2010 11th International Conference on Electronic Packaging Technology and High Density Packaging
Author: IEEE Staff
Publisher:
Published: 2010
Total Pages:
ISBN-13: 9781424481408
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Author: IEEE Staff
Publisher:
Published: 2010
Total Pages:
ISBN-13: 9781424481408
DOWNLOAD EBOOKAuthor: Keyun Bi
Publisher:
Published: 2010
Total Pages: 723
ISBN-13:
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Publisher:
Published: 2010
Total Pages:
ISBN-13:
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Publisher:
Published: 2011
Total Pages:
ISBN-13: 9781457717703
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Publisher:
Published: 2011
Total Pages: 0
ISBN-13:
DOWNLOAD EBOOKAuthor: Xingsheng Liu
Publisher: Springer
Published: 2014-07-14
Total Pages: 415
ISBN-13: 1461492637
DOWNLOAD EBOOKThis book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Author: Keyun Bi
Publisher:
Published: 2011
Total Pages:
ISBN-13:
DOWNLOAD EBOOKAuthor: IEEE Staff
Publisher:
Published: 2009
Total Pages:
ISBN-13: 9781424446582
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Publisher:
Published: 2009
Total Pages:
ISBN-13:
DOWNLOAD EBOOKAuthor: IEEE Staff
Publisher:
Published: 2011-08-12
Total Pages:
ISBN-13: 9781457717703
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