The Ion-assisted Etching and Profile Development of Silicon in Molecular and Atomic Chlorine
Author: Joshua Aaron Levinson
Publisher:
Published: 1999
Total Pages: 318
ISBN-13:
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Author: Joshua Aaron Levinson
Publisher:
Published: 1999
Total Pages: 318
ISBN-13:
DOWNLOAD EBOOKAuthor: Cyril Bernard Lucas
Publisher: CRC Press
Published: 2013-12-13
Total Pages: 396
ISBN-13: 1466561033
DOWNLOAD EBOOKAtomic and molecular beams are employed in physics and chemistry experiments and, to a lesser extent, in the biological sciences. These beams enable atoms to be studied under collision-free conditions and allow the study of their interaction with other atoms, charged particles, radiation, and surfaces. Atomic and Molecular Beams: Production and Collimation explores the latest techniques for producing a beam from any substance as well as from the dissociation of hydrogen, oxygen, nitrogen, and the halogens. The book not only provides the basic expressions essential to beam design but also offers in-depth coverage of: Design of ovens and furnaces for atomic beam production Creation of atomic beams that require higher evaporation temperatures Theory of beam formation including the Clausing equation and the transmission probability Construction of collimating arrays in metals, plastics, glass, and other materials Optimization of the design of atomic beam collimators While many review articles and books discuss the application of atomic beams, few give technical details of their production. Focusing on practical application in the laboratory, the author critically reviews over 800 references to compare the atomic and molecular beam formation theories with actual experiments. Atomic and Molecular Beams: Production and Collimation is a comprehensive source of material for experimentalists facing the design of any atomic or molecular beam and theoreticians wishing to extend the theory.
Author: R. Mohan Sankaran
Publisher: CRC Press
Published: 2017-12-19
Total Pages: 417
ISBN-13: 1439866775
DOWNLOAD EBOOKWe are at a critical evolutionary juncture in the research and development of low-temperature plasmas, which have become essential to synthesizing and processing vital nanoscale materials. More and more industries are increasingly dependent on plasma technology to develop integrated small-scale devices, but physical limits to growth, and other challenges, threaten progress. Plasma Processing of Nanomaterials is an in-depth guide to the art and science of plasma-based chemical processes used to synthesize, process, and modify various classes of nanoscale materials such as nanoparticles, carbon nanotubes, and semiconductor nanowires. Plasma technology enables a wide range of academic and industrial applications in fields including electronics, textiles, automotives, aerospace, and biomedical. A prime example is the semiconductor industry, in which engineers revolutionized microelectronics by using plasmas to deposit and etch thin films and fabricate integrated circuits. An overview of progress and future potential in plasma processing, this reference illustrates key experimental and theoretical aspects by presenting practical examples of: Nanoscale etching/deposition of thin films Catalytic growth of carbon nanotubes and semiconductor nanowires Silicon nanoparticle synthesis Functionalization of carbon nanotubes Self-organized nanostructures Significant advances are expected in nanoelectronics, photovoltaics, and other emerging fields as plasma technology is further optimized to improve the implementation of nanomaterials with well-defined size, shape, and composition. Moving away from the usual focus on wet techniques embraced in chemistry and physics, the author sheds light on pivotal breakthroughs being made by the smaller plasma community. Written for a diverse audience working in fields ranging from nanoelectronics and energy sensors to catalysis and nanomedicine, this resource will help readers improve development and application of nanomaterials in their own work. About the Author: R. Mohan Sankaran received the American Vacuum Society’s 2011 Peter Mark Memorial Award for his outstanding contributions to tandem plasma synthesis.
Author: American Vacuum Society
Publisher:
Published: 2000
Total Pages: 1172
ISBN-13:
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Publisher:
Published: 1997
Total Pages: 2304
ISBN-13:
DOWNLOAD EBOOKAuthor: Chuan Seng Tan
Publisher: CRC Press
Published: 2016-04-19
Total Pages: 376
ISBN-13: 9814303828
DOWNLOAD EBOOKThree-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Author: Stanford University
Publisher:
Published: 1996
Total Pages: 506
ISBN-13:
DOWNLOAD EBOOKAuthor: David W. Humbird
Publisher:
Published: 2004
Total Pages: 524
ISBN-13:
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Publisher:
Published: 2002
Total Pages: 854
ISBN-13:
DOWNLOAD EBOOKAuthor: Kazuo Nojiri
Publisher: Springer
Published: 2014-10-25
Total Pages: 126
ISBN-13: 3319102958
DOWNLOAD EBOOKThis book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.