Advanced Adhesives in Electronics
Advanced Adhesives in Electronics

Author: M O Alam

Publisher: Elsevier

Published: 2011-05-25

Total Pages: 279

ISBN-13: 0857092898

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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. - Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications - Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems - Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Adhesive Bonding
Adhesive Bonding

Author: Robert D. Adams

Publisher: Elsevier

Published: 2005-03-08

Total Pages: 560

ISBN-13: 1845690753

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This important collection reviews key research on adhesive behaviour and applications in sectors as diverse as construction and automotive engineering. The book is divided into three main parts: fundamentals, mechanical properties and applications. Part one focuses on the basic properties of adhesives, surface assessment and treatment. Part two concentrates on understanding how adhesives perform under stress and the factors affecting fatigue and failure. The final part of the book reviews industry specific applications in areas such as building and construction, transport and electrical engineering.With its distinguished editor and international team of contributors, Adhesive bonding is a standard reference for all those concerned with the industrial application of adhesives. - Essential information for all those concerned with the industrial application of adhesives - This important collection examines adhesives and adhesive bonding for load-bearing applications - Arranged in a user-friendly format with three main sections: fundamentals, generic uses and industry specific applications

Progress in Adhesion and Adhesives, Volume 8
Progress in Adhesion and Adhesives, Volume 8

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2024-10-01

Total Pages: 437

ISBN-13: 1394238207

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Keep up-to-date with the latest on adhesion and adhesives from an expert group of worldwide authors. The book series “Progress in Adhesion and Adhesives” was conceived as an annual publication and the premier volume made its debut in 2015. The series has been well-received as it is unique and provides substantive and curated review chapters on subjects that touch many disciplines. The current book contains nine chapters on topics that include multi-component theories in surface thermodynamics and adhesion science; plasma-deposited polymer layers as adhesion promotors; functional interlayers to control interfacial adhesion in reinforced polymer composites; hydrophobic materials, and coatings from natural sources; mechanics of ice adhesion; epoxy adhesives technology: latest developments and trends; hot-melt adhesives for automobile assembly; lifetime estimation of thermostat adhesives by physical and chemical aging processes; and nondestructive evaluation and condition monitoring of adhesive joints. Audience The volume will appeal to adhesionists, adhesive technologists, polymer scientists, materials scientists, and those involved/interested in adhesive bonding, plasma polymerization, adhesion in polymer composites, durability and testing of adhesive joints, materials from natural sources, and ice adhesion and mitigation.

Materials for Advanced Packaging
Materials for Advanced Packaging

Author: Daniel Lu

Publisher: Springer

Published: 2016-11-18

Total Pages: 974

ISBN-13: 3319450980

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Adhesion in Microelectronics
Adhesion in Microelectronics

Author: K. L. Mittal

Publisher: John Wiley & Sons

Published: 2014-08-25

Total Pages: 293

ISBN-13: 1118831349

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This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Reliability Characterisation of Electrical and Electronic Systems
Reliability Characterisation of Electrical and Electronic Systems

Author:

Publisher: Elsevier

Published: 2014-12-24

Total Pages: 274

ISBN-13: 1782422250

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This book takes a holistic approach to reliability engineering for electrical and electronic systems by looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices. The text describes the reliability behavior of electrical and electronic systems. It takes an empirical scientific approach to reliability engineering to facilitate a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation. After introducing the fundamentals and background to reliability theory, the text moves on to describe the methods of reliability analysis and charactersation across a wide range of applications. Takes a holistic approach to reliability engineering Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation

Organic Light-Emitting Diodes (OLEDs)
Organic Light-Emitting Diodes (OLEDs)

Author: Alastair Buckley

Publisher: Elsevier

Published: 2013-08-31

Total Pages: 683

ISBN-13: 0857098942

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Organic light-emitting diodes (OLEDs) are opening up exciting new applications in the area of lighting and displays. OLEDs are self emissive and by careful materials and device design can generate colours across the visible spectrum. Together with simple monolithic fabrication on a range of different substrates, these diverse material properties give OLEDs key advantages over existing display and lighting technology. This important book summarises key research on materials, engineering and the range of applications of these versatile materials.Part one covers materials for OLEDs. Chapters review conjugated polymers, transparent conducting thin films, iridium complexes and phosphorescent materials. Part two discusses the operation and engineering of OLED devices. Chapters discuss topics such as highly efficient pin-type OLEDs, amorphous organic semiconductors, nanostructuring techniques, light extraction, colour tuning, printing techniques, fluorenone defects and disruptive characteristics as well as durability issues. Part three explores the applications of OLEDs in displays and solid-state lighting. Applications discussed include displays, microdisplays and transparent OLEDs, sensors and large-area OLED lighting panels.Organic light-emitting diodes (OLEDs) is a standard reference for engineers working in lighting, display technology and the consumer electronics sectors, as well as those researching OLEDs. - Summarises key research on the materials, engineering and applications of OLEDs - Reviews conjugated polymers, transparent conducting thin films - Considers nanostructuring OLEDS for increasing levels of efficiency

Polymer Optical Fibres
Polymer Optical Fibres

Author: Christian-Alexander Bunge

Publisher: Woodhead Publishing

Published: 2016-08-25

Total Pages: 438

ISBN-13: 0081000561

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Polymer Optical Fibres: Fibre Types, Materials, Fabrication, Characterization, and Applications explores polymer optical fibers, specifically their materials, fabrication, characterization, measurement techniques, and applications. Optical effects, including light propagation, degrading effects of attenuation, scattering, and dispersion, are explained. Other important parameters like mechanical strength, operating temperatures, and processability are also described. Polymer optical fibers (POF) have a number of advantages over glass fibers, such as low cost, flexibility, low weight, electromagnetic immunity, good bandwidth, simple installation, and mechanical stability. - Provides systematic and comprehensive coverage of materials, fabrication, properties, measurement techniques, and applications of POF - Focuses on industry needs in communication, illumination and sensors, the automotive industry, and medical and biotechnology - Features input from leading experts in POF technology, with experience spanning optoelectronics, polymer, and textiles - Explains optical effects, including light propagation, degrading effects of attenuation, scattering, and dispersion

Nitride Semiconductor Light-Emitting Diodes (LEDs)
Nitride Semiconductor Light-Emitting Diodes (LEDs)

Author: Jian-Jang Huang

Publisher: Woodhead Publishing

Published: 2014-02-14

Total Pages: 673

ISBN-13: 0857099302

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The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations. Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting. Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors. - Reviews fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations - Covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots - Highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infra-red emitters, and automotive lighting