Mechanic and Dielectric Properties
Mechanic and Dielectric Properties

Author: Maurice H. Francombe

Publisher: Academic Press

Published: 2013-10-22

Total Pages: 415

ISBN-13: 1483288927

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Mechanic and Dielectric Properties deals with the mechanical and dielectric properties of thin films. Topics covered range from the deposition and mechanical properties of superlattice thin films to the preparation of hard coatings by sputtering and arc evaporation. The use of thin films in microwave acoustics is also discussed, along with ferroelectric films for integrated electronics and the physics, chemistry, and technology of electrochromic tungsten-oxide-based thin films. Comprised of five chapters, this volume begins with an analysis of the growth, characterization, and mechanical behavior of films comprising multilayers primarily of metal and refractory metallic compound components. The next chapter reviews the mechanical properties of hard coatings prepared by sputtering and arc evaporation, together with the influence of multilayer and gradient structures, and of film crystallinity, crystal orientation, and morphology, on properties such as hardness, coating smoothness, and friction behavior. Subsequent chapters focus on the unique role played by piezoelectric films in signal processing devices utilizing bulk or surface acoustic waves; the properties and applications of ferroelectric films in integrated electronics; and the underlying physics and chemistry of electrochromic tungsten-oxide-based thin films. This book should be of interest to physicists.

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

Author: Christopher Lyle Borst

Publisher: Springer Science & Business Media

Published: 2013-11-27

Total Pages: 235

ISBN-13: 1461511658

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As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

Accelerating the Discovery of New Dielectric Properties in Polymer Insulation
Accelerating the Discovery of New Dielectric Properties in Polymer Insulation

Author: Du, Boxue

Publisher: IGI Global

Published: 2017-03-24

Total Pages: 396

ISBN-13: 1522523103

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Modern power systems have undergone tremendous progress due to the implementation of new technologies. With these advancements, the standards for insulation materials must be enhanced and revitalized. Accelerating the Discovery of New Dielectric Properties in Polymer Insulation is a pivotal source of academic research on emerging trends in the properties, applications, and developments of polymer dielectrics. Highlighting a range of relevant perspectives on topics such as high thermal conductivity, power storage, and wind energy, this book is ideally designed for students, professionals, academics, and practitioners interested in the optimization of power system infrastructures.

Mechanical Properties and Performance of Engineering Ceramics and Composites IX, Volume 35, Issue 2
Mechanical Properties and Performance of Engineering Ceramics and Composites IX, Volume 35, Issue 2

Author: Dileep Singh

Publisher: John Wiley & Sons

Published: 2014-11-18

Total Pages: 250

ISBN-13: 1119031311

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The Ceramic Engineering and Science Proceeding has been published by The American Ceramic Society since 1980. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.

Low Dielectric Constant Materials for IC Applications
Low Dielectric Constant Materials for IC Applications

Author: Paul S. Ho

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 323

ISBN-13: 3642559085

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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for

High Dielectric Constant Materials
High Dielectric Constant Materials

Author: Howard Huff

Publisher: Springer Science & Business Media

Published: 2005

Total Pages: 740

ISBN-13: 9783540210818

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Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.

Recent Advances in Mechanical Engineering
Recent Advances in Mechanical Engineering

Author: Premananda Pradhan

Publisher: Springer Nature

Published: 2022-06-03

Total Pages: 721

ISBN-13: 981169057X

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This book presents select proceedings of the International Conference on Recent Advances in Mechanical Engineering Research and Development (ICRAMERD 21). It covers the latest research trends in various branches of mechanical engineering. The topics covered include materials engineering, industrial system engineering, manufacturing systems engineering, automotive engineering, thermal systems, smart composite materials, manufacturing processes, industrial automation, and energy system. The book will be a valuable reference for beginners, researchers, engineers, and industry professionals working in the various fields of mechanical engineering.