Micro/Nano Manufacturing
Micro/Nano Manufacturing

Author: André Zimmermann

Publisher: MDPI

Published: 2019-09-03

Total Pages: 208

ISBN-13: 3039211692

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Micro manufacturing involves dealing with the fabrication of structures in the size range of 0.1 to 1000 µm. The scope of nano manufacturing extends the size range of manufactured features to even smaller length scales—below 100 nm. A strict borderline between micro and nano manufacturing can hardly be drawn, such that both domains are treated as complementary and mutually beneficial within a closely interconnected scientific community. Both micro and nano manufacturing can be considered as important enablers for high-end products. This Special Issue of Applied Sciences is dedicated to recent advances in research and development within the field of micro and nano manufacturing. The included papers report recent findings and advances in manufacturing technologies for producing products with micro and nano scale features and structures as well as applications underpinned by the advances in these technologies.

Microengineering Aerospace Systems
Microengineering Aerospace Systems

Author: Henry Helvajian

Publisher: AIAA

Published: 1999

Total Pages: 748

ISBN-13: 9781884989032

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Microengineering Aerospace Systems is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing, and materials characterization for developing miniaturized smart instruments for aerospace systems (i.e., ASIM application-specific integrated microinstrument), satellites, and satellite subsystems. Third in a series of Aerospace Press publications covering this rapidly advancing technology, this work presents fundamental aspects of the technology and specific aerospace systems applications through worked examples.

Microfabrication and Nanomanufacturing
Microfabrication and Nanomanufacturing

Author: Mark J. Jackson

Publisher: CRC Press

Published: 2005-11-10

Total Pages: 416

ISBN-13: 1420028278

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Nanotechnology, seen as the next leap forward in the industrial revolution, requires that manufacturers develop processes that revolutionize the way small products are made. Microfabrication and Nanomanufacturing focuses on the technology of fabrication and manufacturing of engineering materials at these levels. The book provides an overview of techniques used in the semiconductor industry. It also discusses scaling and manufacturing processes operating at the nanoscale for non-semiconductor applications; the construction of nanoscale components using established lithographic techniques; bulk and surface micromachining techniques used for etching, machining, and molding procedures; and manufacturing techniques such as injection molding and hot embossing. This authoritative compilation describes non-traditional micro and nanoscale processing that uses a newly developed technique called pulsed water jet machining as well as the efficient removal of materials using optical energy. Additional chapters focus on the development of nanoscale processes for producing products other than semiconductors; the use of abrasive particles embedded in porous tools; and the deposition and application of nanocrystalline diamond. Economic factors are also presented and concern the promotion and commercialization of micro and nanoscale products and how demand will eventually drive the market.

Intelligent Electronic Devices
Intelligent Electronic Devices

Author: Teen-Hang Meen

Publisher: MDPI

Published: 2020-05-20

Total Pages: 220

ISBN-13: 303928973X

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In a modern technological society, electronic engineering and design innovations are both academic and practical engineering fields that involve systematic technological materialization through scientific principles and engineering designs. Engineers and designers must work together with a variety of other professionals in their quest to find systems solutions to complex problems. Rapid advances in science and technology have broadened the horizons of engineering while simultaneously creating a multitude of challenging problems in every aspect of modern life. Current research is interdisciplinary in nature, reflecting a combination of concepts and methods that often span several areas of mechanics, mathematics, electrical engineering, control engineering, and other scientific disciplines. In addition, the 2nd IEEE International Conference on Knowledge Innovation and Invention 2019 (IEEE ICKII 2019) was held in Seoul, South Korea, on 12–15 July, 2019. This book, “Intelligent Electronic Devices”, includes 13 excellent papers form 260 papers presented in this conference about intelligent electronic devices. The main goals of this book were to encourage scientists to publish their experimental and theoretical results in as much detail as possible and to provide new scientific knowledge relevant to the topics of electronics.

Proceedings of 11th International Conference on Advanced Materials & Processing 2017
Proceedings of 11th International Conference on Advanced Materials & Processing 2017

Author: ConferenceSeries

Publisher: ConferenceSeries

Published:

Total Pages: 122

ISBN-13:

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September 7-8 2017 Edinburgh, Scotland Key Topics : Advanced Materials Engineering, Advanced Ceramics and Composite Materials, Polymers Science and Engineering, Advancement in Nanomaterials Science And Nanotechnology, Metals, Metallurgy and Materials, Optical, Electronic and Magnetic Materials, Advanced Biomaterials, Bio devices & Tissue Engineering, Materials for Energy application& Energy storage, Carbon Based Nanoscale Materials, Entrepreneurs Investment Meet, Materials Processing and characterization, Processing and Fabrication of Advanced Materials, Emerging Areas of Materials Science, Materials Based Engineering Design and Control, Materials Engineering and Performance, Materials Science and Engineering, Needs, Priorities and Opportunities For Materials, Material Properties at High Temperature Applications, Coatings and Surface Engineering, Functional Materials, Materials For Engineering and Environmental Sustainability,

Convection and Conduction Heat Transfer
Convection and Conduction Heat Transfer

Author: Amimul Ahsan

Publisher: BoD – Books on Demand

Published: 2011-10-21

Total Pages: 410

ISBN-13: 9533075821

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The convection and conduction heat transfer, thermal conductivity, and phase transformations are significant issues in a design of wide range of industrial processes and devices. This book includes 18 advanced and revised contributions, and it covers mainly (1) heat convection, (2) heat conduction, and (3) heat transfer analysis. The first section introduces mixed convection studies on inclined channels, double diffusive coupling, and on lid driven trapezoidal cavity, forced natural convection through a roof, convection on non-isothermal jet oscillations, unsteady pulsed flow, and hydromagnetic flow with thermal radiation. The second section covers heat conduction in capillary porous bodies and in structures made of functionally graded materials, integral transforms for heat conduction problems, non-linear radiative-conductive heat transfer, thermal conductivity of gas diffusion layers and multi-component natural systems, thermal behavior of the ink, primer and paint, heating in biothermal systems, and RBF finite difference approach in heat conduction. The third section includes heat transfer analysis of reinforced concrete beam, modeling of heat transfer and phase transformations, boundary conditions-surface heat flux and temperature, simulation of phase change materials, and finite element methods of factorial design. The advanced idea and information described here will be fruitful for the readers to find a sustainable solution in an industrialized society.

Mems Packaging
Mems Packaging

Author: Yung-cheng Lee

Publisher: World Scientific

Published: 2018-01-03

Total Pages: 363

ISBN-13: 9813229373

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MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

World Congress on Medical Physics and Biomedical Engineering September 7 - 12, 2009 Munich, Germany
World Congress on Medical Physics and Biomedical Engineering September 7 - 12, 2009 Munich, Germany

Author: Olaf Dössel

Publisher: Springer Science & Business Media

Published: 2010-01-04

Total Pages: 405

ISBN-13: 3642038875

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Present Your Research to the World! The World Congress 2009 on Medical Physics and Biomedical Engineering – the triennial scientific meeting of the IUPESM - is the world’s leading forum for presenting the results of current scientific work in health-related physics and technologies to an international audience. With more than 2,800 presentations it will be the biggest conference in the fields of Medical Physics and Biomedical Engineering in 2009! Medical physics, biomedical engineering and bioengineering have been driving forces of innovation and progress in medicine and healthcare over the past two decades. As new key technologies arise with significant potential to open new options in diagnostics and therapeutics, it is a multidisciplinary task to evaluate their benefit for medicine and healthcare with respect to the quality of performance and therapeutic output. Covering key aspects such as information and communication technologies, micro- and nanosystems, optics and biotechnology, the congress will serve as an inter- and multidisciplinary platform that brings together people from basic research, R&D, industry and medical application to discuss these issues. As a major event for science, medicine and technology the congress provides a comprehensive overview and in–depth, first-hand information on new developments, advanced technologies and current and future applications. With this Final Program we would like to give you an overview of the dimension of the congress and invite you to join us in Munich! Olaf Dössel Congress President Wolfgang C.