Multilayer Electronic Ceramic Devices

Multilayer Electronic Ceramic Devices

Author: Jau-Ho Jean

Publisher:

Published: 1999

Total Pages: 400

ISBN-13:

DOWNLOAD EBOOK

"Proceedings of the International Symposium on Multilayer Electronic Ceramic Devices, held at the 100th Annual Meeting of the American Ceramic Society in Cincinnati, Ohio, May 3-6, 1998"--T.p. verso.


Global Roadmap for Ceramic and Glass Technology

Global Roadmap for Ceramic and Glass Technology

Author: Stephen W. Freiman

Publisher: John Wiley & Sons

Published: 2007-06-29

Total Pages: 964

ISBN-13: 0470104910

DOWNLOAD EBOOK

This is the only global roadmap that identifies the technical and manufacturing challenges associated with the development and expansion of commercial markets for ceramics and glass. Featuring presentations by industry leaders at the 1st International Congress on Ceramics (ICC) held in 2006, it suggests positive, proactive ways to address these challenges. The ICC Global Roadmap contains the following content: 1) Summary papers prepared by the invited speakers before the meeting 2) A detailed account of the presentation of each invited speaker written by an editor who attends the presentation 3) A summary account and future recommendations for the industry on each topic covered written by the board and the president of this meeting, Dr. Stephen Freiman (National Institutes of Standards and Technology) 4) The CDRom accompanying the book contains all of the above as well as pdfs of the presentations for non-invited speakers, including posters presented and discussed.


Multilayered Low Temperature Cofired Ceramics (LTCC) Technology

Multilayered Low Temperature Cofired Ceramics (LTCC) Technology

Author: Yoshihiko Imanaka

Publisher: Springer Science & Business Media

Published: 2006-05-28

Total Pages: 252

ISBN-13: 0387233148

DOWNLOAD EBOOK

The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.


Ferroelectric Devices

Ferroelectric Devices

Author: Kenji Uchino

Publisher: CRC Press

Published: 2018-09-03

Total Pages: 410

ISBN-13: 1351834274

DOWNLOAD EBOOK

Updating its bestselling predecessor, Ferroelectric Devices, Second Edition assesses the last decade of developments—and setbacks—in the commercialization of ferroelectricity. Field pioneer and esteemed author Uchino provides insight into why this relatively nascent and interdisciplinary process has failed so far without a systematic accumulation of fundamental knowledge regarding materials and device development. Filling the informational void, this collection of information reviews state-of-the-art research and development trends reflecting nano and optical technologies, environmental regulation, and alternative energy sources. Like the first edition, which became a standard in the field, this volume provides a general introduction to ferroelectrics with theoretical background. It then addresses practical design and device manufacturing, including recently developed processes and applications. Updating old data with a forecast of future developments, the text analyzes improvements to original ferroelectric devices to aid the design process of new ones. The second edition includes new sections on: Pb-free piezoelectrics Size effect on ferroelectricity Electrocaloric devices Micro mass sensor Piezoelectric energy harvesting Light valves and scanners Multi-ferroic devices, including magneto-electric sensors Uchino provides a general introduction to the theoretical background of ferroelectric devices, practical materials, device designs, drive/control techniques, and typical applications. He presents frequently asked questions from students, lab demonstrations for practical understanding, and "check point" quizzes and model solutions to monitor understanding. After a thorough exploration of ferroelectric devices and their past, this book looks to the industry’s future, assessing market size and remaining reliability/lifetime issues. The author also unveils his strategy for developing "best-selling" ferroelectric devices.


Advances in Multifunctional Materials and Systems

Advances in Multifunctional Materials and Systems

Author: Jun Akedo

Publisher: John Wiley & Sons

Published: 2010-07-23

Total Pages: 188

ISBN-13: 0470909846

DOWNLOAD EBOOK

The symposia Advances in Electroceramics and Microwave Materials and Their Applications were held during the 8th Pacific Rim Conference on Ceramic and Glass Technology (PACRIM 8) from May 31-June 5, 2009 in Vancouver, Canada. This issue contains 17 peer-reviewed papers (invited and contributed) from these two symposia. The book is logically organized and carefully selected articles give insight into multifunctional materials and systems and incorporates the latest developments related to multifunctional materials and systems including electroceramics and microwave materials.


MicroMechatronics, Second Edition

MicroMechatronics, Second Edition

Author: Kenji Uchino

Publisher: CRC Press

Published: 2019-07-19

Total Pages: 585

ISBN-13: 0429522452

DOWNLOAD EBOOK

After Uchino’s introduction of a new terminology, ‘Micromechatronics’ in 1979 for describing the application area of ‘piezoelectric actuators’, the rapid advances in semiconductor chip technology have led to a new terminology MEMS (micro-electro-mechanical-system) or even NEMS (nano-electro-mechanicalsystem) to describe mainly thin film sensor/actuator devices, a narrower area of micromechatronics coverage. New technologies, product developments and commercialization are providing the necessity of this major revision. In particular, the progresses in high power transducers, loss mechanisms in smart materials, energy harvesting and computer simulations are significant. New technologies, product developments and commercialization are providing the updating requirement for the book contents, in parallel to the deletion of old contents. Various educational/instructional example problems have been accumulated, which were integrated in the new edition in order to facilitate the self-learning for the students, and the quiz/problem creation for the instructors. Heavily revised topics from the previous edition include: high power transducers, loss mechanisms in smart materials, energy harvesting and computer simulations New technologies, product developments and commercialization helped shape the updated contents of this book where all chapters have been updated and revised. This textbook is intended for graduate students and industrial engineers studying or working in the fields of electronic materials, control system engineering, optical communications, precision machinery, and robotics. The text is designed primarily for a graduate course with the equivalent of thirty 75-minute lectures; however, it is also suitable for self-study by individuals wishing to extend their knowledge in the field.


MicroMechatronics

MicroMechatronics

Author: Kenji Uchino

Publisher: CRC Press

Published: 2003-04-25

Total Pages: 512

ISBN-13: 0824748557

DOWNLOAD EBOOK

This reference reveals the most significant technologies, procedures, and trends in the design and application of actuator devices for micromechatronic systems. It addresses critical design and manufacturing concepts, as well as challenges in the modeling and regulation of electromechanical losses and heat generation in actuator devices. Accompanied by a CD-ROM demonstrating examples of finite-element modeling and previously developed and commercially available actuators, Micromechatronics provides insight into the future of this evolving field, and considers recent developments in micropositioning technology and displacement transducer, motor, and ultrasonic motor applications.


Ceramic Interconnect Technology Handbook

Ceramic Interconnect Technology Handbook

Author: Fred D. Barlow, III

Publisher: CRC Press

Published: 2018-10-03

Total Pages: 456

ISBN-13: 1420018965

DOWNLOAD EBOOK

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.