Soldering in Electronics Assembly
Soldering in Electronics Assembly

Author: MIKE JUDD

Publisher: Elsevier

Published: 1999-03-26

Total Pages: 385

ISBN-13: 008051734X

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Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment

Solder Paste in Electronics Packaging
Solder Paste in Electronics Packaging

Author: Jennie Hwang

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 374

ISBN-13: 146153528X

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.

Modern Solder Technology for Competitive Electronics Manufacturing
Modern Solder Technology for Competitive Electronics Manufacturing

Author: Jennie S. Hwang

Publisher: McGraw Hill Professional

Published: 1996

Total Pages: 678

ISBN-13: 9780070317499

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Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.

Soldering
Soldering

Author: Mel Schwartz

Publisher: ASM International

Published: 2014-03-01

Total Pages: 207

ISBN-13: 1627080589

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Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.

Handbook of Electronic Assembly and a Guide to SMTA Certification
Handbook of Electronic Assembly and a Guide to SMTA Certification

Author: Ronald Lasky

Publisher:

Published: 2014-01-01

Total Pages:

ISBN-13: 9780988887312

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Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.

Getting Started with Soldering
Getting Started with Soldering

Author: Marc de Vinck

Publisher: Maker Media, Inc.

Published: 2017-10-11

Total Pages: 165

ISBN-13: 1680453815

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Getting Started with Soldering not only teaches new makers and experimenters the core principles of soldering, it also functions as an excellent reference and resource for beginners and more advanced makers alike. The book guides readers through the fundamentals of soldering, explains the tools and materials, demonstrates proper techniques, and shows how to fix mistakes or broken connections. It even includes guidance on more advanced techniques such as surface-mount soldering for electronics. From choosing the right soldering iron to making perfect connections, readers will acquire the knowledge and skills needed to form a strong foundation for a lifetime of making. Soldering is a core concept in making, electronics prototyping, and home repairs The many different types of soldering -- requiring different materials and tools -- are explained with easy-to-follow instructions Full-color photographs and illustrations throughout create a visually engaging format for learning Pricing and technical considerations help readers select the best tools for their budgets and needs Troubleshooting guidelines show how to repair solder connections that have failed from improper technique or from age

Reflow Soldering Processes
Reflow Soldering Processes

Author: Ning-Cheng Lee

Publisher: Newnes

Published: 2002-01-11

Total Pages: 282

ISBN-13: 0750672188

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Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Electronic Assembly Fabrication
Electronic Assembly Fabrication

Author: Charles A. Harper

Publisher: McGraw Hill Professional

Published: 2002-04-10

Total Pages: 692

ISBN-13: 9780071378826

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Printed circuit history and overview. Development and fabrication of IC chips. Packaging of IC chips. Printed circuit board fabrication.

Learn to Solder
Learn to Solder

Author: Brian Jepson

Publisher: "O'Reilly Media, Inc."

Published: 2012-05-01

Total Pages: 53

ISBN-13: 1449337430

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Learn the fundamentals of soldering—and pick up an essential skill for building electronic gadgets. You’ll discover how to preheat and tin your iron, make a good solder joint, desolder cleanly (when things don't quite go right), and how to use helping hands to hold components in place. This concise book is part of MAKE’s Getting Started with Soldering Kit. Using the tools in the kit and some electronic components, you can practice soldering while making fun blinky objects. Then show the world you just learned a new skill by wearing the Learn to Solder Skill Badge. Learn how to prepare your workspace Get to know the components you’ll work with Use the best methods for soldering components in place Experience the perfect solder joint Know how to desolder when things don’t work the first time Heat up the iron and start soldering today!

Lead-free Soldering Process Development and Reliability
Lead-free Soldering Process Development and Reliability

Author: Jasbir Bath

Publisher: John Wiley & Sons

Published: 2020-06-12

Total Pages: 515

ISBN-13: 1119482046

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Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.