Semiconductor Power Devices
Semiconductor Power Devices

Author: Josef Lutz

Publisher: Springer Science & Business Media

Published: 2011-01-15

Total Pages: 539

ISBN-13: 3642111254

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Semiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device production technology. In practice, not only the semiconductor, but also the thermal and mechanical properties of packaging and interconnection technologies are essential to predict device behavior in circuits. Wear and aging mechanisms are identified and reliability analyses principles are developed. Unique information on destructive mechanisms, including typical failure pictures, allows assessment of the ruggedness of power devices. Also parasitic effects, such as device induced electromagnetic interference problems, are addressed. The book concludes with modern power electronic system integration techniques and trends.

3D Microelectronic Packaging
3D Microelectronic Packaging

Author: Yan Li

Publisher: Springer

Published: 2017-01-20

Total Pages: 465

ISBN-13: 3319445863

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Next Generation HALT and HASS
Next Generation HALT and HASS

Author: Kirk A. Gray

Publisher: John Wiley & Sons

Published: 2016-03-08

Total Pages: 296

ISBN-13: 1118700201

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Next Generation HALT and HASS presents a major paradigm shift from reliability prediction-based methods to discovery of electronic systems reliability risks. This is achieved by integrating highly accelerated life test (HALT) and highly accelerated stress screen (HASS) into a physics-of-failure-based robust product and process development methodology. The new methodologies challenge misleading and sometimes costly mis-application of probabilistic failure prediction methods (FPM) and provide a new deterministic map for reliability development. The authors clearly explain the new approach with a logical progression of problem statement and solutions. The book helps engineers employ HALT and HASS by illustrating why the misleading assumptions used for FPM are invalid. Next, the application of HALT and HASS empirical discovery methods to quickly find unreliable elements in electronics systems gives readers practical insight to the techniques. The physics of HALT and HASS methodologies are highlighted, illustrating how they uncover and isolate software failures due to hardware-software interactions in digital systems. The use of empirical operational stress limits for the development of future tools and reliability discriminators is described. Key features: * Provides a clear basis for moving from statistical reliability prediction models to practical methods of insuring and improving reliability. * Challenges existing failure prediction methodologies by highlighting their limitations using real field data. * Explains a practical approach to why and how HALT and HASS are applied to electronics and electromechanical systems. * Presents opportunities to develop reliability test discriminators for prognostics using empirical stress limits. * Guides engineers and managers on the benefits of the deterministic and more efficient methods of HALT and HASS. * Integrates the empirical limit discovery methods of HALT and HASS into a physics of failure based robust product and process development process.

Humidity and Electronics
Humidity and Electronics

Author: Rajan Ambat

Publisher: Woodhead Publishing

Published: 2021-11-30

Total Pages: 399

ISBN-13: 0323908543

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Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. - Provides basic and applied knowledge surrounding corrosion in electronics - Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms - Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level

Communication in Transportation Systems
Communication in Transportation Systems

Author: Strobel, Otto

Publisher: IGI Global

Published: 2013-02-28

Total Pages: 483

ISBN-13: 1466629770

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Typically, communication technology breakthroughs and developments occur for the purposes of home, work, or cellular and mobile networks. Communications in transportation systems are often overlooked, yet they are equally as important. Communication in Transportation Systems brilliantly bridges theoretical knowledge and practical applications of cutting-edge technologies for communication in automotive applications. This reference source carefully covers innovative technologies which will continue to advance transportation systems. Researchers, developers, scholars, engineers, and graduate students in the transportation and automotive system, communication, electrical, and information technology fields will especially benefit from this advanced publication.

Power Electronics for the Next Generation Wind Turbine System
Power Electronics for the Next Generation Wind Turbine System

Author: Ke Ma

Publisher: Springer

Published: 2015-07-25

Total Pages: 198

ISBN-13: 3319212486

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This book presents recent studies on the power electronics used for the next generation wind turbine system. Some criteria and tools for evaluating and improving the critical performances of the wind power converters have been proposed and established. The book addresses some emerging problems as well as possibilities for the wind power conversion, and may be useful as an inspiring reference for the researchers in this field.

Electronic Components and Systems
Electronic Components and Systems

Author: W. H. Dennis

Publisher: Elsevier

Published: 2013-10-22

Total Pages: 273

ISBN-13: 148310334X

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Electronic Components and Systems focuses on the principles and processes in the field of electronics and the integrated circuit. Covered in the book are basic aspects and physical fundamentals; different types of materials involved in the field; and passive and active electronic components such as capacitors, inductors, diodes, and transistors. Also covered in the book are topics such as the fabrication of semiconductors and integrated circuits; analog circuitry; digital logic technology; and microprocessors. The monograph is recommended for beginning electrical engineers who would like to know the fundamental concepts, theories, and processes in the related fields.

Automotive Embedded Systems Handbook
Automotive Embedded Systems Handbook

Author: Nicolas Navet

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 566

ISBN-13: 1351838199

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A Clear Outline of Current Methods for Designing and Implementing Automotive Systems Highlighting requirements, technologies, and business models, the Automotive Embedded Systems Handbook provides a comprehensive overview of existing and future automotive electronic systems. It presents state-of-the-art methodological and technical solutions in the areas of in-vehicle architectures, multipartner development processes, software engineering methods, embedded communications, and safety and dependability assessment. Divided into four parts, the book begins with an introduction to the design constraints of automotive-embedded systems. It also examines AUTOSAR as the emerging de facto standard and looks at how key technologies, such as sensors and wireless networks, will facilitate the conception of partially and fully autonomous vehicles. The next section focuses on networks and protocols, including CAN, LIN, FlexRay, and TTCAN. The third part explores the design processes of electronic embedded systems, along with new design methodologies, such as the virtual platform. The final section presents validation and verification techniques relating to safety issues. Providing domain-specific solutions to various technical challenges, this handbook serves as a reliable, complete, and well-documented source of information on automotive embedded systems.