Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.
Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
This book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable electronic equipment. Adequate information is provided for designing computerized reliability database system to support the application of the techniques by designers. Pedantic terms and the associated mathematics of reliability engineering discipline are excluded for the benefit of comprehensiveness and practical applications. This book offers excellent support for electrical and electronics engineering students and professionals, bridging academic curriculum with industrial expectations.
This classic textbook/reference contains a complete integration of the processes which influence quality and reliability in product specification, design, test, manufacture and support. Provides a step-by-step explanation of proven techniques for the development and production of reliable engineering equipment as well as details of the highly regarded work of Taguchi and Shainin. New to this edition: over 75 pages of self-assessment questions plus a revised bibliography and references. The book fulfills the requirements of the qualifying examinations in reliability engineering of the Institute of Quality Assurance, UK and the American Society of Quality Control.
A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers. This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers? attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal. Revolutionary in focus, as it describes how to achieve failure free performance rather than how to predict an acceptable performance failure rate (reliability technology rather than reliability engineering) Author has over 40 years experience in the field, and the text is based on classroom tested notes from the reliability technology course he taught at Massachusetts Institute of Technology (MIT), USA Contains graphical interpretations of mathematical models together with diagrams, tables of physical constants, case studies and unique worked examples
Authored by a practicing reliability engineer with over 25 years of experience, this book provides useful insights and a practical analysis that can be used to deal with reliability problems in designs. Practical Reliability Analysis makes use of both case studies and illustrative examples to teach readers through the use of practical applications. Features include: Case studies--provide practical applications of problem-solving techniques Mathematical analysis--demonstrates useful applications of statistical analysis in reliability problems Pictorial description of mechanical reliability--demonstrates common mechanical failures of electrical components Confidence limits--uses graphical examples to make this difficult subject clear
Next Generation HALT and HASS presents a major paradigm shift from reliability prediction-based methods to discovery of electronic systems reliability risks. This is achieved by integrating highly accelerated life test (HALT) and highly accelerated stress screen (HASS) into a physics-of-failure-based robust product and process development methodology. The new methodologies challenge misleading and sometimes costly mis-application of probabilistic failure prediction methods (FPM) and provide a new deterministic map for reliability development. The authors clearly explain the new approach with a logical progression of problem statement and solutions. The book helps engineers employ HALT and HASS by illustrating why the misleading assumptions used for FPM are invalid. Next, the application of HALT and HASS empirical discovery methods to quickly find unreliable elements in electronics systems gives readers practical insight to the techniques. The physics of HALT and HASS methodologies are highlighted, illustrating how they uncover and isolate software failures due to hardware-software interactions in digital systems. The use of empirical operational stress limits for the development of future tools and reliability discriminators is described. Key features: * Provides a clear basis for moving from statistical reliability prediction models to practical methods of insuring and improving reliability. * Challenges existing failure prediction methodologies by highlighting their limitations using real field data. * Explains a practical approach to why and how HALT and HASS are applied to electronics and electromechanical systems. * Presents opportunities to develop reliability test discriminators for prognostics using empirical stress limits. * Guides engineers and managers on the benefits of the deterministic and more efficient methods of HALT and HASS. * Integrates the empirical limit discovery methods of HALT and HASS into a physics of failure based robust product and process development process.
