This book offers a comprehensive overview of the development, current state, and future prospects of wide bandgap semiconductor materials and related optoelectronics devices. With 901 references, 333 figures and 21 tables, this book will serve as a one-stop source of knowledge on wide bandgap semiconductors and related optoelectronics devices.
This supplement contains new projects since the publication of the Project Book in Sep. 1995. Potential new starts are summarized on a single page. The summary contains an explanation of the need for the project, the approach taken to accomplish the effort, the benefits expected to be realized, the current status, the name of the project engineer, & performing contractor. Covers: advanced industrial practices, electronics, manufacturing & engineering systems, metals, nonmetals, sustainment, technology development, & Title III. Illsutrated.
This book provides an introduction to the fundamentals of composite materials for high performance structures from the point of view of engineering design, manufacturing, analysis, and repair. It is designed to address eight critical areas of composite technologies. Readers will learn how composite materials achieve properties of strength, stiffness, weight ratios and durability that surpass aluminum in high performance structures. For these applications, engineers typically rely on laminated structures, which are built up from many varying layers of ply-materials. Using this process the mechanical properties of the composite part can be tailored to specific applications resulting in significant weight and cost savings. Tailoring specific properties and designing innovative laminate structures highlights the multidisciplinary nature of this industry.
Endohedral Metallofullerenes: Fullerenes with Metal Inside presents a comprehensive survey of the current state of knowledge on endohedral metallofullerenes, from preparation to functionalization, reactivity and applications. Following a brief historical overview, the book describes methods for synthesis, extraction, separation and purification, and provides an insight into the molecular and crystal structures. Subsequent chapters discuss various categories of endohedral metallofullerenes based on the encapsulated species, including carbides, nitrides, sulphides, oxides, non-metal and non-IPR endohedral metallofullerenes, followed by scanning tunneling microscopy studies and the examination of electronic, vibrational, magnetic and optical properties. The book concludes with chapters addressing the chemical functionalization of endohedral metallofullerenes, and applications ranging from solar cells to biomedicine.
Over two volumes and 1500 pages, the Handbook of Spintronics will cover all aspects of spintronics science and technology, including fundamental physics, materials properties and processing, established and emerging device technology and applications. Comprising 60 chapters from a large international team of leading researchers across academia and industry, the Handbook provides readers with an up-to-date and comprehensive review of this dynamic field of research. The opening chapters focus on the fundamental physical principles of spintronics in metals and semiconductors, including an introduction to spin quantum computing. Materials systems are then considered, with sections on metallic thin films and multilayers, magnetic tunnelling structures, hybrids, magnetic semiconductors and molecular spintronic materials. A separate section reviews the various characterisation methods appropriate to spintronics materials, including STM, spin-polarised photoemission, x-ray diffraction techniques and spin-polarised SEM. The third part of the Handbook contains chapters on the state of the art in device technology and applications, including spin valves, GMR and MTJ devices, MRAM technology, spin transistors and spin logic devices, spin torque devices, spin pumping and spin dynamics and other topics such as spin caloritronics. Each chapter considers the challenges faced by researchers in that area and contains some indications of the direction that future work in the field is likely to take. This reference work will be an essential and long-standing resource for the spintronics community.
With the progress in nanotechnology and associated production methods, composite materials are becoming lighter, cheaper, more durable, and more versatile. At present, great progress has been made in the design, preparation, and characterization of composite materials, making them smarter and versatile. By creating new properties using suitable fillers and matrix, functional composites can meet the most challenging standards of users, especially in high-tech industries. Advanced composites reinforced by high-performance carbon fibers and nanofillers are popular in the automotive and aerospace industries thanks to their significant advantages, such as high specific strength to weight ratio and noncorrosion properties. In addition to the improvement of the mechanical performance, composite materials today are designed to provide new functions dealing with antibacterial, self-cleaning, self-healing, super-hard, and solar reflective properties for desired end-use applications. On the other hand, composite materials can contribute to mitigating environmental issues by providing renewable energy technologies in conjunction with multifunctional, lightweight energy storage systems with high performance and noncorrosive properties. They are also used to prepare a new generation of batteries and directly contribute to H2 production or CO2 reduction in fuels and chemicals. This Special Issue aims to collect articles reporting on recent developments dealing with preparative methods, design, properties, structure, and characterization methods as well as promising applications of multifunctional composites. It covers potential applications in various areas, such as anticorrosion, photocatalyst, absorbers, superhydrophobic, self-cleaning, antifouling/antibacterial, renewable energy, energy storage systems, construction, and electronics. The modeling and simulation of processes involving the design and preparation of functional and multifunctional composites as well as experimental studies involving these composites are all covered in this Special Issue.
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Silicon (Si) is by far the most widely used semiconductor material for power devices. On the other hand, Si-based power devices are approaching their material limits, which has provoked a lot of efforts to find alternatives to Si-based power devices for better performance. With the rapid innovations and developments in the semiconductor industry, Silicon Carbide (SiC) power devices have progressed from immature prototypes in laboratories to a viable alternative to Si-based power devices in high-efficiency and high-power density applications. SiC devices have numerous persuasive advantages--high-breakdown voltage, high-operating electric field, high-operating temperature, high-switching frequency and low losses. Silicon Carbide (SiC) devices belong to the so-called wide band gap semiconductor group, which offers a number of attractive characteristics for high voltage power semiconductors when compared to commonly used silicon (Si). Recently, some SiC power devices, for example, Schottky-barrier diodes (SBDs), metal-oxide-semiconductor field-effecttransistors (MOSFETs), junction FETs (JFETs), and their integrated modules have come onto the market. Physics and Technology of Silicon Carbide Devices abundantly describes recent technologies on manufacturing, processing, characterization, modeling, etc. for SiC devices.
