Ultraclean Surface Processing of Silicon Wafers
Ultraclean Surface Processing of Silicon Wafers

Author: Takeshi Hattori

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 634

ISBN-13: 3662035359

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A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

Handbook of Semiconductor Manufacturing Technology
Handbook of Semiconductor Manufacturing Technology

Author: Yoshio Nishi

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 1720

ISBN-13: 1420017667

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Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Ultra Clean Processing of Semiconductor Surfaces XVI
Ultra Clean Processing of Semiconductor Surfaces XVI

Author: Paul Mertens

Publisher: Trans Tech Publications Ltd

Published: 2023-08-14

Total Pages: 363

ISBN-13: 303641312X

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Selected peer-reviewed full text papers from the 16th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS 2023) Selected peer-reviewed full text papers from the 16th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS 2023), September 12-14, 2023, Brugge, Belgium

Advances in CMP Polishing Technologies
Advances in CMP Polishing Technologies

Author: Toshiro Doi

Publisher: William Andrew

Published: 2011-12-06

Total Pages: 330

ISBN-13: 1437778593

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CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Developments in Surface Contamination and Cleaning
Developments in Surface Contamination and Cleaning

Author: Rajiv Kohli

Publisher: Elsevier

Published: 2008-01-10

Total Pages: 1209

ISBN-13: 0815516851

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Surface contamination is of cardinal importance in a host of technologies and industries, ranging from microelectronics to optics to automotive to biomedical. Thus, the need to understand the causes of surface contamination and their removal is very patent. Generally speaking, there are two broad categories of surface contaminants: film-type and particulates. In the world of shrinking dimensions, such as the ever-decreasing size of microelectronic devices, there is an intensified need to understand the behavior of nanoscale particles and to devise ways to remove them to an acceptable level. Particles which were functionally innocuous a few years ago are ôkiller defectsö today, with serious implications for yield and reliability of the components. This book addresses the sources, detection, characterization and removal of both kinds of contaminants, as well as ways to prevent surfaces from being contaminated. A number of techniques to monitor the level of cleanliness are also discussed. Special emphasis is placed on the behaviour of nanoscale particles. The book is amply referenced and profusely illustrated.• Excellent reference for a host of technologies and industries ranging from microelectronics to optics to automotive to biomedical.• A single source document addressing everything from the sources of contamination to their removal and prevention.• Amply referenced and profusely illustrated.

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning
Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning

Author: Rajiv Kohli

Publisher: William Andrew

Published: 2016-11-04

Total Pages: 214

ISBN-13: 0323431720

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Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9, part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their associated cleaning methods. This newest volume in the series discusses methods of surface cleaning of contaminants and the resources that are needed to deal with them. Taken as a whole, the series forms a unique reference for professionals and academics working in the area of surface contamination and cleaning. A strong theme running through the series is that of surface contamination and cleaning at the micro and nano scales. - Provides a comprehensive coverage of innovations in surface cleaning - Written by established experts in the surface cleaning field, presenting an authoritative resource - Contains a comprehensive review of the state-of-the-art, including case studies to enhance the learning process

Analytical and Diagnostic Techniques for Semiconductor Materials, Devices, and Processes
Analytical and Diagnostic Techniques for Semiconductor Materials, Devices, and Processes

Author: Bernd O. Kolbesen

Publisher: The Electrochemical Society

Published: 2003

Total Pages: 572

ISBN-13: 9781566773485

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.".. ALTECH 2003 was Symposium J1 held at the 203rd Meeting of the Electrochemical Society in Paris, France from April 27 to May 2, 2003 ... Symposium M1, Diagnostic Techniques for Semiconductor Materials and Devices, was part of the 202nd Meeting of the Electrochemical Society held in Salt Lake City, Utah, from October 21 to 25, 2002 ..."--p. iii.

Silicon Wafer Bonding Technology
Silicon Wafer Bonding Technology

Author: Subramanian S. Iyer

Publisher: Univ. Press of Mississippi

Published: 2002

Total Pages: 180

ISBN-13: 9780852960394

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This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in detail, and subsequent chapters cover bonding by mechanical removal, the Smart Cut method of hydrogen exfoliation, the ELTRAN thinning technique and hydrogen annealing, engineering methods of wafer characterization, and quality assurance for bonded wafers. A chapter on advanced applications looks at applications in optoelectronics, very large scale integration (VLSI), microelectromechanical systems (MEMS), and photonics. A glossary is included, plus a table comparing various bonding methods. The editors work in the private sector. Annotation copyrighted by Book News, Inc., Portland, OR

Ultra Clean Processing of Silicon Surfaces VI
Ultra Clean Processing of Silicon Surfaces VI

Author: Marc Heyns

Publisher: Trans Tech Publications Ltd

Published: 2003-05-02

Total Pages: 321

ISBN-13: 3035707200

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Proceedings of the 6h International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2002), Held in Ostens, Belgium, September 2002