Methods and Materials in Microelectronic Technology

Methods and Materials in Microelectronic Technology

Author: Joachim Bargon

Publisher: Springer Science & Business Media

Published: 2013-03-09

Total Pages: 367

ISBN-13: 1468448471

DOWNLOAD EBOOK

The papers collected in this volume were presented at the International Symposium on Methods and Materials in Microelectronic Technology. This symposium was sponsored by IBM Germany, and it was held September 29 - October 1, 1982, in Bad Neuenahr, West Germany. The progress of semiconductor and microelectronic technology has become so rapid and the field so sophisticated that it is imperative to exchange the latest insight gained as frequently as it can be accomplished. In addition, it is peculiar for this field that the bulk of the investigations are carried out at industrial research and development laboratories, which makes some of the results less readily accessible. Because of these circumstances, the academic community, which among other things, is supposed to communicate the prog ress in this field to students of different disciplines, finds it rather difficult to stay properly informed. It was the intent of this IBM sponsored symposium to bring together key scientists from academic institutions, primarily from Europe, with principal investigators of the industrial scene. Accordingly, this symposium exposed technologists to scientists and vice versa. Scientific advances often lead directly to technological innovations. In turn, new technologies are often arrived at empirically and, because of that, are initially poorly understood. Scientific inquiry then attempts to probe these processes and phenomena in order to achieve a better understanding. Thus science and technology are intricately interconnected, and it is important that technical exchange between technolo gists and scientists is facilitated, since the problems are typically interdiscipli nary in nature.


Microelectronic Materials and Processes

Microelectronic Materials and Processes

Author: Roland Levy

Publisher: Springer Science & Business Media

Published: 1989-01-31

Total Pages: 1006

ISBN-13: 9780792301547

DOWNLOAD EBOOK

The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.


Microelectronics to Nanoelectronics

Microelectronics to Nanoelectronics

Author: Anupama B. Kaul

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 464

ISBN-13: 1466509554

DOWNLOAD EBOOK

Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena. Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology’s Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached the commercial realm. Capitalizing on Dr. Kaul’s considerable technical experience with micro- and nanotechnologies and her extensive research in prestigious academic and industrial labs, the book offers a fresh perspective on application-driven research in micro- and nanoelectronics, including MEMS. Chapters explore how rapid developments in this area are transitioning from the lab to the market, where new and exciting materials, devices, and manufacturing technologies are revolutionizing the electronics industry. Although many micro- and nanotechnologies still face major scientific and technological challenges and remain within the realm of academic research labs, rapid advances in this area have led to the recent emergence of new applications and markets. This handbook encapsulates that exciting recent progress by providing high-quality content contributed by international experts from academia, leading industrial institutions—such as Hewlett-Packard—and government laboratories including the U.S. Department of Energy’s Sandia National Laboratory. Offering something for everyone, from students to scientists to entrepreneurs, this book showcases the broad spectrum of cutting-edge technologies that show significant promise for electronics and related applications in which nanotechnology plays a key role.


Defects in Microelectronic Materials and Devices

Defects in Microelectronic Materials and Devices

Author: Daniel M. Fleetwood

Publisher: CRC Press

Published: 2008-11-19

Total Pages: 772

ISBN-13: 1420043773

DOWNLOAD EBOOK

Uncover the Defects that Compromise Performance and ReliabilityAs microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them.A comprehensive survey of defe


Microlithography: High Integration In Microelectronics - Proceedings Of The First Workshop

Microlithography: High Integration In Microelectronics - Proceedings Of The First Workshop

Author: Vitor Baranauskas

Publisher: World Scientific

Published: 1990-05-01

Total Pages: 194

ISBN-13: 9814611905

DOWNLOAD EBOOK

This volume is a collection of classical and recent empirical studies of currency options and their implications for issues of exchange rate economics, such as exchange rate risk premium, volatility, market expectations, and credibility of exchange rate regimes. It contains applications on how to extract useful information from option market data for financial forecasting policy purposes. The subjects are discussed in a self-contained, user-friendly format, with introductory chapters on currency option theory and currency option markets.The book can be used as supplementary reading for graduate finance and international economics courses, as training material for central bank and regulatory authorities, or as a reference book for financial analysts.


Electron-Beam Technology in Microelectronic Fabrication

Electron-Beam Technology in Microelectronic Fabrication

Author: George Brewer

Publisher: Elsevier

Published: 2012-12-02

Total Pages: 377

ISBN-13: 0323153410

DOWNLOAD EBOOK

Electron-Beam Technology in Microelectronic Fabrication presents a unified description of the technology of high resolution lithography. This book is organized into six chapters, each treating a major segment of the technology of high resolution lithography. The book examines topics such as the physics of interaction of the electrons with the polymer resist in which the patterns are drawn, the machines that generate and control the beam, and ways of applying electron-beam lithography in device fabrication and in the making of masks for photolithographic replication. Chapter 2 discusses fundamental processes by which patterns are created in resist masks. Chapter 3 describes electron-beam lithography machines, including some details of each of the major elements in the electron-optical column and their effect on the focused electron beam. Chapter 4 presents the use of electron-beam lithography to make discrete devices and integrated circuits. Chapter 5 looks at the techniques and economics of mask fabrication by the use of electron beams. Finally, Chapter 6 presents a comprehensive description and evaluation of the several high resolution replication processes currently under development. This book will be of great value to students and to engineers who want to learn the unique features of high resolution lithography so that they can apply it in research, development, or production of the next generation of microelectronic devices and circuits.


Microelectronics Technology and Devices - SBMicro 2009

Microelectronics Technology and Devices - SBMicro 2009

Author: Davies William de Lima Monteiro

Publisher: The Electrochemical Society

Published: 2009-08

Total Pages: 639

ISBN-13: 1566777372

DOWNLOAD EBOOK

This issue of ECS Transactions features eight invited and sixty-seven regular papers on technology, devices, systems, optoelectronics, modeling and characterization; all either directly or indirectly related to microelectronics. The topics presented herein reveal the multidisciplinary character of this field, which definitely incites the highly cooperative trace of human nature.


Materials for Information Technology

Materials for Information Technology

Author: Ehrenfried Zschech

Publisher: Springer Science & Business Media

Published: 2006-07-02

Total Pages: 498

ISBN-13: 1846282357

DOWNLOAD EBOOK

This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.


Carbon-Based Nanocomposite Applications and Microelectronic Technologies

Carbon-Based Nanocomposite Applications and Microelectronic Technologies

Author: Loutfy H. Madkour

Publisher: CRC Press

Published: 2024-11-29

Total Pages: 508

ISBN-13: 1040155502

DOWNLOAD EBOOK

Carbon-Based Nanocomposite Applications and Microelectronic Technologies covers the fundamentals of carbon-based nanomaterials (CNMs) and their potential for technological and industrial applications. Written by a leading expert, this volume gives thorough coverage of bio-nanotechnology and biomedical applications of novel carbon nanomaterials and explores the development of microelectronics technologies and nanocomposites. Key features: · Covers a range of biotechnological applications, from human toxicological assessment of carbon nanotubes at biointerfaces to electrochemiluminescence (ECL), optical and glucose biosensors. · Addresses issues of biosafety, biocompatibility and biodegradation. · Assesses the potential for future CNMs-enzyme conjugates for potential use in cancer treatment. ·Full references can be found via the Support Material: www.routledge.com/9781032636061 This book provides a crucial study of technological and biomedical applications of CNMs and will be important reading for researchers and industry professionals working in the fields of advanced nanoelectronic materials, biotechnology and nanomedicine.


Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Author: Kim S. Siow

Publisher: Springer

Published: 2019-01-29

Total Pages: 292

ISBN-13: 3319992562

DOWNLOAD EBOOK

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.