Power Integrity for Nanoscale Integrated Systems
Power Integrity for Nanoscale Integrated Systems

Author: Masanori Hashimoto

Publisher: McGraw Hill Professional

Published: 2014-03-07

Total Pages: 417

ISBN-13: 0071787771

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Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery

e-Learning, e-Education, and Online Training
e-Learning, e-Education, and Online Training

Author: Guanglu Sun

Publisher: Springer Nature

Published: 2019-11-18

Total Pages: 449

ISBN-13: 3030350959

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This book constitutes the proceedings of the 5th International Conference on e-Learning, e-Education, and Online Training, eLEOT 2019, held in Kunming, China, in August 2019. The 46 revised full papers presented were carefully reviewed and selected from 99 submissions. They focus on most recent and innovative trends in this broad area, ranging from distance education to collaborative learning, from interactive learning environments to the modelling of STEM (Science, Technology, Mathematics, Engineering) curricula.

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Author: Yue Ma

Publisher: CRC Press

Published: 2019-03-08

Total Pages: 279

ISBN-13: 0429680066

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As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Power Integrity Analysis and Management for Integrated Circuits
Power Integrity Analysis and Management for Integrated Circuits

Author: Raj Nair

Publisher: Prentice-Hall PTR

Published: 2010

Total Pages: 0

ISBN-13: 9780137011223

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As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. --

Electrical Modeling and Design for 3D System Integration
Electrical Modeling and Design for 3D System Integration

Author: Er-Ping Li

Publisher: John Wiley & Sons

Published: 2012-03-19

Total Pages: 394

ISBN-13: 1118166744

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New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Circuits at the Nanoscale
Circuits at the Nanoscale

Author: Krzysztof Iniewski

Publisher: CRC Press

Published: 2018-10-08

Total Pages: 669

ISBN-13: 1351834657

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Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

Peterson's Graduate Programs in Engineering & Applied Sciences, Aerospace/Aeronautical Engineering, Agricultural Engineering & Bioengineering, and Architectural Engineering 2011
Peterson's Graduate Programs in Engineering & Applied Sciences, Aerospace/Aeronautical Engineering, Agricultural Engineering & Bioengineering, and Architectural Engineering 2011

Author: Peterson's

Publisher: Peterson's

Published: 2011-05-01

Total Pages: 288

ISBN-13: 0768934796

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Peterson's Graduate Programs in Engineering & Applied Sciences, Aerospace/Aeronautical Engineering, Agricultural Engineering & Bioengineering, and Architectural Engineering contains a wealth of information on colleges and universities that offer graduate work these exciting fields. The institutions listed include those in the United States and Canada, as well as international institutions that are accredited by U.S. accrediting bodies. Up-to-date information, collected through Peterson's Annual Survey of Graduate and Professional Institutions, provides valuable information on degree offerings, professional accreditation, jointly offered degrees, part-time and evening/weekend programs, postbaccalaureate distance degrees, faculty, students, degree requirements, entrance requirements, expenses, financial support, faculty research, and unit head and application contact information. Readers will find helpful links to in-depth descriptions that offer additional detailed information about a specific program or department, faculty members and their research, and much more. In addition, there are valuable articles on financial assistance, the graduate admissions process, advice for international and minority students, and facts about accreditation, with a current list of accrediting agencies.

Power Integrity Analysis and Management for Integrated Circuits (paperback)
Power Integrity Analysis and Management for Integrated Circuits (paperback)

Author: Raj Nair

Publisher: Prentice Hall

Published: 2010-05-07

Total Pages: 432

ISBN-13: 9780134185958

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New Techniques and Tools for Ensuring On-Chip Power Integrity--Down to Nanoscale As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. Raj Nair and Dr. Donald Bennett first provide a complete foundational understanding of power integrity, including ULSI issues, practical aspects of power delivery, and the benefits of a total power integrity approach to optimizing chip physical designs. They introduce advanced power distribution network modeling, design, and analysis techniques that highlight abstraction and physics-based analysis, while also incorporating traditional circuit- and field-solver based approaches. They also present advanced techniques for floorplanning and power integrity management, and help designers anticipate emerging challenges associated with increased integration. Anasim RLCSim.exe, a new tool for power integrity aware floorplanning, is downloadable for free atanasim.com/category/software. The authors Systematically explore power integrity implications, analysis, and management for integrated circuits Present practical examples and industry best practices for a broad spectrum of chip design applications Discuss distributed and high-bandwidth voltage regulation, differential power path design, and the significance of on-chip inductance to power integrity Review both traditional and advanced modeling techniques for integrated circuit power integrity analysis, and introduce continuum modeling Explore chip, package, and board interactions for power integrity and EMI, and bring together industry best practices and examples Introduce advanced concepts for power integrity management, including non-linear capacitance devices, impedance modulation, and active noise regulation Power Integrity Analysis and Management for Integrated Circuits ' coverage of both fundamentals and advanced techniques will make this book indispensable to all engineers responsible for signal integrity, power integrity, hardware, or system design--especially those working at the nanoscale level.

Nano and Molecular Electronics Handbook
Nano and Molecular Electronics Handbook

Author: Sergey Edward Lyshevski

Publisher: CRC Press

Published: 2018-10-03

Total Pages: 912

ISBN-13: 1420008145

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There are fundamental and technological limits of conventional microfabrication and microelectronics. Scaling down conventional devices and attempts to develop novel topologies and architectures will soon be ineffective or unachievable at the device and system levels to ensure desired performance. Forward-looking experts continue to search for new paradigms to carry the field beyond the age of microelectronics, and molecular electronics is one of the most promising candidates. The Nano and Molecular Electronics Handbook surveys the current state of this exciting, emerging field and looks toward future developments and opportunities. Molecular and Nano Electronics Explained Explore the fundamentals of device physics, synthesis, and design of molecular processing platforms and molecular integrated circuits within three-dimensional topologies, organizations, and architectures as well as bottom-up fabrication utilizing quantum effects and unique phenomena. Technology in Progress Stay current with the latest results and practical solutions realized for nanoscale and molecular electronics as well as biomolecular electronics and memories. Learn design concepts, device-level modeling, simulation methods, and fabrication technologies used for today's applications and beyond. Reports from the Front Lines of Research Expert innovators discuss the results of cutting-edge research and provide informed and insightful commentary on where this new paradigm will lead. The Nano and Molecular Electronics Handbook ranks among the most complete and authoritative guides to the past, present, and future of this revolutionary area of theory and technology.

Intelligent System and Computing
Intelligent System and Computing

Author: Yang Yi

Publisher: BoD – Books on Demand

Published: 2020-04-29

Total Pages: 296

ISBN-13: 1838805222

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The book “Intelligent System and Computing” reports the theory, mathematical models, algorithms, design methods, and applications of intelligent systems and computing. It covers various disciplines including computer and information science, electrical and computer engineering, natural sciences, economics, and neuroscience. The broad-ranging discussion covers the key disciplines in computational science and artificial intelligence as well as advances in neuromorphic computing, deep learning, the Internet of Things, computer vision, and many others. This volume provides both academics and professionals with a comprehensive overview of the field and presents areas for future research.