NRL MODULAR ELECTRONIC PACKAGING.
NRL MODULAR ELECTRONIC PACKAGING.

Author: NAVAL RESEARCH LAB WASHINGTON D C.

Publisher:

Published: 1967

Total Pages: 111

ISBN-13:

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Contents: Module design; Connectors; Racks; Cabinets; Interconnections; Heat exchanger; and Future development.

Electronic Packaging
Electronic Packaging

Author: J. W. Klapheke

Publisher:

Published: 1966

Total Pages: 104

ISBN-13:

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This annotated bibliography of selected reports, journal articles, and manufacturers' literature on electronic packaging provides a literature basis for electronic packaging engineers to design moer reliable, maintainable, and adaptable electronic equipment for aerospace application. Subject indexing is provided by properties and environmental effects on packaging materials, discrete parts to module packaging, module packing to assembly, housing and mounting, packaging products, and interconnection techniques. Author and corporate author indexes are included. (Author, modified) INCLUDED. (Author, modified-PL).

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Author: Hengyun Zhang

Publisher: Woodhead Publishing

Published: 2019-11-14

Total Pages: 436

ISBN-13: 0081025335

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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging

Electronic Packaging
Electronic Packaging

Author: John H. Lau

Publisher: McGraw-Hill Professional Publishing

Published: 1998

Total Pages: 0

ISBN-13: 9780070371354

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Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Scientific and Technical Aerospace Reports
Scientific and Technical Aerospace Reports

Author:

Publisher:

Published: 1995

Total Pages: 602

ISBN-13:

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Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.