Sip, Pick, and Pack...
Sip, Pick, and Pack...

Author: Polly W. Cheney

Publisher:

Published: 2016-12

Total Pages: 27

ISBN-13: 9781939710550

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"... Teaches children about seeds, plants, and a great variety of pollinators in a really fun way. With twenty-two beautiful illustrations, and cleverly rhyming text, it appeals to adults and children, while providing instruction about pollinators' crucial role in food production and some of the challenges that they face. A glossary of terms is listed in the back along with some fun facts about bees and other pollinators. Great for reading to young children and for grades 3-6."--Publisher's description.

You Can Do It! Guided Reading 6-Pack
You Can Do It! Guided Reading 6-Pack

Author:

Publisher: Teacher Created Materials

Published: 2016-12-15

Total Pages: 18

ISBN-13: 1425852769

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Beginning readers follow along as they discover the many things that kids, bugs, and animals can do in this engaging story that features playful illustrations, challenging words, and simple text with examples of various phonemic sounds to aid in developing early reading skills. This 6-Pack includes six copies of this Level G title and a lesson plan that specifically supports Guided Reading instruction.

Advanced Packaging
Advanced Packaging

Author:

Publisher:

Published: 2007-11

Total Pages: 44

ISBN-13:

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Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.

VoIP Hacks
VoIP Hacks

Author: Ted Wallingford

Publisher: "O'Reilly Media, Inc."

Published: 2006

Total Pages: 326

ISBN-13: 0596101333

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Voice over Internet Protocol is gaining a lot of attention these days. Both practical and fun, this text provides technology enthusiasts and voice professionals with dozens of hands-on projects for building a VoIP network, including a softPBX.

Nanopackaging
Nanopackaging

Author: James E. Morris

Publisher: Springer

Published: 2018-09-22

Total Pages: 1007

ISBN-13: 3319903624

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This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.