This book consists of four chapters to address at different modeling levels for different nanoscale MOS structures (Single- and Multi-Gate MOSFETs). The collection of these chapters in the book are attempted to provide a comprehensive coverage on the different levels of electrostatics and transport modeling for these devices, and relationships between them. In particular, the issue of quantum transport approaches, analytical predictive 2D/3D modeling and design-oriented compact modeling. It should be of interests to researchers working on modeling at any level, to provide them with a clear explanation of theapproaches used and the links with modeling techniques for either higher or lower levels.
Is Bigger Always Better? Explore the Behavior of Very Small Devices as Described by Quantum Mechanics Smaller is better when it comes to the semiconductor transistor. Nanoscale Silicon Devices examines the growth of semiconductor device miniaturization and related advances in material, device, circuit, and system design, and highlights the use of device scaling within the semiconductor industry. Device scaling, the practice of continuously scaling down the size of metal-oxide-semiconductor field-effect transistors (MOSFETs), has significantly improved the performance of small computers, mobile phones, and similar devices. The practice has resulted in smaller delay time and higher device density in a chip without an increase in power consumption. This book covers recent advancements and considers the future prospects of nanoscale silicon (Si) devices. It provides an introduction to new concepts (including variability in scaled MOSFETs, thermal effects, spintronics-based nonvolatile computing systems, spin-based qubits, magnetoelectric devices, NEMS devices, tunnel FETs, dopant engineering, and single-electron transfer), new materials (such as high-k dielectrics and germanium), and new device structures in three dimensions. It covers the fundamentals of such devices, describes the physics and modeling of these devices, and advocates further device scaling and minimization of energy consumption in future large-scale integrated circuits (VLSI). Additional coverage includes: Physics of nm scaled devices in terms of quantum mechanics Advanced 3D transistors: tri-gate structure and thermal effects Variability in scaled MOSFET Spintronics on Si platform NEMS devices for switching, memory, and sensor applications The concept of ballistic transport The present status of the transistor variability and more An indispensable resource, Nanoscale Silicon Devices serves device engineers and academic researchers (including graduate students) in the fields of electron devices, solid-state physics, and nanotechnology.
Microelectronics is one of the most rapidly changing scientific fields today. The tendency to shrink devices as far as possible results in extremely small devices which can no longer be described using simple analytical models. This book covers various aspects of advanced device modeling and simulation. As such it presents extensive reviews and original research by outstanding scientists. The bulk of the book is concerned with the theory of classical and quantum-mechanical transport modeling, based on macroscopic, spherical harmonics and Monte Carlo methods.
This book provides a comprehensive review of the state-of-the-art in the development of new and innovative materials, and of advanced modeling and characterization methods for nanoscale CMOS devices. Leading global industry bodies including the International Technology Roadmap for Semiconductors (ITRS) have created a forecast of performance improvements that will be delivered in the foreseeable future – in the form of a roadmap that will lead to a substantial enlargement in the number of materials, technologies and device architectures used in CMOS devices. This book addresses the field of materials development, which has been the subject of a major research drive aimed at finding new ways to enhance the performance of semiconductor technologies. It covers three areas that will each have a dramatic impact on the development of future CMOS devices: global and local strained and alternative materials for high speed channels on bulk substrate and insulator; very low access resistance; and various high dielectric constant gate stacks for power scaling. The book also provides information on the most appropriate modeling and simulation methods for electrical properties of advanced MOSFETs, including ballistic transport, gate leakage, atomistic simulation, and compact models for single and multi-gate devices, nanowire and carbon-based FETs. Finally, the book presents an in-depth investigation of the main nanocharacterization techniques that can be used for an accurate determination of transport parameters, interface defects, channel strain as well as RF properties, including capacitance-conductance, improved split C-V, magnetoresistance, charge pumping, low frequency noise, and Raman spectroscopy.
Heat in most semiconductor materials, including the traditional group IV elements (Si, Ge, diamond), III–V compounds (GaAs, wide-bandgap GaN), and carbon allotropes (graphene, CNTs), as well as emerging new materials like transition metal dichalcogenides (TMDCs), is stored and transported by lattice vibrations (phonons). Phonon generation through interactions with electrons (in nanoelectronics, power, and nonequilibrium devices) and light (optoelectronics) is the central mechanism of heat dissipation in nanoelectronics. This book focuses on the area of thermal effects in nanostructures, including the generation, transport, and conversion of heat at the nanoscale level. Phonon transport, including thermal conductivity in nanostructured materials, as well as numerical simulation methods, such as phonon Monte Carlo, Green’s functions, and first principles methods, feature prominently in the book, which comprises four main themes: (i) phonon generation/heat dissipation, (i) nanoscale phonon transport, (iii) applications/devices (including thermoelectrics), and (iv) emerging materials (graphene/2D). The book also covers recent advances in nanophononics—the study of phonons at the nanoscale. Applications of nanophononics focus on thermoelectric (TE) and tandem TE/photovoltaic energy conversion. The applications are augmented by a chapter on heat dissipation and self-heating in nanoelectronic devices. The book concludes with a chapter on thermal transport in nanoscale graphene ribbons, covering recent advances in phonon transport in 2D materials. The book will be an excellent reference for researchers and graduate students of nanoelectronics, device engineering, nanoscale heat transfer, and thermoelectric energy conversion. The book could also be a basis for a graduate special topics course in the field of nanoscale heat and energy.
In this Brief, authors introduce the advance in theoretical and experimental techniques for determining the thermal conductivity in nanomaterials, and focus on review of their recent theoretical studies on the thermal properties of silicon–based nanomaterials, such as zero–dimensional silicon nanoclusters, one–dimensional silicon nanowires, and graphenelike two–dimensional silicene. The specific subject matters covered include: size effect of thermal stability and phonon thermal transport in spherical silicon nanoclusters, surface effects of phonon thermal transport in silicon nanowires, and defects effects of phonon thermal transport in silicene. The results obtained are supplemented by numerical calculations, presented as tables and figures. The potential applications of these findings in nanoelectrics and thermoelectric energy conversion are also discussed. In this regard, this Brief represents an authoritative, systematic, and detailed description of the current status of phonon thermal transport in silicon–based nanomaterials. This Brief should be a highly valuable reference for young scientists and postgraduate students active in the fields of nanoscale thermal transport and silicon-based nanomaterials.
This book addresses mathematics in a wide variety of applications, ranging from problems in electronics, energy and the environment, to mechanics and mechatronics. Using the classification system defined in the EU Framework Programme for Research and Innovation H2020, several of the topics covered belong to the challenge climate action, environment, resource efficiency and raw materials; and some to health, demographic change and wellbeing; while others belong to Europe in a changing world – inclusive, innovative and reflective societies. The 19th European Conference on Mathematics for Industry, ECMI2016, was held in Santiago de Compostela, Spain in June 2016. The proceedings of this conference include the plenary lectures, ECMI awards and special lectures, mini-symposia (including the description of each mini-symposium) and contributed talks. The ECMI conferences are organized by the European Consortium for Mathematics in Industry with the aim of promoting interaction between academy and industry, leading to innovation in both fields and providing unique opportunities to discuss the latest ideas, problems and methodologies, and contributing to the advancement of science and technology. They also encourage industrial sectors to propose challenging problems where mathematicians can provide insights and fresh perspectives. Lastly, the ECMI conferences are one of the main forums in which significant advances in industrial mathematics are presented, bringing together prominent figures from business, science and academia to promote the use of innovative mathematics in industry.
Physics and Modeling of Tera- and Nano-Devices is a compilation of papers by well-respected researchers working in the field of physics and modeling of novel electronic and optoelectronic devices. The topics covered include devices based on carbon nanotubes, generation and detection of terahertz radiation in semiconductor structures including terahertz plasma oscillations and instabilities, terahertz photomixing in semiconductor heterostructures, spin and microwave-induced phenomena in low-dimensional systems, and various computational aspects of device modeling. Researchers as well as graduate and postgraduate students working in this field will benefit from reading this book. Sample Chapter(s). Semiconductor Device Scaling: Physics, Transport, and the Role of Nanowires (784 KB). Contents: Semiconductor Device Scaling: Physics, Transport, and the Role of Nanowires (D K Ferry et al.); Polaronic Effects at the Field Effect Junctions for Unconventional Semiconductors (N Kirova); Cellular Monte Carlo Simulation of High Field Transport in Semiconductor Devices (S M Goodnick & M Saraniti); Nanoelectronic Device Simulation Based on the Wigner Function Formalism (H Kosina); Quantum Simulations of Dual Gate MOSFET Devices: Building and Deploying Community Nanotechnology Software Tools on nanoHUB.org (S Ahmed et al.); Positive Magneto-Resistance in a Point Contact: Possible Manifestation of Interactions (V T Renard et al.); Impact of Intrinsic Parameter Fluctuations in Nano-CMOS Devices on Circuits and Systems (S Roy et al.); HEMT-Based Nanometer Devices Toward Terahertz Era (E Sano & T Otsuji); Plasma Waves in Two-Dimensional Electron Systems and Their Applications (V Ryzhii et al.); Resonant Terahertz Detection Antenna Utilizing Plasma Oscillations in Lateral Schottky Diode (A Satou et al.); Terahertz Polarization Controller Based on Electronic Dispersion Control of 2D Plasmons (T Nishimura & T Otsuji); Higher-Order Plasmon Resonances in GaN-Based Field-Effect Transistor Arrays (V V Popov et al.); Ultra-Highly Sensitive Terahertz Detection Using Carbon-Nanotube Quantum Dots (Y Kawano et al.); Generation of Ultrashort Electron Bunches in Nanostructures by Femtosecond Laser Pulses (A Gladun et al.); Characterization of Voltage-Controlled Oscillator Using RTD Transmission Line (K Narahara et al.); Infrared Quantum-Dot Detectors with Diffusion-Limited Capture (N Vagidov et al.); Magnetoresistance in Fe/MgO/Fe Magentic Tunnel Junctions (N N Beleskii et al.); Modeling and Implementation of Spin-Based Quantum Computation (M E Hawley et al.); Quantum Engineering for Threat Reduction and Homeland Security (G P Berman et al.); Strong Phase Shift Mask Manufacturing Error Impact on the 65nm Poly Line Printability (N Belova). Readership: Academics, graduate and postgraduate students in the field of physics and modeling of novel electronics and optoelectronic devices.
With the increasing demand for smaller, faster, and more highly integrated optical and electronic devices, as well as extremely sensitive detectors for biomedical and environmental applications, a field called nano-optics or nano-photonics/electronics is emerging – studying the many promising optical properties of nanostructures. Like nanotechnology itself, it is a rapidly evolving and changing field – but because of strong research activity in optical communication and related devices, combined with the intensive work on nanotechnology, nano-optics is shaping up fast to be a field with a promising future. This book serves as a one-stop review of modern nano-optical/photonic and nano-electronic techniques, applications, and developments. - Provides overview of the field of Nano-optics/photonics and electronics, detailing practical examples of photonic technology in a wide range of applications - Discusses photonic systems and devices with mathematical rigor precise enough for design purposes - A one-stop review of modern nano-optical/photonic and nano-electronic techniques, applications, and developments
Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.
