Advances in Rapid Thermal and Integrated Processing
Advances in Rapid Thermal and Integrated Processing

Author: F. Roozeboom

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 568

ISBN-13: 9401587116

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Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

Science and Technology of Rapid Solidification and Processing
Science and Technology of Rapid Solidification and Processing

Author: M.A. Otooni

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 384

ISBN-13: 9401102236

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This book represents a collection of papers presented at the NATO Advanced Research Workshop (NATO/ARW) on "Science and Technology of Rapid Solidification and Processing", held at Hotel Thayer, West Point Military Academy, New York, N. Y. , during June 21-24, 1994. The workshop was attended by over forty scientists representing several NATO member countries as well as representatives from Japan, China (PRC), Taiwan and India. The purpose of this NATO/ARW conference was to review the major advances made in most recent years in both the theoretical and experimental areas of rapid solidification technology and processing. In accordance with the NATO/ARW format, the agenda for the conference was so arranged to offer in depth presentation of the latest developments in the subject area as well as to encourage follow-up discussions by the participants. There was seven sessions each opened with a lecture by an invited guest speaker. Sessions 1-4, covered two days of the conference and focused mainly on Processing Technologies of Rapid Solidification and Thermodynamic Properties (Practical Applications). Sessions 4-6 concentrated on Thermodynamics of Metastable Alloys, Relaxation, Diffusion, Magnetic and Electric Properties (Fundamentals). Session 6 was devoted to the Structural Characterization of Supercooled Melts, Ultra Fine Polycrystalline Materials (New Innovations and Techniques). There were two equally important aspects of this NATO/ARW conference which must be mentioned. Firstly, this is the first NATO/ARW conference on Science and Technology of Rapid Solidification and Processing held in the United States.

Rapid Thermal Processing of Semiconductors
Rapid Thermal Processing of Semiconductors

Author: Victor E. Borisenko

Publisher: Springer Science & Business Media

Published: 2013-11-22

Total Pages: 374

ISBN-13: 1489918043

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Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.

Rapid Thermal Processing
Rapid Thermal Processing

Author: Richard B. Fair

Publisher: Academic Press

Published: 2012-12-02

Total Pages: 441

ISBN-13: 0323139809

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This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.

Rapid Thermal and Other Short-time Processing Technologies
Rapid Thermal and Other Short-time Processing Technologies

Author: Fred Roozeboom

Publisher: The Electrochemical Society

Published: 2000

Total Pages: 482

ISBN-13: 9781566772747

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The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.

Chemical Abstracts Service Source Index
Chemical Abstracts Service Source Index

Author: American Chemical Society. Chemical Abstracts Service

Publisher:

Published: 1907

Total Pages: 2064

ISBN-13:

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A key source to journal and conference abbreviations in the sciences. Although it focuses on chemistry, other scientific and engineering disciplines are also well represented. In addition to the abbreviation and full title, each entry also contains publishing info, title changes, language and frequency of publication, and libraries owning that title. Over 130,000 entries representing more than 70,000 publications dating back to 1907 are included.