[PDF] Full Materials Technology And Reliability For Advanced Interconnects 2005 Volume 863 Download eBook

Materials and Strength of Gas Turbine Parts

Author: Leonid Borisovich Getsov

Publisher: Springer Nature

Published: 2021-04-17

Total Pages: 469

ISBN-13: 9811605343

This book discusses several mechanical and material problems that are typical for gas turbine components. It discusses accelerated tests and other methods for increasing the reliability of gas turbine engines. Special attention is given to non-traditional methods for calculating the strength characteristics and longevity of the main components. This first volume focuses on the selection of materials, deformation and destruction mechanisms in connection with stationary and non-stationary loading, and types of material damage such as the thermal fatigue. Particular attention is paid to the issues of the properties of single crystal alloys, the relationship between structure and properties, the influence of technological factors and long-term operation. The characteristics of creep resistance, crack resistance, and resistance to cyclic deformation of different alloys are given.

Handbook of Thin Film Deposition

Author: Krishna Seshan

Publisher: William Andrew

Published: 2018-02-23

Total Pages: 472

ISBN-13: 0128123125

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Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics

Handbook of Semiconductor Manufacturing Technology

Author: Yoshio Nishi

Publisher: CRC Press

Published: 2017-12-19

Total Pages: 3276

ISBN-13: 1351829823

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Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Materials, Integration and Technology for Monolithic Instruments: Volume 869

Author: Jeremy A. Theil

Publisher:

Published: 2005-07-28

Total Pages: 192

ISBN-13:

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Materials and Devices for Smart Systems II: Volume 888

Author: Yasubumi Furuya

Publisher:

Published: 2006-04-07

Total Pages: 408

ISBN-13:

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Smart/intelligent systems is a primary technology for present and future applications in areas ranging from everyday life to aerospace missions, from civil to military environments, from robots to information technology. Smart materials are the critical foundation for high-performance smart devices, and smart devices are fundamental components for smart systems. The three cannot be separated. This book bridges the fields of smart materials, sensing and actuating devices, and intelligent systems, and provides an opportunity for researchers from all three arenas to channel information into a coherent, interdisciplinary community. Topics include: piezoelectric actuators; novel devices and systems; shape memory alloys and magnetostrictive devices; nanometer-scale processing and properties; piezoelectric materials; sensor materials and devices; and electroactive polymer actuators.

Chemical-Mechanical Planarization: Volume 867

Author: A. Kumar

Publisher:

Published: 2005-07-19

Total Pages: 330

ISBN-13:

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Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.