ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

Author:

Publisher: ASM International

Published: 2019-12-01

Total Pages: 540

ISBN-13: 1627082735

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The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

Author: ASM International

Publisher: ASM International

Published: 2018-12-01

Total Pages: 593

ISBN-13: 1627080996

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The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Failure Analysis of Integrated Circuits
Failure Analysis of Integrated Circuits

Author: Lawrence C. Wagner

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 256

ISBN-13: 1461549191

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This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.