Advances in Chemical Mechanical Planarization (CMP)
Advances in Chemical Mechanical Planarization (CMP)

Author: Babu Suryadevara

Publisher: Woodhead Publishing

Published: 2016-01-09

Total Pages: 538

ISBN-13: 0081002181

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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. - Considers techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for particular materials - Addresses consumables and process control for improved CMP

Chemical Mechanical Planarization in IC Device Manufacturing III
Chemical Mechanical Planarization in IC Device Manufacturing III

Author: Robert Leon Opila

Publisher: The Electrochemical Society

Published: 2000

Total Pages: 664

ISBN-13: 9781566772600

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This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).

Microelectronic Applications of Chemical Mechanical Planarization
Microelectronic Applications of Chemical Mechanical Planarization

Author: Yuzhuo Li

Publisher: John Wiley & Sons

Published: 2008

Total Pages: 734

ISBN-13: 9780471719199

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An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: Provides in-depth coverage of a wide range of state-of-the-art technologies and applications Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Electrochemistry in Mineral and Metal Processing VI
Electrochemistry in Mineral and Metal Processing VI

Author: Fiona M. Doyle

Publisher: The Electrochemical Society

Published: 2003

Total Pages: 458

ISBN-13: 9781566774017

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"The sixth International Symposium on Electrochemistry in Mineral and Metal Processing was held during the 2003rd Meeting of the Electrochemical Society, Inc., in Paris, France, May 14-18, 2003."--p. iii.

Electrochemical Processing in ULSI and MEMS 3
Electrochemical Processing in ULSI and MEMS 3

Author: John O. Dukovic

Publisher: The Electrochemical Society

Published: 2007-09

Total Pages: 288

ISBN-13: 1566775868

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The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.

Chemical Mechanical Polishing in Silicon Processing
Chemical Mechanical Polishing in Silicon Processing

Author:

Publisher: Academic Press

Published: 1999-10-29

Total Pages: 325

ISBN-13: 0080864619

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Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.

Tribology In Chemical-Mechanical Planarization
Tribology In Chemical-Mechanical Planarization

Author: Hong Liang

Publisher: CRC Press

Published: 2005-03-01

Total Pages: 199

ISBN-13: 1420028391

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Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.

Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 9
Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics 9

Author: Ram Ekwal Sah

Publisher: The Electrochemical Society

Published: 2007

Total Pages: 863

ISBN-13: 1566775523

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This issue of ECS Transactions contains the papers presented in the symposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectics held May 6-11, 2007 in Chicago. Papers were presented on deposition, characterization and applications of the dielectrics including high- and low-k dielectrics, as well as interface states, device characterization, reliabiliy and modeling.