Surface Mount Technology Terms and Concepts is an invaluable resource for anyone involved in SMT. This book clearly defines more than 1000 of the most commonly used terms and concepts. By far the most comprehensive glossary of its kind, as well as more accessible and readable than most technical books devoted to assembly, Surface Mount Technology Terms and Concepts contains all of the terms that engineers and managers engaged in surface mount process, manufacturing, quality, design, and purchasing may encounter.
The only source that focuses exclusively on engineering and technology, this important guide maps the dynamic and changing field of information sources published for engineers in recent years. Lord highlights basic perspectives, access tools, and English-language resources—directories, encyclopedias, yearbooks, dictionaries, databases, indexes, libraries, buyer's guides, Internet resources, and more. Substantial emphasis is placed on digital resources. The author also discusses how engineers and scientists use information, the culture and generation of scientific information, different types of engineering information, and the tools and resources you need to locate and access that material. Other sections describe regulations, standards and specifications, government resources, professional and trade associations, and education and career resources. Engineers, scientists, librarians, and other information professionals working with engineering and technology information will welcome this research
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through hole technology (THT). SMT comes into existence because our earlier version of Through Hole Manufacturing Technology (THT)were having following limitations: 1.Large in Size 2.Only one side of PCB can be used 3.Lesser functions 4.Automation of PCB Assembly restricted 5.Cross Talk becomes predominating factor at Higher Frequency, restricting evolution of Mobile Technology.
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.
An application protocol is an information systems engineering view of a specific product The view represents an agreement on the generic activities needed to design and fabricate the product the agreement on the information needed to support those activities, and the specific constructs of a product data standard for use in transferring some or all of the information required. This application protocol describes the data for electrical and electronic products in terms of a product description standard called the Initial Graphics Exchange Specification (IGES). More specifically, the Layered Electrical Product IGES Application Protocol (AP) specifies the mechanisms for defining and exchanging computer-models and their associated data for those products which have been designed in two dimensional geometry so as to be produced as a series of layers in IGES format The AP defines the appropriateness of the data items for describing the geometry of the various parts of a product (shape and location), the connectivity, and the processing and material characteristics. Excluded is the behavioral requirements which the product was intended to satisfy, except as those requirements have been recorded as design rules or product testing requirements.
This book shows how to build in, evaluate, and demonstrate reliability and availability of components, equipment, systems. It presents the state-of-the-art of reliability engineering, both in theory and practice, and is based on the author's more than 30 years experience in this field, half in industry and half as Professor of Reliability Engineering at the ETH, Zurich. The structure of the book allows rapid access to practical results. This final edition extend and replace all previous editions. New are, in particular, a strategy to mitigate incomplete coverage, a comprehensive introduction to human reliability with design guidelines and new models, and a refinement of reliability allocation, design guidelines for maintainability, and concepts related to regenerative stochastic processes. The set of problems for homework has been extended. Methods & tools are given in a way that they can be tailored to cover different reliability requirement levels and be used for safety analysis. Because of the Appendices A6 - A8, the book is also self contained from a mathematical point of view, and can be used as a text book or as a desktop reference, with a large number of tables (60), figures (190), and examples (210 of which 70 as problems for homework) to support the practical aspects.
Analyzes all phases of the electronic product design process, including management, planning, quality control, design, manufacturing, and automation. A reference/textbook for students and professionals in such fields as electronics, manufacturing, circuit design, computer science. Annotation copyrig
