Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.
This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Today, computer science engineering and telecommunications are two important areas linked and even inseparable. This is obvious for the user who connects the modem of his computer on his mobile phone or telephone line to access, via the global data network, the information available on the servers. The both domains are evolving rapidly and the development of new architectures of systems dedicated to telecommunications and computing becomes essential. Especially, wireless transmission systems with high data rate. Two parts of these systems should be developed software and hardware. Another area that is renewable energies becomes more attractive for researchers in order to develop new conversion systems with good performances, and a good optimization of energy. For example, in wireless sensor systems, we try to develop new protocols permitting to have a good autonomy in terms of energy.
Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems The first and only comprehensive text on substrate-integrated mmW antenna technology, state-of-the-art antenna design, and emerging wireless applications Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems elaborates the most important topics related to revolutionary millimeter-wave (mmW) technology. Following a clear description of fundamental concepts including substrate-integrated waveguides and loss analysis, the text treats key design methods, prototyping techniques, and experimental setup and testing. The authors also highlight applications of mmW antennas in 5G wireless communication and next-generation radar systems. Readers are prepared to put techniques into practice through practical discussions of how to set up testing for impedance matching, radiation patterns, gain from 24GHz up to 325 GHz, and more. This book will bring readers state-of-the-art designs and recent progress in substrate-integrated mmW antennas for emerging wireless applications. Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems is the first comprehensive text on the topic, allowing readers to quickly master mmW technology. This book: Introduces basic concepts such as metamaterials Huygens’s surface, zero-index structures, and pattern synthesis Describes prototyping in the form of fabrication based on printed-circuit-board, low-temperature-co-fired-ceramic and micromachining Explores applications for next-generation radar and imaging systems such as 24-GHz and 77-GHz vehicular radar systems Elaborates design methods including waveguide-based feeding network, three-dimensional feeding structure, dielectric loaded aperture antenna element, and low-sidelobe synthesis The mmW is one of today’s most important emerging technologies. This book provides graduate students, researchers, and engineers with the knowledge they need to deploy mmW systems and develop new antenna designs with low cost, low loss, and low complexity.
This book gives an in-depth account of GaAs, InP and SiGe, technologies and describes all the key techniques for the design of amplifiers, ranging from filters and data converters to image oscillators, mixers, switches, variable attenuators, phase shifters, integrated antennas and complete monolithic transceivers.
