Structure and Electronic Properties of Ultrathin Dielectric Films on Silicon and Related Structures: Volume 592

Structure and Electronic Properties of Ultrathin Dielectric Films on Silicon and Related Structures: Volume 592

Author: D. A. Buchanan

Publisher: Mrs Proceedings

Published: 2000-10-17

Total Pages: 408

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. The book, first published in 2000, includes detailed theoretical studies of the nature of SiO2 and its interface with silicon, electron paramagnetic resonance for the study of defects, electron tunneling, and band alignment among others.


Oxide Reliability: A Summary Of Silicon Oxide Wearout, Breakdown, And Reliability

Oxide Reliability: A Summary Of Silicon Oxide Wearout, Breakdown, And Reliability

Author: David J Dumin

Publisher: World Scientific

Published: 2002-01-18

Total Pages: 281

ISBN-13: 981448945X

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This book presents in summary the state of our knowledge of oxide reliability. The articles have been written by experts who are among the most knowledgeable in the field. The book will be an invaluable aid to reliability engineers and manufacturing engineers, helping them to produce and characterize reliable oxides. It can be used as an introduction for new engineers interested in oxide reliability, besides being a reference for engineers already engaged in the field.


Thermoelectric Materials 2000 - The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications: Volume 626

Thermoelectric Materials 2000 - The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications: Volume 626

Author: Terry M. Tritt

Publisher:

Published: 2001-03

Total Pages: 434

ISBN-13:

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The presentations from the symposium are grouped into the following topics: skutterudites, superlattice, new materials, quantum wires and dots, half-heusler alloys and quasicrystals, TE theory, thermionics, clathrates, and thin films TE. In addition, poster sessions include the following: semiconductors with tetrahedral anions as potential thermoelectric materials, lattice dynamics study of anisotropic heat conduction in supperlattices, structure and thermoelectric properties of new quaternary tin and lead Bismuth selenides, attributes of the Seebeck coefficient of Bismuth microwire array composites, and High-Z Lanthanum-Cerium Hexaborate thin films for low-temperature applications. c. Book News Inc.


Characterization and Metrology for ULSI Technology: 2003

Characterization and Metrology for ULSI Technology: 2003

Author: David G. Seiler

Publisher: American Institute of Physics

Published: 2003-10-08

Total Pages: 868

ISBN-13:

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The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Topics include: integrated circuit history, challenges and overviews, front end, lithography, interconnect and back end, and critical analytical techniques. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The editors believe that this book of collected papers provides a concise and effective portrayal of industry characterization needs and the way they are being addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. Hopefully, it will also provide a basis for stimulating advances in metrology and new ideas for research and development.


Si Front End Processing - Physics and Technology II of Dopant-Defect Interactions II: Volume 610

Si Front End Processing - Physics and Technology II of Dopant-Defect Interactions II: Volume 610

Author: Aditya Agarwal

Publisher:

Published: 2001-04-09

Total Pages: 448

ISBN-13:

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This proceedings of the April 2000 symposium deals with formation of electrical junctions in the front-end processing of devices for the approaching end-of-the-roadmap. The 60 papers address 2D dopant characterization, ion implantation and shallow junction technology, group III diffusion and activation, carbon diffusion and activation, group V diffusion and activation, vacancy-type defects, regrown amorphous layers, and structure and properties of point and extended defects. Topics include ultra-shallow junction formation and gate activation in deep-submicron CMOS, low energy implantation of boron with decaborane ions, modeling ramp rate effects on shallow junction formation, clustering equilibrium and deactivation kinetics in As doped silicon, and atomistic modeling of complex silicon processing scenarios. c. Book News Inc.


Ferroelectric Thin Films VIII: Volume 596

Ferroelectric Thin Films VIII: Volume 596

Author: R. W. Schwartz

Publisher:

Published: 2000-08-17

Total Pages: 610

ISBN-13:

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This book, the eighth in a popular series from MRS, features the latest technical information on ferroelectric thin films from an international mix of academia, industry and government organizations. Recent results for DRAM and FERAM devices, as well as enhancements in material performance for these applications, are presented. Significant advances in understanding leakage current, frequency dependence of the coercive field, hydrogen annealing effects, piezoelectric constants, and domain switching responses are highlighted. The development of ferroelectric thin films for piezoelectric applications are also reviewed, as are improved film-fabrication procedures including chemical vapor deposition and chemical solution deposition. Topics include: BST thin films and DRAM; integration and electrodes; Bi-based thin-film ferroelectrics; Pb-based thin-film ferroelectrics; fundamental properties of thin-film ferroelectrics; ferroelectric gate materials and devices; and piezoelectric, pyro-electric and capacitor devices and novel processing strategies.