Heat Transfer and Fluid Flow in Minichannels and Microchannels

Heat Transfer and Fluid Flow in Minichannels and Microchannels

Author: Satish Kandlikar

Publisher: Elsevier

Published: 2006

Total Pages: 492

ISBN-13: 9780080445274

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&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.


Thermal Transport in Oblique Finned Micro/Minichannels

Thermal Transport in Oblique Finned Micro/Minichannels

Author: Yan Fan

Publisher: Springer

Published: 2014-10-15

Total Pages: 143

ISBN-13: 3319096478

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The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies. Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.


Microscale Heat Transfer - Fundamentals and Applications

Microscale Heat Transfer - Fundamentals and Applications

Author: S. Kakaç

Publisher: Springer Science & Business Media

Published: 2005-05-02

Total Pages: 530

ISBN-13: 9781402033605

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This volume provides a comprehensive state-of-the art assessment of the fundamentals of the Microscale heat transfer and transport phenomena and heat transfer and applications in Microsystems. The modern trend toward miniaturization of devices requires a better understanding of heat mass transfer phenomena in small dimensions. Devices having dimensions of order of microns are being developed for use of cooling of integrated circuits, and in biochemicals-biomedical applications and cryogenics. Microelectromechanical systems (MEMS) have an important impact in medicine, bioengineering, information technologies and other industries.


Advances in Heat Transfer

Advances in Heat Transfer

Author: George A. Greene

Publisher: Elsevier

Published: 2006-10-17

Total Pages: 668

ISBN-13: 008046534X

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Advances in Heat Transfer fills the information gap between regularly scheduled journals and university level textbooks by providing in-depth review articles over a broader scope than in journals or texts. The articles, which serve as a broad review for experts in the field, will also be of great interest to non-specialists who need to keep up-to- date with the results of the latest research. It is essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, graduate schools or industry. - Provides an overview of review articles on topics of current interest - Bridges the gap between academic researchers and practitioners in industry - A long-running and prestigious series


Heat Transfer

Heat Transfer

Author: Salim Newaz Kazi

Publisher: BoD – Books on Demand

Published: 2015-07-29

Total Pages: 408

ISBN-13: 9535121464

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In the wake of energy crisis due to rapid growth of industries, the efficient heat transfer could play a vital role in energy saving. Industries, household equipment, transportation, offices, etc., all are dependent on heat exchanging equipment. Considering this, the book has incorporated different chapters on heat transfer phenomena, analytical and experimental heat transfer investigations, heat transfer enhancement and applications.


Liquid-Vapor Phase-Change Phenomena

Liquid-Vapor Phase-Change Phenomena

Author: Van P. Carey

Publisher: CRC Press

Published: 2020-02-28

Total Pages: 731

ISBN-13: 1498716636

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Since the second edition of Liquid-Vapor Phase-Change Phenomena was written, research has substantially enhanced the understanding of the effects of nanostructured surfaces, effects of microchannel and nanochannel geometries, and effects of extreme wetting on liquid-vapor phase-change processes. To cover advances in these areas, the new third edition includes significant new coverage of microchannels and nanostructures, and numerous other updates. More worked examples and numerous new problems have been added, and a complete solution manual and electronic figures for classroom projection will be available for qualified adopting professors.


Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)

Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)

Author:

Publisher: World Scientific

Published: 2012-09-25

Total Pages: 1582

ISBN-13: 9814452599

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remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.


Micro Process Engineering

Micro Process Engineering

Author: Norbert Kockmann

Publisher: John Wiley & Sons

Published: 2013-03-26

Total Pages: 529

ISBN-13: 3527675051

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This edition of 'Micro Process Engineering' was originally published in the successful series 'Advanced Micro & Nanosystems'. Authors from leading industrial players and research institutions present a concise and didactical introduction to Micro Process Engineering, the combination of microtechnology and process engineering into a most promising and powerful tool for revolutionizing chemical processes and industrial mass production of bulk materials, fine chemicals, pharmaceuticals and many other products. The book takes the readers from the fundamentals of engineering methods, transport processes, and fluid dynamics to device conception, simulation and modelling, control interfaces and issues of modularity and compatibility. Fabrication strategies and techniques are examined next, focused on the fabrication of suitable microcomponents from various materials such as metals, polymers, silicon, ceramics and glass. The book concludes with actual applications and operational aspects of micro process systems, giving broad coverage to industrial efforts in America, Europe and Asia as well as laboratory equipment and education.