Diamond Materials VI

Diamond Materials VI

Author: Jimmy Lee Davidson

Publisher: The Electrochemical Society

Published: 2000

Total Pages: 554

ISBN-13: 9781566772556

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"The sixth International Symposium on Diamond Materials was held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii from Ooctober 17 to October 22, 1999"--Pref.


Power Electronics Device Applications of Diamond Semiconductors

Power Electronics Device Applications of Diamond Semiconductors

Author: Satoshi Koizumi

Publisher: Woodhead Publishing

Published: 2018-06-29

Total Pages: 468

ISBN-13: 0081021844

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Power Electronics Device Applications of Diamond Semiconductors presents state-of-the-art research on diamond growth, doping, device processing, theoretical modeling and device performance. The book begins with a comprehensive and close examination of diamond crystal growth from the vapor phase for epitaxial diamond and wafer preparation. It looks at single crystal vapor deposition (CVD) growth sectors and defect control, ultra high purity SC-CVD, SC diamond wafer CVD, heteroepitaxy on Ir/MqO and needle-induced large area growth, also discussing the latest doping and semiconductor characterization methods, fundamental material properties and device physics. The book concludes with a discussion of circuits and applications, featuring the switching behavior of diamond devices and applications, high frequency and high temperature operation, and potential applications of diamond semiconductors for high voltage devices. - Includes contributions from today's most respected researchers who present the latest results for diamond growth, doping, device fabrication, theoretical modeling and device performance - Examines why diamond semiconductors could lead to superior power electronics - Discusses the main challenges to device realization and the best opportunities for the next generation of power electronics


Ceramic Materials And Components For Engines - Proceedings Of The 5th International Symposium

Ceramic Materials And Components For Engines - Proceedings Of The 5th International Symposium

Author: X R Fu

Publisher: World Scientific

Published: 1995-03-31

Total Pages: 890

ISBN-13: 9814550361

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The 5th of a prestigious series of conferences, these proceedings are devoted to the latest achievements in ceramic materials and components for engines. Their purpose is to advance structural ceramics and ceramic engine technology on a worldwide scale and provide a state-of-the-art survey of this increasingly important field. The papers presented cover many aspects from basic research and development to production, properties and applications. These proceedings will be of interest to ceramists and mechanical engineers concerned with the potential use of ceramic components in engines.


Extreme Environment Electronics

Extreme Environment Electronics

Author: John D. Cressler

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 1041

ISBN-13: 143987431X

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Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.


Comprehensive Hard Materials

Comprehensive Hard Materials

Author: Daniele Mari

Publisher: Newnes

Published: 2014-02-01

Total Pages: 1809

ISBN-13: 0080965288

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Comprehensive Hard Materials, Three Volume Set deals with the production, uses and properties of the carbides, nitrides and borides of these metals and those of titanium, as well as tools of ceramics, the superhard boron nitrides and diamond and related compounds. Articles include the technologies of powder production (including their precursor materials), milling, granulation, cold and hot compaction, sintering, hot isostatic pressing, hot-pressing, injection moulding, as well as on the coating technologies for refractory metals, hard metals and hard materials. The characterization, testing, quality assurance and applications are also covered. Comprehensive Hard Materials provides meaningful insights on materials at the leading edge of technology. It aids continued research and development of these materials and as such it is a critical information resource to academics and industry professionals facing the technological challenges of the future. Hard materials operate at the leading edge of technology, and continued research and development of such materials is critical to meet the technological challenges of the future. Users of this work can improve their knowledge of basic principles and gain a better understanding of process/structure/property relationships. With the convergence of nanotechnology, coating techniques, and functionally graded materials to the cognitive science of cemented carbides, cermets, advanced ceramics, super-hard materials and composites, it is evident that the full potential of this class of materials is far from exhausted. This work unites these important areas of research and will provide useful insights to users through its extensive cross-referencing and thematic presentation. To link academic to industrial usage of hard materials and vice versa, this work deals with the production, uses and properties of the carbides, nitrides and borides of these metals and those of titanium, as well as tools of ceramics, the superhard boron nitrides and diamond and related compounds.


Silicon Carbide, Volume 2

Silicon Carbide, Volume 2

Author: Peter Friedrichs

Publisher: John Wiley & Sons

Published: 2011-04-08

Total Pages: 520

ISBN-13: 9783527629084

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Silicon Carbide - this easy to manufacture compound of silicon and carbon is said to be THE emerging material for applications in electronics. High thermal conductivity, high electric field breakdown strength and high maximum current density make it most promising for high-powered semiconductor devices. Apart from applications in power electronics, sensors, and NEMS, SiC has recently gained new interest as a substrate material for the manufacture of controlled graphene. SiC and graphene research is oriented towards end markets and has high impact on areas of rapidly growing interest like electric vehicles. This volume is devoted to high power devices products and their challenges in industrial application. Readers will benefit from reports on development and reliability aspects of Schottky barrier diodes, advantages of SiC power MOSFETs, or SiC sensors. The authors discuss MEMS and NEMS as SiC-based electronics for automotive industry as well as SiC-based circuit elements for high temperature applications, and the application of transistors in PV-inverters. The list of contributors reads like a "Who's Who" of the SiC community, strongly benefiting from collaborations between research institutions and enterprises active in SiC crystal growth and device development. Among the former are CREE Inc. and Fraunhofer ISE, while the industry is represented by Toshiba, Nissan, Infineon, NASA, Naval Research Lab, and Rensselaer Polytechnic Institute, to name but a few.