Thermal Management Handbook: For Electronic Assemblies
Thermal Management Handbook: For Electronic Assemblies

Author: Jerry E. Sergent

Publisher: McGraw Hill Professional

Published: 1998

Total Pages: 386

ISBN-13:

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Board-Level Thermal Management Systems with Application in Electronics and Power Electronics
Board-Level Thermal Management Systems with Application in Electronics and Power Electronics

Author: Aliakbar Soleymani Koohbanani

Publisher:

Published: 2016

Total Pages: 80

ISBN-13:

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In this study, heat removal and thermal management solutions for electronic devices were investigated at board-level. The generated heat at an electronic chip, installed on a printed circuit board (PCB), can be dissipated either through a heat sink, that is attached directly to the chip, or can be transferred through the PCB to the other side and then be dissipated to the ambient. In any case, thermal interface materials (TIMs) should be used to reduce the thermal contact resistance (TCR) at the solid-solid interface, and also to electrically insulate the live electrical component from the heat sink which is normally exposed to the ambient. Graphite, due to its low cost, lightweight, low thermal expansion coefficient, high temperature tolerance, and high corrosion resistance properties is shown to be a promising candidate to be used as a TIM. In this study, a new analytical model was developed to predict the thermal conductivity of graphite-based TIMs as a function of pressure applied during the production, and flake mechanical properties. The model was verified with the experimental results obtained from testing multiple graphite-based TIM samples. Transferring the heat to the back of the PCB could potentially provide more surface area for the heat transfer, as normally the backside of PCBs is less populated compared to the front side. However, this comes with its own challenges, due to the low thermal conductivity of the FR4, the main material used in the PCB composition. Thermal vias, which are copper-plated through holes, are proposed as a solution, since they can provide a thermal bridge for heat. A new analytical model was developed for predicting the enhanced thermal conductivity of PCBs equipped with thermal vias. The results were validated by the experimental data obtained from testing nine PCB samples. Effects of vias diameter and their arrangement on the thermal performance were investigated. The results indicated that by using staggered arrangement of thermal vias with larger diameters, the effective thermal conductivity of the PCB can be improved.

Thermal Management of Microelectronic Equipment
Thermal Management of Microelectronic Equipment

Author: Lian-Tuu Yeh

Publisher: American Society of Mechanical Engineers

Published: 2002

Total Pages: 454

ISBN-13:

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With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

Qpedia Thermal Management – Electronics Cooling Book, Volume 2
Qpedia Thermal Management – Electronics Cooling Book, Volume 2

Author: Advanced Thermal Solutions

Publisher: Advanced Thermal Solutions

Published: 2008

Total Pages: 206

ISBN-13: 0984627901

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The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.

Thermal Copper Pillar Bump
Thermal Copper Pillar Bump

Author: Fouad Sabry

Publisher: One Billion Knowledgeable

Published: 2022-08-31

Total Pages: 523

ISBN-13:

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What Is Thermal Copper Pillar Bump The thermal copper pillar bump is a thermoelectric device that is made from thin-film thermoelectric material and is embedded in flip chip interconnects. It is used in the packaging of electronic and optoelectronic components, such as integrated circuits (chips), laser diodes, and semiconductor optical amplifiers. The thermal bump is also known as the thermal copper pillar bump (SOA). Thermal bumps, as opposed to traditional solder bumps, which provide an electrical path and a mechanical connection to the package, act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. Conventional solder bumps also provide a mechanical connection to the package. A thermal bump has a diameter of 238 micrometers and a height of 60 micrometers. How You Will Benefit (I) Insights, and validations about the following topics: Chapter 1: Thermal copper pillar bump Chapter 2: Solder Chapter 3: Printed circuit board Chapter 4: Ball grid array Chapter 5: Thermoelectric cooling Chapter 6: Flip chip Chapter 7: Thermoelectric materials Chapter 8: Desoldering Chapter 9: Thermal management (electronics) Chapter 10: Power electronic substrate Chapter 11: Flat no-leads package Chapter 12: Thermoelectric generator Chapter 13: Thermal management of high-power LEDs Chapter 14: Microvia Chapter 15: Thick-film technology Chapter 16: Soldering Chapter 17: Failure of electronic components Chapter 18: Glass frit bonding Chapter 19: Decapping Chapter 20: Thermal inductance Chapter 21: Glossary of microelectronics manufacturing terms (II) Answering the public top questions about thermal copper pillar bump. (III) Real world examples for the usage of thermal copper pillar bump in many fields. (IV) 17 appendices to explain, briefly, 266 emerging technologies in each industry to have 360-degree full understanding of thermal copper pillar bump' technologies. Who This Book Is For Professionals, undergraduate and graduate students, enthusiasts, hobbyists, and those who want to go beyond basic knowledge or information for any kind of thermal copper pillar bump.

Thermal Management of Electronic Systems
Thermal Management of Electronic Systems

Author: C.J. Hoogendoorn

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 334

ISBN-13: 9401110824

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The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.

Advanced Computational Methods in Mechanical and Materials Engineering
Advanced Computational Methods in Mechanical and Materials Engineering

Author: Ashwani Kumar

Publisher: CRC Press

Published: 2021-11-23

Total Pages: 343

ISBN-13: 1000483029

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This book provides in-depth knowledge to solve engineering, geometrical, mathematical, and scientific problems with the help of advanced computational methods with a focus on mechanical and materials engineering. Divided into three subsections covering design and fluids, thermal engineering and materials engineering, each chapter includes exhaustive literature review along with thorough analysis and future research scope. Major topics covered pertains to computational fluid dynamics, mechanical performance, design, and fabrication including wide range of applications in industries as automotive, aviation, electronics, nuclear and so forth. Covers computational methods in design and fluid dynamics with a focus on computational fluid dynamics Explains advanced material applications and manufacturing in labs using novel alloys and introduces properties in material Discusses fabrication of graphene reinforced magnesium metal matrix for orthopedic applications Illustrates simulation and optimization gear transmission, heat sink and heat exchangers application Provides unique problem-solution approach including solutions, methodology, experimental setup, and results validation This book is aimed at researchers, graduate students in mechanical engineering, computer fluid dynamics,fluid mechanics, computer modeling, machine parts, and mechatronics.