What's a Doherty power amplifier? What's the practical design flow to develop a DPA? May I estimate the achievable performance? May I get more efficiency, gain, back-off and frequencies from my DPA? Whether you have a FAQ or a rare question, inside you'll probably find the answer. This book is a real design manual, which can help the designer to identify, starting from the desired requirements, the best approach to use, simultaneously highlighting the advantages as well as disadvantages that occurs with its adoption.
New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. - Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies - Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) - Focuses on mm-wave frequencies up to the terahertz regime
This book is focused on addressing the designs of FinFET-based analog ICs for 5G and E-band communication networks. In addition, it also incorporates some of the contemporary developments over different fields. It highlights the latest advances, problems and challenges and presents the latest research results in the field of mm-wave integrated circuits designing based on scientific literature and its practical realization. The traditional approaches are excluded in this book. The authors cover various design guidelines to be taken care for while designing these circuits and detrimental scaling effects on the same. Moreover, Gallium Nitrides (GaN) are also reported to show huge potentials for the power amplifier designing required in 5G communication network. Subsequently, to enhance the readability of this book, the authors also include real-time problems in RFIC designing, case studies from experimental results, and clearly demarking design guidelines for the 5G communication ICs designing. This book incorporates the most recent FinFET architecture for the analog IC designing and the scaling effects along with the GaN technology as well.
Achieve higher levels of performance, integration, compactness, and cost-effectiveness in the design and modeling of radio-frequency (RF) power amplifiers RF power amplifiers are important components of any wireless transmitter, but are often the limiting factors in achieving better performance and lower cost in a wireless communication system—presenting the RF IC design community with many challenges. The next-generation technological advances presented in this book are the result of cutting-edge research in the area of large-signal device modeling and RF power amplifier design at the Georgia Institute of Technology, and have the potential to significantly address issues of performance and cost-effectiveness in this area. Richly complemented with hundreds of figures and equations, Modeling and Design Techniques for RF Power Amplifiers introduces and explores the most important topics related to RF power amplifier design under one concise cover. With a focus on efficiency enhancement techniques and the latest advances in the field, coverage includes: Device modeling for CAD Empirical modeling of bipolar devices Scalable modeling of RF MOSFETs Power amplifier IC design Power amplifier design in silicon Efficiency enhancement of RF power amplifiers The description of state-of-the-art techniques makes this book a valuable and handy reference for practicing engineers and researchers, while the breadth of coverage makes it an ideal text for graduate- and advanced undergraduate-level courses in the area of RF power amplifier design and modeling.
This cutting-edge resource presents a complete and systematic overview of the practical design considerations of radio frequency (RF) high efficiency load modulation power amplifiers (PA) for modern wireless communications for 4G and beyond. It provides comprehensive insight into all aspects of load modulation PA design and optimization not only covering design approaches specifically for passive and active load modulation operation but also hybrid with dynamic supply modulation and digital signal processing algorithms required for performance enhancement. Passive load impedance tuner design, dynamic load modulation PA, active load modulation PA and Doherty PA design for efficiently enhancement are explained. Readers find practical guidance into load modulation PA design for bandwidth extension, including video bandwidth enhancement techniques, broadband dynamic load amplifiers, topology selection, design procedures, and network output. This book presents the evolution and integration of classical load modulation PA topologies in order to meet new challenges in the field.
This book addresses the true innovation in engineering design that may be promoted by blending together models and methodologies from different disciplines, and, in this book, the target was exactly to follow this approach to deliver a new disruptive architecture to deliver these next-generation mobile small cell technologies. According to this design philosophy, the work within this book resides in the intersection of engineering paradigms that includes “cooperation”, “network coding”, and “smart energy-aware frontends”. These technologies will not only be considered as individual building blocks, but re-engineered according to an inter-design approach resulting in the enabler for energy efficient femtocell-like services on the move. The book aims to narrow the gap between the current networking technologies and the foreseen requirements that are targeted at the future development of the 5G mobile and wireless communications networks in terms of the higher networking capacity, the ability to support more users, the lower cost per bit, the enhanced energy efficiency, and adaptability to new services and devices (for example, smart cities, and the Internet of things (IoT)).
The book "Nitride Semiconductor Technology" provides an overview of nitride semiconductors and their uses in optoelectronics and power electronics devices. It explains the physical properties of those materials as well as their growth methods. Their applications in high electron mobility transistors, vertical power devices, LEDs, laser diodes, and vertical-cavity surface-emitting lasers are discussed in detail. The book further examines reliability issues in these materials and puts forward perspectives of integrating them with 2D materials for novel high-frequency and high-power devices. In summary, it covers nitride semiconductor technology from materials to devices and provides the basis for further research.
This book introduces power amplifier design in 22nm FDSOI CMOS dedicated towards 5G applications at 28 GHz and presents 4 state-of-the-art power amplifier designs. The authors discuss power amplifier performance metrics, design trade-offs, and presents different power amplifier classes utilizing efficiency enhancement techniques at 28 GHz. The book presents the design process from theory, simulation, layout, and finally measurement results.
This book introduces systematic design methods for passive and active RF circuits and techniques, including state-of-the-art digital enhancement techniques. As the very first book dedicated to multiband RF circuits and techniques, this work provides an overview of the evolution of transmitter architecture and discusses current digital predistortion techniques. Readers will find a collection of novel research ideas and new architectures in concurrent multiband power dividers, power amplifiers and related digital enhancement techniques. This book will be of great interest to academic researchers, R&D engineers, wireless transmitter and protocol designers, as well as graduate students who wish to learn the core architectures, principles and methods of multiband RF circuits and techniques.
With speeds of up to 20 gigabits per second and the ability to support up to one million devices per square kilometer, 5G — the current generation of mobile communications technology — may seem impressive, but 6G is set to take these capabilities even further. Envisioned to deliver a peak data rate of 1 terabit per second and latency of 100 microseconds or less, 6G must be able to seamlessly and securely deliver data in an ever increasingly saturated network of wireless connections without exceeding the energy requirements of 5G.This book covers every aspect of future communications, from key technologies, to design challenges, network requirements, and users experiences; to standardization, chip design, and industry applications from 5G to 6G. It presents the requirements and use cases of 6G, RF transceivers roadmap for 2030 and beyond, and modeling of RF devices for 5G/6G applications. In here, a modified Shannon's capacity formula that is critical for future advanced wireless communications such as 6G is discussed for the first time. It also presents the standardization of 6G wireless communication systems with emphasis on Standard Development Organizations (SDOs), regulatory bodies and administrations, ITU, industry forums, and 6G standard timeline. The book presents an RF/mm-wave integrated circuit design for future communications to provides readers with an easy-to-understand overview of voltage-controlled oscillators, power amplifiers, low-noise amplifiers, frequency synthesizers, high-frequency dividers, and chip-to-chip communications isolation technology.This book is an excellent reference for readers specializing in electrical and electronic engineering, wireless communication, integrated circuit design, circuits and systems, to learn more about 5G and even 6G communication standards and RF/mm-wave IC design. In particular, professionals working in the foundry, fabless semiconductor companies, original equipment manufacturers, and integrated device manufacturers will also benefit from this book.
