Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Intelligent/smart systems have become common practice in many engineering applications. On the other hand, current low cost standard CMOS technology (and future foreseeable developments) makes available enormous potentialities. The next breakthrough will be the design and development of "smart adaptive systems on silicon" i.e. very power and highly size efficient complete systems (i.e. sensing, computing and "actuating" actions) with intelligence on board on a single silicon die. Smart adaptive systems on silicon will be able to "adapt" autonomously to the changing environment and will be able to implement "intelligent" behaviour and both perceptual and cognitive tasks. At last, they will communicate through wireless channels, they will be battery supplied or remote powered (via inductive coupling) and they will be ubiquitous in our every day life. Although many books deal with research and engineering topics (i.e. algorithms, technology, implementations, etc.) few of them try to bridge the gap between them and to address the issues related to feasibility, reliability and applications. Smart Adaptive Systems on Silicon, though not exhaustive, tries to fill this gap and to give answers mainly to the feasibility and reliability issues. Smart Adaptive Systems on Silicon mainly focuses on the analog and mixed mode implementation on silicon because this approach is amenable of achieving impressive energy and size efficiency. Moreover, analog systems can be more easily interfaced with sensing and actuating devices.
Semiconductor Memories and Systems provides a comprehensive overview of the current state of semiconductor memory at the technology and system levels. After an introduction on market trends and memory applications, the book focuses on mainstream technologies, illustrating their current status, challenges and opportunities, with special attention paid to scalability paths. Technologies discussed include static random access memory (SRAM), dynamic random access memory (DRAM), non-volatile memory (NVM), and NAND flash memory. Embedded memory and requirements and system level needs for storage class memory are also addressed. Each chapter covers physical operating mechanisms, fabrication technologies, and the main challenges to scalability.Finally, the work reviews the emerging trends for storage class memory, mainly focusing on the advantages and opportunities of phase change based memory technologies. - Features contributions from experts from leading companies in semiconductor memory - Discusses physical operating mechanisms, fabrication technologies and paths to scalability for current and emerging semiconductor memories - Reviews primary memory technologies, including SRAM, DRAM, NVM and NAND flash memory - Includes emerging storage class memory technologies such as phase change memory
The book describes the significant multidisciplinary research findings at the Università Politecnica delle Marche and the expected future advances. It addresses some of the most dramatic challenges posed by today’s fast-growing, global society and the changes it has caused. It also discusses solutions to improve the wellbeing of human beings. The book covers the main research achievements in the different disciplines of the physical sciences and engineering, as well as several research lines developed at the university’s Faculty of Engineering in the fields of electronic and information engineering, telecommunications, biomedical engineering, mechanical engineering, manufacturing technologies, energy, advanced materials, chemistry, physics of matter, mathematical sciences, geotechnical engineering, circular economy, urban planning, construction engineering, infrastructures and environment protection, technologies and digitization of the built environment and cultural heritage. It highlights the international relevance and multidisciplinarity of research at the university as well as the planned research lines for the next years.
Digital photography, MP3, digital video, etc. make extensive use of NAND-based Flash cards as storage media. To realize how much NAND Flash memories pervade every aspect of our life, just imagine how our recent habits would change if the NAND memories suddenly disappeared. To take a picture it would be necessary to find a film (as well as a traditional camera...), disks or even magnetic tapes would be used to record a video or to listen a song, and a cellular phone would return to be a simple mean of communication rather than a multimedia console. The development of NAND Flash memories will not be set down on the mere evolution of personal entertainment systems since a new killer application can trigger a further success: the replacement of Hard Disk Drives (HDDs) with Solid State Drives (SSDs). SSD is made up by a microcontroller and several NANDs. As NAND is the technology driver for IC circuits, Flash designers and technologists have to deal with a lot of challenges. Therefore, SSD (system) developers must understand Flash technology in order to exploit its benefits and countermeasure its weaknesses. Inside NAND Flash Memories is a comprehensive guide of the NAND world: from circuits design (analog and digital) to Flash reliability (including radiation effects), from testing issues to high-performance (DDR) interface, from error correction codes to NAND applications like Flash cards and SSDs.
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
This work covers the design of CMOS fully integrated low power low phase noise voltage controlled oscillators for telecommunication or datacommuni- tion systems. The need for low power is obvious, as mobile wireless telecommunications are battery operated. As wireless telecommunication systems use oscillators in frequency synthesizers for frequency translation, the selectivity and signal to noise ratio of receivers and transmitters depend heavily on the low phase noise performance of the implemented oscillators. Datacommunication s- tems need low jitter, the time-domain equivalent of low phase noise, clocks for data detection and recovery. The power consumption is less critical. The need for multi-band and multi-mode systems pushes the high-integration of telecommunication systems. This is o?ered by sub-micron CMOS feat- ing digital ?exibility. The recent crisis in telecommunication clearly shows that mobile hand-sets became mass-market high-volume consumer products, where low-cost is of prime importance. This need for low-cost products - livens tremendously research towards CMOS alternatives for the bipolar or BiCMOS solutions in use today.
Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.
Advanced concepts for wireless technologies present a vision of technology that is embedded in our surroundings and practically invisible. From established radio techniques like GSM, 802.11 or Bluetooth to more emerging technologies, such as Ultra Wide Band and smart dust motes, a common denominator for future progress is the underlying integrated circuit technology. Wireless Technologies responds to the explosive growth of standard cellular radios and radically different wireless applications by presenting new architectural and circuit solutions engineers can use to solve modern design problems. This reference addresses state-of-the art CMOS design in the context of emerging wireless applications, including 3G/4G cellular telephony, wireless sensor networks, and wireless medical application. Written by top international experts specializing in both the IC industry and academia, this carefully edited work uncovers new design opportunities in body area networks, medical implants, satellite communications, automobile radar detection, and wearable electronics. The book is divided into three sections: wireless system perspectives, chip architecture and implementation issues, and devices and technologies used to fabricate wireless integrated circuits. Contributors address key issues in the development of future silicon-based systems, such as scale of integration, ultra-low power dissipation, and the integration of heterogeneous circuit design style and processes onto one substrate. Wireless sensor network systems are now being applied in critical applications in commerce, healthcare, and security. This reference, which contains 25 practical and scientifically rigorous articles, provides the knowledge communications engineers need to design innovative methodologies at the circuit and system level.