The Printed Circuit Designer's Guide To... Thermal Management with Insulated Metal Substrates, Vol. 2
The Printed Circuit Designer's Guide To... Thermal Management with Insulated Metal Substrates, Vol. 2

Author: Ventec International Group

Publisher:

Published: 2022-07-25

Total Pages: 0

ISBN-13:

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This book is meant to be a companion to The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, which describes material selection for cost-effective solutions and reliable designs. This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. These include not only the heat dissipation and the drive to increase thermal conductivity (W/mK), but the total thermal balance as well.Among the most pertinent questions is how to improve reliability of components as they become smaller and smaller, while being more efficient.Readers will also learn the value of understanding the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material, and the effects of measurement errors and tolerance in dielectric thickness can also vary.

The Printed Circuit Designer's Guide To... Thermal Management
The Printed Circuit Designer's Guide To... Thermal Management

Author: American Standard Circuits

Publisher:

Published: 2020-10-06

Total Pages:

ISBN-13: 9781734200560

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Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.Written by Anaya Vardya, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.PCB designers and design engineers, both new and veteran, will learn how to "beat the heat" by gaining a thorough understanding of thermal management design processes.

Thermal Management Handbook: For Electronic Assemblies
Thermal Management Handbook: For Electronic Assemblies

Author: Jerry E. Sergent

Publisher: McGraw Hill Professional

Published: 1998

Total Pages: 386

ISBN-13:

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Printed Circuit Assembly Design
Printed Circuit Assembly Design

Author: Leonard Marks

Publisher: McGraw Hill Professional

Published: 2000-08-17

Total Pages: 433

ISBN-13: 0071500146

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Nuts-and-bolts guide to designing printed circuit assemblies Want to build circuit boards for today's smaller, faster electronics applications? This how-to tutorial puts a PCA design roadmap at your fingertips--valuable whether you're neophyte just starting out or an experienced designer, engineer or a manager associated with the electronics industry, as printed circuit assemblies are key building blocks in almost every commodity made today with any electronics content. In this unique one-stop design guide you'll find complete coverage of electrical and mechanical design considerations as you explore: design process flow; the latest design methods and tools; circuit board layout; documentation; more.

Thermal Management for Opto-electronics Packaging and Applications
Thermal Management for Opto-electronics Packaging and Applications

Author: Xiaobing Luo

Publisher: John Wiley & Sons

Published: 2024-08-12

Total Pages: 373

ISBN-13: 1119179270

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Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Thermal Management of Microelectronic Equipment
Thermal Management of Microelectronic Equipment

Author: Lian-Tuu Yeh

Publisher: American Society of Mechanical Engineers

Published: 2002

Total Pages: 454

ISBN-13:

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With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

Printed Circuit Boards
Printed Circuit Boards

Author: R. S. Khandpur

Publisher: McGraw Hill Professional

Published: 2005-09-07

Total Pages: 717

ISBN-13: 0071589252

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The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.