The Printed Circuit Designer's Guide To... Thermal Management
The Printed Circuit Designer's Guide To... Thermal Management

Author: American Standard Circuits

Publisher:

Published: 2020-10-06

Total Pages:

ISBN-13: 9781734200560

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Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.Written by Anaya Vardya, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.PCB designers and design engineers, both new and veteran, will learn how to "beat the heat" by gaining a thorough understanding of thermal management design processes.

The Printed Circuit Designer's Guide To... Thermal Management with Insulated Metal Substrates, Vol. 2
The Printed Circuit Designer's Guide To... Thermal Management with Insulated Metal Substrates, Vol. 2

Author: Ventec International Group

Publisher:

Published: 2022-07-25

Total Pages: 0

ISBN-13:

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This book is meant to be a companion to The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, which describes material selection for cost-effective solutions and reliable designs. This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. These include not only the heat dissipation and the drive to increase thermal conductivity (W/mK), but the total thermal balance as well.Among the most pertinent questions is how to improve reliability of components as they become smaller and smaller, while being more efficient.Readers will also learn the value of understanding the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material, and the effects of measurement errors and tolerance in dielectric thickness can also vary.

Thermal Management Handbook: For Electronic Assemblies
Thermal Management Handbook: For Electronic Assemblies

Author: Jerry E. Sergent

Publisher: McGraw Hill Professional

Published: 1998

Total Pages: 370

ISBN-13: 9780070266995

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

PCB Design Guide to Via and Trace Currents and Temperatures
PCB Design Guide to Via and Trace Currents and Temperatures

Author: Douglas Brooks

Publisher: Artech House

Published: 2021-02-28

Total Pages: 246

ISBN-13: 1630818615

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A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.

The Circuit Designer's Companion
The Circuit Designer's Companion

Author: Tim Williams

Publisher:

Published: 1993-01-01

Total Pages: 302

ISBN-13: 9780750617567

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This is a compendium of practical wisdom concerning real world aspects of electronic circuit design gathered during years of experience in industry. The Companion enables circuit designers to produce more effective working circuits. Valued by linear and digital designers alike, this guide explains and outlines solutions that take into account the imperfect behaviour of real components, interconnections and circuits. Electronic circuit design can be divided into two areas: the first consists in designing a circuit that will fulfil its specified function; the second consists in designing the same circuit so that every production model of it will fulfil its specified function reliably over its lifetime. Designers who can appreciate the techniques and tools used in the latter area are becoming increasingly rare. The aim of this guide is to help such people. The subjects covered include grounding, printed circuit design and layout, the characteristics of practical active and passive components, cables, linear ICs, logic circuits and their interfaces, power supplies, electromagnetic compatibility, safety and thermal management. Throughout, the implications of manufacturability and cost are stressed. The style is direct and lucid, providing straightforward practical advice. This is the ideal guide to real world design for both students and practitioners.

The Printed Circuit Designer's Guide To... DFM
The Printed Circuit Designer's Guide To... DFM

Author: David Marrakchi

Publisher:

Published: 2017-02-28

Total Pages:

ISBN-13: 9780979618932

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This book provides an in-depth look at DFM: what DFM entails, why it's so critical today, and how to implement the DFM techniques necessary to produce a manufacturable and functional board. With something to offer for both the seasoned designer and the newbie, after reading this book, PCB designers will have all the DFM knowledge they need to eliminate costly design re-spins and get a good board back, every time.

Reliability Engineering
Reliability Engineering

Author: Alessandro Birolini

Publisher: Springer Science & Business Media

Published: 2003-08-20

Total Pages: 564

ISBN-13: 9783540402879

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Using clear language, this book shows you how to build in, evaluate, and demonstrate reliability and availability of components, equipment, and systems. It presents the state of the art in theory and practice, and is based on the author's 30 years' experience, half in industry and half as professor of reliability engineering at the ETH, Zurich. In this extended edition, new models and considerations have been added for reliability data analysis and fault tolerant reconfigurable repairable systems including reward and frequency / duration aspects. New design rules for imperfect switching, incomplete coverage, items with more than 2 states, and phased-mission systems, as well as a Monte Carlo approach useful for rare events are given. Trends in quality management are outlined. Methods and tools are given in such a way that they can be tailored to cover different reliability requirement levels and be used to investigate safety as well. The book contains a large number of tables, figures, and examples to support the practical aspects.