Electronic Thin-Film Reliability
Electronic Thin-Film Reliability

Author: King-Ning Tu

Publisher: Cambridge University Press

Published: 2010-11-25

Total Pages: 413

ISBN-13: 1139492705

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Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

The Materials Science of Thin Films
The Materials Science of Thin Films

Author: Milton Ohring

Publisher: Academic Press

Published: 1992

Total Pages: 744

ISBN-13: 9780125249904

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Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.

The Mechanics and Reliability of Films, Multilayers and Coatings
The Mechanics and Reliability of Films, Multilayers and Coatings

Author: Matthew R. Begley

Publisher: Cambridge University Press

Published: 2017-03-24

Total Pages: 289

ISBN-13: 1108132731

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A wide variety of applications ranging from microelectronics to turbines for propulsion and power generation rely on films, coatings, and multilayers to improve performance. As such, the ability to predict coating failure - such as delamination (debonding), mud-cracking, blistering, crack kinking, and the like - is critical to component design and development. This work compiles and organizes decades of research that established the theoretical foundation for predicting such failure mechanisms, and clearly outlines the methodology needed to predict performance. Detailed coverage of cracking in multilayers is provided, with an emphasis on the role of differences in thermoelastic properties between the layers. The comprehensive theoretical foundation of the book is complemented by easy-to-use analysis codes designed to empower novices with the tools needed to simulate cracking; these codes enable not only precise quantitative reproduction of results presented graphically in the literature, but also the generation of new results for more complex multilayered systems.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author: Ephraim Suhir

Publisher: Springer Science & Business Media

Published: 2007-05-26

Total Pages: 1471

ISBN-13: 0387329897

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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Reliability of MEMS
Reliability of MEMS

Author: Osamu Tabata

Publisher: John Wiley & Sons

Published: 2008-02-04

Total Pages: 328

ISBN-13: 9783527314942

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This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.