Chemical Abstracts
Author:
Publisher:
Published: 2002
Total Pages: 2540
ISBN-13:
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
Published: 2007-05-26
Total Pages: 1471
ISBN-13: 0387329897
DOWNLOAD EBOOKThis handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Interfacial Phenomena in Adhesion and Adhesive Bonding
Author: Shin Horiuchi
Publisher: Springer Nature
Published: 2023-10-26
Total Pages: 368
ISBN-13: 9819944562
DOWNLOAD EBOOKThis open access book reviews the recent research achievements of the investigation of interfacial phenomena in polymer/polymer and polymer/metal joint interfaces with the state-of-the-art analytical techniques not previously used in the field of adhesion and bonding. Adhesion performance is determined not only by the two-dimensional interfaces but also by a three-dimensional (3D) region having different properties and structural characteristics that extends into the bulk materials. In this book, the authors also discuss in detail the bonding mechanism by characterizing such 3D regions called “interphase”. The book is of great interest to researchers and engineers devoted to adhesion science and technology. Videos via app: download the SN More Media app for free, scan an image or a link with play button, and access videos directly on your smartphone or tablet.
Adhesion in Microelectronics
Author: K. L. Mittal
Publisher: John Wiley & Sons
Published: 2014-08-25
Total Pages: 293
ISBN-13: 1118831349
DOWNLOAD EBOOKThis comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Mechanics of Microelectronics
Author: G.Q. Zhang
Publisher: Springer Science & Business Media
Published: 2006-08-25
Total Pages: 580
ISBN-13: 1402049358
DOWNLOAD EBOOKThis book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Nanopackaging
Author: James E. Morris
Publisher: Springer Science & Business Media
Published: 2008-12-30
Total Pages: 553
ISBN-13: 0387473262
DOWNLOAD EBOOKThis book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Reliability of Organic Compounds in Microelectronics and Optoelectronics
Author: Willem Dirk van Driel
Publisher: Springer Nature
Published: 2022-01-31
Total Pages: 552
ISBN-13: 3030815765
DOWNLOAD EBOOKThis book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Electronic Packaging Materials Science X: Volume 515
Author: Daniel J. Belton
Publisher:
Published: 1998-10
Total Pages: 288
ISBN-13:
DOWNLOAD EBOOKProceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
Encyclopedia of Analytical Science
Author:
Publisher: Elsevier
Published: 2019-04-02
Total Pages: 5142
ISBN-13: 008101984X
DOWNLOAD EBOOKThe third edition of the Encyclopedia of Analytical Science, Ten Volume Set is a definitive collection of articles covering the latest technologies in application areas such as medicine, environmental science, food science and geology. Meticulously organized, clearly written and fully interdisciplinary, the Encyclopedia of Analytical Science, Ten Volume Set provides foundational knowledge across the scope of modern analytical chemistry, linking fundamental topics with the latest methodologies. Articles will cover three broad areas: analytical techniques (e.g., mass spectrometry, liquid chromatography, atomic spectrometry); areas of application (e.g., forensic, environmental and clinical); and analytes (e.g., arsenic, nucleic acids and polycyclic aromatic hydrocarbons), providing a one-stop resource for analytical scientists. Offers readers a one-stop resource with access to information across the entire scope of modern analytical science Presents articles split into three broad areas: analytical techniques, areas of application and and analytes, creating an ideal resource for students, researchers and professionals Provides concise and accessible information that is ideal for non-specialists and readers from undergraduate levels and higher
Electronic Packaging Materials Science
Author:
Publisher:
Published: 1998
Total Pages: 288
ISBN-13:
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