Advanced lithography grows up to several fields such as nano-lithography, micro electro-mechanical system (MEMS) and nano-phonics, etc. Nano-lithography reaches to 20 nm size in advanced electron device. Consequently, we have to study and develop true single nanometer size lithography. One of the solutions is to study a fusion of top down and bottom up technologies such as EB drawing and self-assembly with block copolymer. In MEMS and nano-photonics, 3 dimensional structures are needed to achieve some functions in the devices for the applications. Their formation are done by several methods such as colloid lithography, stereo-lithography, dry etching, sputtering, deposition, etc. This book covers a wide area regarding nano-lithography, nano structure and 3-dimensional structure, and introduces readers to the methods, methodology and its applications.
This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.
Editorial Review Dr. Bakshi has compiled a thorough, clear reference text covering the important fields of EUV lithography for high-volume manufacturing. This book has resulted from his many years of experience in EUVL development and from teaching this subject to future specialists. The book proceeds from an historical perspective of EUV lithography, through source technology, optics, projection system design, mask, resist, and patterning performance, to cost of ownership. Each section contains worked examples, a comprehensive review of challenges, and relevant citations for those who wish to further investigate the subject matter. Dr. Bakshi succeeds in presenting sometimes unfamiliar material in a very clear manner. This book is also valuable as a teaching tool. It has become an instant classic and far surpasses others in the EUVL field. --Dr. Akira Endo, Chief Development Manager, Gigaphoton Inc. Description Extreme ultraviolet lithography (EUVL) is the principal lithography technology aiming to manufacture computer chips beyond the current 193-nm-based optical lithography, and recent progress has been made on several fronts: EUV light sources, optics, optics metrology, contamination control, masks and mask handling, and resists. This comprehensive volume is comprised of contributions from the world's leading EUVL researchers and provides all of the critical information needed by practitioners and those wanting an introduction to the field. Interest in EUVL technology continues to increase, and this volume provides the foundation required for understanding and applying this exciting technology. About the editor of EUV Lithography Dr. Vivek Bakshi previously served as a senior member of the technical staff at SEMATECH; he is now president of EUV Litho, Inc., in Austin, Texas.
This book presents state-of-the-art information regarding the extensive field of advanced lithography. Advanced lithography expands into numerous sub-fields like micro electro-mechanical system (MEMS), nano-lithography, nano-physics, etc. In optimized electron device, nano-lithography reaches up to 20 nm in size. Subsequently, we have to analyze and develop true single nanometer size lithography. One of the solutions is to analyze a fusion of bottom up and top down technologies like EB drawing and self-assembly with block copolymer. In nano-photonics and MEMS, 3D structures are required for carrying out specific functions in the devices for applications. They are formed as a result of execution of numerous techniques like stereo-lithography, sputtering, colloid lithography, deposition, dry etching, etc. This book provides the readers with valuable information about nano structure, 3D structure, nano-lithography, and elucidates the methodology, techniques and applications of nano-lithography.
This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning.
Lithography is a field in which advances proceed at a swift pace. This book was written to address several needs, and the revisions for the second edition were made with those original objectives in mind. Many new topics have been included in this text commensurate with the progress that has taken place during the past few years, and several subjects are discussed in more detail. This book is intended to serve as an introduction to the science of microlithography for people who are unfamiliar with the subject. Topics directly related to the tools used to manufacture integrated circuits are addressed in depth, including such topics as overlay, the stages of exposure, tools, and light sources. This text also contains numerous references for students who want to investigate particular topics in more detail, and they provide the experienced lithographer with lists of references by topic as well. It is expected that the reader of this book will have a foundation in basic physics and chemistry. No topics will require knowledge of mathematics beyond elementary calculus.
Three-Dimensional Microfabrication Using Two-Photon Polymerization (TPP) is the first comprehensive guide to TPP microfabrication—essential reading for researchers and engineers in areas where miniaturization of complex structures is key, such as in the optics, microelectronics, and medical device industries. TPP stands out among microfabrication techniques because of its versatility, low costs, and straightforward chemistry. TPP microfabrication attracts increasing attention among researchers and is increasingly employed in a range of industries where miniaturization of complex structures is crucial: metamaterials, plasmonics, tissue engineering, and microfluidics, for example. Despite its increasing importance and potential for many more applications, no single book to date is dedicated to the subject. This comprehensive guide, edited by Professor Baldacchini and written by internationally renowned experts, fills this gap and includes a unified description of TPP microfabrication across disciplines. The guide covers all aspects of TPP, including the pros and cons of TPP microfabrication compared to other techniques, as well as practical information on material selection, equipment, processes, and characterization. Current and future applications are covered and case studies provided as well as challenges for adoption of TPP microfabrication techniques in other areas are outlined. The freeform capability of TPP is illustrated with numerous scanning electron microscopy images. Comprehensive account of TPP microfabrication, including both photophysical and photochemical aspects of the fabrication process Comparison of TPP microfabrication with conventional and unconventional micromanufacturing techniques Covering applications of TPP microfabrication in industries such as microelectronics, optics and medical devices industries, and includes case studies and potential future directions Illustrates the freeform capability of TPP using numerous scanning electron microscopy images
This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.
