The Printed Circuit Designer's Guide To... Thermal Management with Insulated Metal Substrates, Vol. 2
The Printed Circuit Designer's Guide To... Thermal Management with Insulated Metal Substrates, Vol. 2

Author: Ventec International Group

Publisher:

Published: 2022-07-25

Total Pages: 0

ISBN-13:

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This book is meant to be a companion to The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, which describes material selection for cost-effective solutions and reliable designs. This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. These include not only the heat dissipation and the drive to increase thermal conductivity (W/mK), but the total thermal balance as well.Among the most pertinent questions is how to improve reliability of components as they become smaller and smaller, while being more efficient.Readers will also learn the value of understanding the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material, and the effects of measurement errors and tolerance in dielectric thickness can also vary.

The Printed Circuit Designer's Guide To... Thermal Management
The Printed Circuit Designer's Guide To... Thermal Management

Author: American Standard Circuits

Publisher:

Published: 2020-10-06

Total Pages:

ISBN-13: 9781734200560

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Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.Written by Anaya Vardya, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.PCB designers and design engineers, both new and veteran, will learn how to "beat the heat" by gaining a thorough understanding of thermal management design processes.

Thermal Management Handbook: For Electronic Assemblies
Thermal Management Handbook: For Electronic Assemblies

Author: Jerry E. Sergent

Publisher: McGraw Hill Professional

Published: 1998

Total Pages: 386

ISBN-13:

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Engineering Materials 2
Engineering Materials 2

Author: Michael F. Ashby

Publisher: Elsevier

Published: 2014-06-28

Total Pages: 380

ISBN-13: 1483297217

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Provides a thorough explanation of the basic properties of materials; of how these can be controlled by processing; of how materials are formed, joined and finished; and of the chain of reasoning that leads to a successful choice of material for a particular application. The materials covered are grouped into four classes: metals, ceramics, polymers and composites. Each class is studied in turn, identifying the families of materials in the class, the microstructural features, the processes or treatments used to obtain a particular structure and their design applications. The text is supplemented by practical case studies and example problems with answers, and a valuable programmed learning course on phase diagrams.

Thermal Management of Electronic Systems II
Thermal Management of Electronic Systems II

Author: E. Beyne

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 358

ISBN-13: 9401155062

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For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.

Microwave Circuit Design Using Linear and Nonlinear Techniques
Microwave Circuit Design Using Linear and Nonlinear Techniques

Author: George D. Vendelin

Publisher: John Wiley & Sons

Published: 2005-10-03

Total Pages: 1080

ISBN-13: 0471715824

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The ultimate handbook on microwave circuit design with CAD. Full of tips and insights from seasoned industry veterans, Microwave Circuit Design offers practical, proven advice on improving the design quality of microwave passive and active circuits-while cutting costs and time. Covering all levels of microwave circuit design from the elementary to the very advanced, the book systematically presents computer-aided methods for linear and nonlinear designs used in the design and manufacture of microwave amplifiers, oscillators, and mixers. Using the newest CAD tools, the book shows how to design transistor and diode circuits, and also details CAD's usefulness in microwave integrated circuit (MIC) and monolithic microwave integrated circuit (MMIC) technology. Applications of nonlinear SPICE programs, now available for microwave CAD, are described. State-of-the-art coverage includes microwave transistors (HEMTs, MODFETs, MESFETs, HBTs, and more), high-power amplifier design, oscillator design including feedback topologies, phase noise and examples, and more. The techniques presented are illustrated with several MMIC designs, including a wideband amplifier, a low-noise amplifier, and an MMIC mixer. This unique, one-stop handbook also features a major case study of an actual anticollision radar transceiver, which is compared in detail against CAD predictions; examples of actual circuit designs with photographs of completed circuits; and tables of design formulae.

Semiconductor Packaging
Semiconductor Packaging

Author: Andrea Chen

Publisher: CRC Press

Published: 2016-04-19

Total Pages: 216

ISBN-13: 1439862079

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Metal Matrix Composites in Industry
Metal Matrix Composites in Industry

Author: Alexander Evans

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 430

ISBN-13: 1461504058

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Metal matrix composites are making tangible inroads into the "real" world of engineering. They are used in engineering components such as brake rotors, aircraft parts, combustion engines, and heat sinks for electronic systems. Yet, outside a relatively limited circle of specialists, these materials are mostly unknown. Designers do not as a rule think of using these materials, in part because access to information is difficult as these materials have not really entered engineering handbooks. Metal Matrix Composites in Industry is thus useful to engineers who wish to gain introductory knowledge of these materials and who want to know where "to find" them. Additionally, it provides researchers and academics with a survey of current industrial activity in this area of technology.