The Packaging Development Process
The Packaging Development Process

Author: Kristine DeMaria

Publisher: CRC Press

Published: 1999-12-01

Total Pages: 114

ISBN-13: 1482278898

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The Packaging Development Process: A Guide for Engineers and Project Managers presents the techniques necessary for creating, testing, and launching packaging, in one convenient reference book. It does so by explaining each step of how a packaging project evolves from the business plan to product launch, with an emphasis on the financial and human

Principles of Package Development
Principles of Package Development

Author: Roger C. Griffin

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 388

ISBN-13: 9401173826

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Since the first edition of "Principles of Packaging Development" was published, the packaging industry has undergone many profound changes. These have included the virtual elimination of cellophane and its replacement with oriented polypropylene as a carton overwrap, fluid milk in blow-molded HDPE bottles, PET beverage bottles, cookie bags and cartons lined with polyolefin coextrusions instead of waxed glassine, and bread in reclosable polyolefin and coextruded film bags. New phrases have also worked their way into the lexicon of the practic ing packaging technologist, such as "child resistance" and "tamper evident. " This most popular text on packaging demanded updating. How these phrases and ideas have affected the industry in the 1980s and how they will probably alter its course in the future are treated. New concepts of packaging system planning and forecasting tech niques are intruding into package management, and new chapters will introduce them to the reader. The years have added a certain degree of maturity to the packaging industry. Not only have the original authors broadened their per spectives and changed professional responsibilities, we have also in cluded a third co-author, Dr. Aaron L. Brody, whose experience in the industry, academic background, and erudite insights into the very na ture of packaging have added an unparalled degree of depth to this book. We would like to thank David L.

NRL MODULAR ELECTRONIC PACKAGING.
NRL MODULAR ELECTRONIC PACKAGING.

Author: NAVAL RESEARCH LAB WASHINGTON D C.

Publisher:

Published: 1967

Total Pages: 111

ISBN-13:

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Contents: Module design; Connectors; Racks; Cabinets; Interconnections; Heat exchanger; and Future development.

Advanced Electronic Packaging
Advanced Electronic Packaging

Author: William D. Brown

Publisher: Wiley-IEEE Press

Published: 1998-10-27

Total Pages: 0

ISBN-13: 9780780347007

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Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Physical Design for Multichip Modules
Physical Design for Multichip Modules

Author: Mysore Sriram

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 205

ISBN-13: 1461526825

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Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Introduction to Microsystem Packaging Technology
Introduction to Microsystem Packaging Technology

Author: Yufeng Jin

Publisher: CRC Press

Published: 2018-09-10

Total Pages: 232

ISBN-13: 9781138374256

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The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process--including design and manufacturing technologies--is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technologydetails the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Power Electronic Packaging
Power Electronic Packaging

Author: Yong Liu

Publisher: Springer Science & Business Media

Published: 2012-02-15

Total Pages: 606

ISBN-13: 1461410533

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.