Advanced Short-time Thermal Processing for Si-based CMOS Devices 2
Author: Mehmet C. Öztürk
Publisher: The Electrochemical Society
Published: 2004
Total Pages: 444
ISBN-13: 9781566774062
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Author: Mehmet C. Öztürk
Publisher: The Electrochemical Society
Published: 2004
Total Pages: 444
ISBN-13: 9781566774062
DOWNLOAD EBOOKAuthor: Fred Roozeboom
Publisher: The Electrochemical Society
Published: 2003
Total Pages: 488
ISBN-13: 9781566773966
DOWNLOAD EBOOKAuthor: Fred Roozeboom
Publisher: The Electrochemical Society
Published: 2006
Total Pages: 472
ISBN-13: 1566775027
DOWNLOAD EBOOKThese proceedings describe processing, materials, and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author:
Publisher:
Published: 2005
Total Pages: 658
ISBN-13:
DOWNLOAD EBOOKAuthor: Samares Kar
Publisher: The Electrochemical Society
Published: 2004
Total Pages: 512
ISBN-13: 9781566774055
DOWNLOAD EBOOK"This volume is the proceedings of The Second International Symposium on High Dielectric Constant Materials: Materials Science, Processing, Reliability, and Manufacturing Issues ... and was held during [the] 204th Meeting [of the Electrochemical Society] ..."--P. v.
Author: Dim-Lee Kwong
Publisher: The Electrochemical Society
Published: 2001
Total Pages: 458
ISBN-13: 9781566773157
DOWNLOAD EBOOK"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Author: Yoshio Nishi
Publisher: CRC Press
Published: 2017-12-19
Total Pages: 3276
ISBN-13: 1351829823
DOWNLOAD EBOOKRetaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: Hiu Yung Wong
Publisher:
Published: 2006
Total Pages: 330
ISBN-13:
DOWNLOAD EBOOKAuthor: Samares Kar
Publisher: The Electrochemical Society
Published: 2006
Total Pages: 565
ISBN-13: 1566775035
DOWNLOAD EBOOKThis issue covers, in detail, all aspects of the physics and the technology of high dielectric constant gate stacks, including high mobility substrates, high dielectric constant materials, processing, metals for gate electrodes, interfaces, physical, chemical, and electrical characterization, gate stack reliability, and DRAM and non-volatile memories.
Author: H. Fukuda
Publisher: Elsevier
Published: 2003-04-02
Total Pages: 161
ISBN-13: 0080540260
DOWNLOAD EBOOKThis volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.