Noise Coupling in System-on-Chip
Noise Coupling in System-on-Chip

Author: Thomas Noulis

Publisher: CRC Press

Published: 2018-01-09

Total Pages: 519

ISBN-13: 1138031615

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Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

Substrate Noise Coupling in Mixed-Signal ASICs
Substrate Noise Coupling in Mixed-Signal ASICs

Author: Stéphane Donnay

Publisher: Springer Science & Business Media

Published: 2006-05-31

Total Pages: 311

ISBN-13: 0306481707

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This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.

Substrate Noise Coupling in RFICs
Substrate Noise Coupling in RFICs

Author: Ahmed Helmy

Publisher: Springer Science & Business Media

Published: 2008-03-23

Total Pages: 129

ISBN-13: 1402081669

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The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.

Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs
Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs

Author: X. Aragones

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 242

ISBN-13: 1475730136

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Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.

Measurement, Suppression, and Prediction of Digital Switching Noise Coupling in Mixed-signal System-on-chip Applications
Measurement, Suppression, and Prediction of Digital Switching Noise Coupling in Mixed-signal System-on-chip Applications

Author: Cosmin Iorga

Publisher:

Published: 2007

Total Pages: 268

ISBN-13: 9781109918014

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The suppression work proposes active noise cancellation structures that can be used in addition to conventional guard ring methods. Coupling reduction for NMOS in common-source amplifier of 8.8 times has been achieved at 10 MHz sinusoidal substrate noise. Coupling reduction for NMOS common source with degeneration of 56 times has been achieved at 10 MHz. Ring oscillator sideband suppression of 25 dB has been achieved at 1 MHz sinusoidal substrate noise for differential delay cells with noise cancellation.

Noise Coupling Analysis for Mixed Signal Systems
Noise Coupling Analysis for Mixed Signal Systems

Author: Jae Wook Kim

Publisher:

Published: 2012

Total Pages:

ISBN-13:

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Trends toward portable electronics are leading forces in developing new systems. Accordingly, two features have become crucial in implementing these integrated systems: wireless communication and efficiency in size and energy consumption. Efforts to facilitate both digital and analog features produce mixed signal System-On-Chip (SOC), which include both analog and digital functions on a single die. Noise coupling in such an environment is a key issue in improving system performance; in particular, the noise coupling through the common substrate (i.e. substrate noise) is unavoidable as physical separation between the functions shrinks with technology scaling. To prevent the system performance from degenerating due to the substrate noise, methodologies for analyzing, estimating and measuring the noise in both simulated and practical conditions are essential and worthy of full investigation. This dissertation has conducted such an investigation in mixed signal SOCs Overall, this dissertation presents methodologies regarding how to understand, estimate, and measure the substrate noise in the mixed-signal SOC. As long as mixed-signal systems prevail in the integrated electronics industry, the SOC as well as the SIP should become the main frames of system implementations, and the presented research can contribute to shaping these frames.

Wireless Technologies
Wireless Technologies

Author: Krzysztof Iniewski

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 909

ISBN-13: 1351838202

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Advanced concepts for wireless technologies present a vision of technology that is embedded in our surroundings and practically invisible. From established radio techniques like GSM, 802.11 or Bluetooth to more emerging technologies, such as Ultra Wide Band and smart dust motes, a common denominator for future progress is the underlying integrated circuit technology. Wireless Technologies responds to the explosive growth of standard cellular radios and radically different wireless applications by presenting new architectural and circuit solutions engineers can use to solve modern design problems. This reference addresses state-of-the art CMOS design in the context of emerging wireless applications, including 3G/4G cellular telephony, wireless sensor networks, and wireless medical application. Written by top international experts specializing in both the IC industry and academia, this carefully edited work uncovers new design opportunities in body area networks, medical implants, satellite communications, automobile radar detection, and wearable electronics. The book is divided into three sections: wireless system perspectives, chip architecture and implementation issues, and devices and technologies used to fabricate wireless integrated circuits. Contributors address key issues in the development of future silicon-based systems, such as scale of integration, ultra-low power dissipation, and the integration of heterogeneous circuit design style and processes onto one substrate. Wireless sensor network systems are now being applied in critical applications in commerce, healthcare, and security. This reference, which contains 25 practical and scientifically rigorous articles, provides the knowledge communications engineers need to design innovative methodologies at the circuit and system level.

Interconnect-Centric Design for Advanced SOC and NOC
Interconnect-Centric Design for Advanced SOC and NOC

Author: Jari Nurmi

Publisher: Springer Science & Business Media

Published: 2006-03-20

Total Pages: 450

ISBN-13: 1402078366

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In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.

EDA for IC Implementation, Circuit Design, and Process Technology
EDA for IC Implementation, Circuit Design, and Process Technology

Author: Luciano Lavagno

Publisher: CRC Press

Published: 2018-10-03

Total Pages: 608

ISBN-13: 1420007955

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Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.