Proceedings of the 3rd ASME Integrated Nanosystems Conference
Author:
Publisher: American Society of Mechanical Engineers
Published: 2004
Total Pages: 164
ISBN-13:
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Author:
Publisher: American Society of Mechanical Engineers
Published: 2004
Total Pages: 164
ISBN-13:
DOWNLOAD EBOOKAuthor: Asme Conference Proceedings
Publisher: American Society of Mechanical Engineers
Published: 2004-01-01
Total Pages:
ISBN-13: 9780791837498
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Publisher:
Published: 2005
Total Pages: 132
ISBN-13:
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Publisher: American Society of Mechanical Engineers
Published: 2005-01-01
Total Pages: 106
ISBN-13: 9780791842089
DOWNLOAD EBOOKAuthor: Akira Fujishima
Publisher: John Wiley & Sons
Published: 2023-05-03
Total Pages: 1098
ISBN-13: 3527824855
DOWNLOAD EBOOKHandbook of Self-Cleaning Surfaces and Materials The first truly comprehensive work on this rapidly developing field in two volumes Self-cleaning surfaces are those that can be cleaned, for instance, by sun or rainwater, without human intervention. They are sometimes found in nature but developing man-made equivalents has been a major area of nanotechnology research in recent years. Self-cleaning tiles, glasses, paints, and textiles have been developed to date, and the number of applications for this technology is growing. Handbook of Self-Cleaning Surfaces and Materials provides a comprehensive overview of this field of study. It includes two volumes, with the first presenting the basic principles of the field and the second supplying specific examples and applications. It is a one-stop shop for anyone looking to familiarize themselves with this area of technological research, as well as for existing professionals who want a handy and thorough reference. Readers of the Handbook of Self-Cleaning Surfaces and Materials will also find: An editor and contributor team with decades of experience in both academic and industrial research Detailed treatment of subjects including TiO2 photocatalysis, hydrophobic self-cleaning surfaces, and more Figures throughout illustrating important concepts and chemical formulas Handbook of Self-Cleaning Surfaces and Materials is an essential resource for researchers and industry professionals in chemistry, surface physics, and materials science.
Author: Sujeet K. Sinha
Publisher: Springer Science & Business Media
Published: 2013-08-27
Total Pages: 276
ISBN-13: 3642369359
DOWNLOAD EBOOKThis book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.
Author: L. P. Deshmukh
Publisher:
Published: 2018
Total Pages:
ISBN-13: 9780735417052
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Publisher:
Published: 2012
Total Pages:
ISBN-13:
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Publisher:
Published: 2022
Total Pages: 0
ISBN-13: 9780791886298
DOWNLOAD EBOOKAuthor: Yung-cheng Lee
Publisher: World Scientific
Published: 2018-01-03
Total Pages: 363
ISBN-13: 9813229373
DOWNLOAD EBOOKMEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.