Modern Electronics Soldering Techniques
Author: Andrew Singmin
Publisher: Prompt
Published: 2000
Total Pages: 0
ISBN-13: 9780790611990
DOWNLOAD EBOOKOffers up-to-date techniques for the use of soldering in electronic components.
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Author: Andrew Singmin
Publisher: Prompt
Published: 2000
Total Pages: 0
ISBN-13: 9780790611990
DOWNLOAD EBOOKOffers up-to-date techniques for the use of soldering in electronic components.
Author: Jennie S. Hwang
Publisher: McGraw Hill Professional
Published: 1996
Total Pages: 678
ISBN-13: 9780070317499
DOWNLOAD EBOOKIntroduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.
Author: MIKE JUDD
Publisher: Elsevier
Published: 1999-03-26
Total Pages: 385
ISBN-13: 008051734X
DOWNLOAD EBOOKManagers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment
Author: Jennie Hwang
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 374
ISBN-13: 146153528X
DOWNLOAD EBOOKOne of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Author: John B. Watkins
Publisher: Elsevier
Published: 2016-01-22
Total Pages: 209
ISBN-13: 1483103390
DOWNLOAD EBOOKModern Electronic Materials focuses on the development of electronic components. The book first discusses the history of electronic components, including early developments up to 1900, developments up to World War II, post-war developments, and a comparison of present microelectric techniques. The text takes a look at resistive materials. Topics include resistor requirements, basic properties, evaporated film resistors, thick film resistors, and special resistors. The text examines dielectric materials. Considerations include basic properties, evaporated dielectric materials, ceramic dielectrics, metallization process, vacuum tightness, and materials with large values of permittivity. The text also discusses the reliability of discrete electronic components. The book also explains magnetic materials. Focus is on basic properties, preparation of ferrite materials, magnetization curve, and microwave properties of ferrite materials. The text is a valuable reference for readers interested in electronic materials.
Author: Howard H. Manko
Publisher: McGraw-Hill Companies
Published: 1979
Total Pages: 376
ISBN-13:
DOWNLOAD EBOOKGet the latest developments in solder technology You can't work in electronics without solder -- and you shouldn't work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You'll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.
Author: R. Sengupta
Publisher: New Age International
Published: 1997
Total Pages: 122
ISBN-13: 9788122411096
DOWNLOAD EBOOKSoldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Author: G.W.A. Dummer
Publisher: Elsevier
Published: 2013-10-02
Total Pages: 571
ISBN-13: 1483151425
DOWNLOAD EBOOKElectronic Connection Techniques and Equipment 1968–69 presents the methods and equipment used in the wide field of electronic connections. This book describes all connection methods, including automated systems and microelectronic interconnections. This text covers all aspects of electronic connections, such as the system selection parameters and applications, as well as information on reliability. This book provides information on a wide range of methods and equipment in use and available in the United States of America and in the United Kingdom. Information is also included on welding, smoldering, wrapping, bonding, and crimping. The materials are extensively illustrated with diagrams and photographs describing system, equipment, application, and operation. This book is a valuable resource for readers who are interested in the connection and interconnection of electronic components, equipment, and devices.
Author: Charles Platt
Publisher: "O'Reilly Media, Inc."
Published: 2009-11-23
Total Pages: 354
ISBN-13: 1449388795
DOWNLOAD EBOOK"This is teaching at its best!" --Hans Camenzind, inventor of the 555 timer (the world's most successful integrated circuit), and author of Much Ado About Almost Nothing: Man's Encounter with the Electron (Booklocker.com) "A fabulous book: well written, well paced, fun, and informative. I also love the sense of humor. It's very good at disarming the fear. And it's gorgeous. I'll be recommending this book highly." --Tom Igoe, author of Physical Computing and Making Things Talk Want to learn the fundamentals of electronics in a fun, hands-on way? With Make: Electronics, you'll start working on real projects as soon as you crack open the book. Explore all of the key components and essential principles through a series of fascinating experiments. You'll build the circuits first, then learn the theory behind them! Build working devices, from simple to complex You'll start with the basics and then move on to more complicated projects. Go from switching circuits to integrated circuits, and from simple alarms to programmable microcontrollers. Step-by-step instructions and more than 500 full-color photographs and illustrations will help you use -- and understand -- electronics concepts and techniques. Discover by breaking things: experiment with components and learn from failure Set up a tricked-out project space: make a work area at home, equipped with the tools and parts you'll need Learn about key electronic components and their functions within a circuit Create an intrusion alarm, holiday lights, wearable electronic jewelry, audio processors, a reflex tester, and a combination lock Build an autonomous robot cart that can sense its environment and avoid obstacles Get clear, easy-to-understand explanations of what you're doing and why