Literature 1976, Part 2

Literature 1976, Part 2

Author: S. Böhme

Publisher: Springer Science & Business Media

Published: 2013-04-18

Total Pages: 869

ISBN-13: 366212307X

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Astronomy and Astrophysics Abstracts, which has appeared in semi-annual volumes since 1969, is de voted to the recording, summarizing and indexing of astronomical publications throughout the world. It is prepared under the auspices of the International Astronomical Union (according to a resolution adopted at the 14th General Assembly in 1970). Astronomy and Astrophysics Abstracts aims to present a comprehensive documentation of literature in all fields of astronomy and astrophysics. Every effort will be made to ensure that the average time interval between the date of receipt of the original literature and publication of the abstracts will not exceed eight months. This time interval is near to that achieved by monthly abstracting journals, com pared to which our system of accumulating abstracts for about six months offers the advantage of greater convenience for the user. Volume 18 contains literature published in 1976 and received before March 1, 1977; some older liter ature which was received late and which is not recorded in earlier volumes is also included.


ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

Author: ASM International

Publisher: ASM International

Published: 2019-12-01

Total Pages: 540

ISBN-13: 1627082735

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The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.