SN3 - Collection of Interlaced Speeches

SN3 - Collection of Interlaced Speeches

Author: Tomás Morales y Durán

Publisher: Libros de Verdad

Published: 2024-03-31

Total Pages: 311

ISBN-13:

DOWNLOAD EBOOK

The Book of the Factors of Clinging to Existence is the third of the five books of the Interwoven Discourses. It is named after its first saṃyutta which is the dominant one both in length and importance, since it deals with a key aspect of the teachings. The analysis of the factors of clinging to existence represents the logical level systematization of experience and is key to understanding suffering and describes how we are chained to Samsara. Experience involves five processes: qualia, emotional reaction, perception, conditional situation and cognition. The first is the process related to sense inputs and the other four are the processes of conceptualization. Qualia are the result of encoding and processing inputs from the six sense gates: sight, hearing, smell, taste, touch and intellect, and deliver images, sounds, smells, tastes, tactile sensations and ideas. The emotional reaction is the first thing that intervenes through the limbic system and is the process that translates the experience into pleasant, unpleasant or indifferent. A pleasant experience will incite clinging and an unpleasant one, aversion. Perception is the process that gives meaning to the experience. The conditional situation affects the experience from the moment in which the same experience is not processed in the same way over time depending on the previous history. Each experience will change the conditional situation so that no experience will be repeated. Our perception of time is a conceptualization of the conditional situation. And finally, cognition is the act of knowing. As we see, all these components are perishable and last as long as the experience lasts. We have no other connection with Samsara than these five elements which, grouped together, we will call qualia and conceptualization. Understand that all five are conditioned and therefore perishable. That what is conditioned we have no control over. And that over which one has no control cannot be said to be "me" or "mine". And that which is neither me, nor mine, which is perishable and conditioned, is unsatisfactory. And that which is unsatisfactory becomes easy to abandon. And abandoning it, one abandons the enchainment to Samsara. We see that the consciousness is clinging to existence by these five clinging factors. Liberation is untying the consciousness from these five factors and constitutes the ultimate goal. A consciousness untied from Samsara is a free consciousness and freedom is Nibbāna. This is the core of the Dhamma. Of the remaining booklets, three continue with this theme and the rest deal with various secondary subjects, some organized by theme, others by persons. Of note is the saṃyutta devoted to the Nāgas, beings whose bodies are described as those of serpents, although they can assume human form at will. Also to the Supaṇṇas, mythical creatures imagined as winged, considered enemies of the nāgas, the Gandhabbas, a class of semi-divine beings who inhabit the Cātummahārājika realm and are the lowest among the devas, and the Valāhakas who are the cloud devas who control the weather.


FPGA Implementations of Neural Networks

FPGA Implementations of Neural Networks

Author: Amos R. Omondi

Publisher: Springer Science & Business Media

Published: 2006-10-04

Total Pages: 365

ISBN-13: 0387284877

DOWNLOAD EBOOK

During the 1980s and early 1990s there was signi?cant work in the design and implementation of hardware neurocomputers. Nevertheless, most of these efforts may be judged to have been unsuccessful: at no time have have ha- ware neurocomputers been in wide use. This lack of success may be largely attributed to the fact that earlier work was almost entirely aimed at developing custom neurocomputers, based on ASIC technology, but for such niche - eas this technology was never suf?ciently developed or competitive enough to justify large-scale adoption. On the other hand, gate-arrays of the period m- tioned were never large enough nor fast enough for serious arti?cial-neur- network (ANN) applications. But technology has now improved: the capacity and performance of current FPGAs are such that they present a much more realistic alternative. Consequently neurocomputers based on FPGAs are now a much more practical proposition than they have been in the past. This book summarizes some work towards this goal and consists of 12 papers that were selected, after review, from a number of submissions. The book is nominally divided into three parts: Chapters 1 through 4 deal with foundational issues; Chapters 5 through 11 deal with a variety of implementations; and Chapter 12 looks at the lessons learned from a large-scale project and also reconsiders design issues in light of current and future technology.


A Swift Pair of Messengers

A Swift Pair of Messengers

Author: Bhikkhu Sujato

Publisher: Bhikkhu Sujato

Published: 2010-08-12

Total Pages: 185

ISBN-13: 1921842008

DOWNLOAD EBOOK

Serenity and insight are the two great wings of Buddhist meditation. They each have a special role to play in the path to Awakening. While some modern approaches seek to marginalize serenity in favor of 'dry' insight, the Buddha's own discourses place serenity right at the center of the path. This book collects virtually all the significant passages on this topic that are found in the early discourses, carefully elucidated for the modern reader.


Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Author: John H. Lau

Publisher: Springer Nature

Published: 2020-05-29

Total Pages: 545

ISBN-13: 9811539200

DOWNLOAD EBOOK

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.


Nonlinear Laser Dynamics

Nonlinear Laser Dynamics

Author: Kathy Lüdge

Publisher: John Wiley & Sons

Published: 2012-04-09

Total Pages: 412

ISBN-13: 3527639837

DOWNLOAD EBOOK

A distinctive discussion of the nonlinear dynamical phenomena of semiconductor lasers. The book combines recent results of quantum dot laser modeling with mathematical details and an analytic understanding of nonlinear phenomena in semiconductor lasers and points out possible applications of lasers in cryptography and chaos control. This interdisciplinary approach makes it a unique and powerful source of knowledge for anyone intending to contribute to this field of research. By presenting both experimental and theoretical results, the distinguished authors consider solitary lasers with nano-structured material, as well as integrated devices with complex feedback sections. In so doing, they address such topics as the bifurcation theory of systems with time delay, analysis of chaotic dynamics, and the modeling of quantum transport. They also address chaos-based cryptography as an example of the technical application of highly nonlinear laser systems.


Dictionary of Hard Words

Dictionary of Hard Words

Author: Robert Morris Pierce

Publisher: Legare Street Press

Published: 2023-07-18

Total Pages: 0

ISBN-13: 9781020286193

DOWNLOAD EBOOK

Don't let difficult vocabulary words hold you back! This handy dictionary offers clear definitions of some of the trickiest words in the English language. Designed for students, writers, and anyone who wants to improve their vocabulary, this reference book is an essential tool for anyone seeking to expand their knowledge of English. This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work is in the "public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.


Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Author: John H. Lau

Publisher: McGraw-Hill Professional Publishing

Published: 1997

Total Pages: 440

ISBN-13:

DOWNLOAD EBOOK

The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale package (CSP), and solder-bumped flip chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. For these technologies, solder is the electrical and mechanical "glue," and thus solder joint reliability is one of the most critical issues in the development of these technologies. This book is a one-stop guide to the state of the art of solder joint reliability problem-solving methods, or choose a creative, high-performance, robust, and cost-effective design and high-yield manufacturing process for their interconnect systems will be able to do so with this unique sourcebook. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. This book is structured to provide readers with the necessary know-how for practical, on-the-job problem-solving guidance. The book covers the solder joint reliability of BGA, CSP, flip chip, and FPT assemblies completely, proceeding from the theoretical basics to applications. Specific areas covered include: Definition of reliability, life distribution, failure rate, mean time to failure, etc.; Some well-known life distributions; Accelerated testing; Parameter estimation of life distributions; Acceleration factors for solders;Solder mechanics: plasticity, creep, and constitutive equations; Design, material, and manufacturing processes of BGA, CSP, flip chip, and FTP; Failure analysis and root cause of failure for BGA, CSP, flip chip, and FPT solder joints; Design for reliability of BGA, CSP, flip chip and FPT solder joints; Solder joint reliability of CBGA, PBGA, DBGA, and TBGA assemblies under thermal fatigue, mechanical bending and twisting, and shock and vibration conditions; solder joint reliability of flip chip (e.g., high-temperature and eutectic solder bumped flip chips on ceramic and PCB) assemblies under thermal fatigue, mechanical pulling, shearing, bending and twisting, and shock and vibration conditions; Solder joint reliability of CSP (e.g., LG Semicon's, Mitsubishi's, Motorola's, Tessera's, NEC's, nitto Denko's and Toshiba's) assemblies under thermal fatigue and mechanical bending conditions; Solder joint reliability of PQFP and TSOP assemblies under thermal fatigue, mechanical bending and twisting, and vibration conditions.