This issue of ECS Transactions is a compilation of papers presented at the 218th Meeting of the Electrochemical Society, held in Las Vegas from October 10 - 15, 2010. The papers presented covered the research and development in the field of chemical (gas, ion, bio and other) sensors, including molecular recognition surface, transduction methods, and integrated and micro sensor systems, as well as all aspects of MEMS/NEMS technology, including micro/nanomachining, fabrication processes, packaging, and the application of these structures and processes to the miniaturization of chemical sensors, physical sensors, biosensors, miniature chemical analysis systems and other devices.
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
The first volume of The Handbook of Humidity Measurement focuses on the review of devices based on optical principles of measurement such as optical UV, fluorescence hygrometers, optical and fiber-optic sensors of various types. Numerous methods for monitoring the atmosphere have been developed in recent years, based on measuring the absorption of electromagnetic field in different spectral ranges. These methods, covering the optical (FTIR and Lidar techniques), as well as a microwave and THz ranges are discussed in detail in this volume. The role of humidity-sensitive materials in optical and fiber-optic sensors is also detailed. This volume describes the reasons for controlling the humidity, features of water and water vapors, and units used for humidity measurement.
Noise pollution is one of the factors that affect the quality of life of the general population, especially in urban areas, where the noise levels are often high due to the presence of numerous sources, such as transport infrastructures, activities production and commercial areas, entertainment venues and other sound sources which, although temporary, such as construction sites and outdoor music events, affect general noise levels. Even if noise is one of the oldest pollutants referred to in history, for years, the problem of noise pollution has been often considered less important than others related to the environment, such as air pollution, water pollution, and waste management.The regulations in force to contain the noise have become increasingly stringent as each individual is constantly exposed to noise and often the noise is treated just as a scourge of modern society. Making noise is becoming easier and cheaper each day, but just the opposite for controlling it. Deeper studies are needed to understand the core of current noise problems; new materials and techniques are needed to control them. This book is a combination of theory and practice based on the latest research. The studies in this book range from evaluation methods for the perception of noise and outline forecast criteria that can be integrated with applications for acoustic mapping as well as the use of innovative techniques and materials for its abatement. The main purpose of this book, organized in 8 chapters, is to provide an overview of the recent studies in this field and the applications in different research studies. The authors, contributing to the success of this book, provide a series of practical applications of their recent studies aimed at the reduction of noise in different environments. The editors would like to thank all the authors who, through their studies and research, have accepted our invitation to share recent discoveries in this field with the scientific community.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Semiannual, with semiannual and annual indexes. References to all scientific and technical literature coming from DOE, its laboratories, energy centers, and contractors. Includes all works deriving from DOE, other related government-sponsored information, and foreign nonnuclear information. Arranged under 39 categories, e.g., Biomedical sciences, basic studies; Biomedical sciences, applied studies; Health and safety; and Fusion energy. Entry gives bibliographical information and abstract. Corporate, author, subject, report number indexes.
