The fully updated single-source guide to creating successful packaging designs for consumer products Now in full-color throughout, Packaging Design, Second Edition has been fully updated to secure its place as the most comprehensive resource of professional information for creating packaging designs that serve as the marketing vehicles for consumer products. Packed with practical guidance, step-by-step descriptions of the creative process, and all-important insights into the varying perspectives of the stakeholders, the design phases, and the production process, this book illuminates the business of packaging design like no other. Whether you're a designer, brand manager, or packaging manufacturer, the highly visual coverage in Packaging Design will be useful to you, as well as everyone else involved in the process of marketing consumer products. To address the most current packaging design objectives, this new edition offers: Fully updated coverage (35 percent new or updated) of the entire packaging design process, including the business of packaging design, terminology, design principles, the creative process, and pre-production and production issues A new chapter that puts packaging design in the context of brand and business strategies A new chapter on social responsibility and sustainability All new case studies and examples that illustrate every phase of the packaging design process A history of packaging design covered in brief to provide a context and framework for today's business Useful appendices on portfolio preparation for the student and the professional, along with general legal and regulatory issues and professional practice guidelines
A comprehensive reference volume, this book provides readers with a thoughtful packaging primer that covers the challenges of designing packaging for a competitive market in a very hardworking and relevant way.
Apply design principles to your classes, preparing them for reuse. You will use package design principles to create packages that are just right in terms of cohesion and coupling, and are user- and maintainer-friendly at the same time. The first part of this book walks you through the five SOLID principles that will help you improve the design of your classes. The second part introduces you to the best practices of package design, and covers both package cohesion principles and package coupling principles. Cohesion principles show you which classes should be put together in a package, when to split packages, and if a combination of classes may be considered a "package" in the first place. Package coupling principles help you choose the right dependencies and prevent wrong directions in the dependency graph of your packages. What You'll LearnApply the SOLID principles of class designDetermine if classes belong in the same packageKnow whether it is safe for packages to depend on each other Who This Book Is For Software developers with a broad range of experience in the field, who are looking for ways to reuse,share, and distribute their code
Packaging Sustainability Take the lead with sustainable package design solutions The classic role of packaging is to “Protect, Inform, and Sell.” Today, packaging must do all that—but with minimal eco-impact. Packaging Sustainability: Tools, Systems, and Strategies for Innovative Package Design is a comprehensive guide to thinking outside the box to create practical, cost-effective, and eco-responsible packaging. With a broad range of contributions from pioneers of sustainability, Packaging Sustainability not only describes the concepts of sustainability but reveals the logic behind them, providing you with the tools to sift through and adapt to the ever changing barrage of materials, services, regulations, and mandates. The book: Enables the designer to make smart, informed decisions at all points throughout the packaging design process Offers a comprehensive overview of sustainable packaging design issues from leading practitioners, designers, engineers, marketers, psychologists, and ecologists Describes materials and processes in current use and helps the reader understand how they interconnect With solid information and actionable ideas, Packaging Sustainability gives you all the tools for maximizing a product’s shelf impact—while minimizing its ecological footprint.
Packaging today needs to do so much more than preserving, protecting, and promoting the products it contains. Therise of environmental issues and globalization mean that today's packaging designers must create innovative solutions that are also sustainable. This book shows how packaging design has changed to meet the demands of this new context. It takes the reader behind some of the worlds best-known brands to meet the designers, clients, marketers, technologists, environmentalists, and retailers, to tell their stories about the development of some of the most remarkable packs of our time. Showcasing the best packaging design from around the world, and presented through new color photography, the book also features in-depth case studies of some of the most innovative design processes with interviews and illustrated details.
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
noAH VIII presents its most extraordinary collection of international packaging work to date. A stunning assortment of the best package design from around the world. Contents include: Directory of International Package Design; 26 Participating Countries; 47 Renowned Design Companies. 700 colour illustrations
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.
