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Author: C. V. Thompson
Publisher:
Published: 1992-09-30
Total Pages: 352
ISBN-13:
DOWNLOAD EBOOKThe MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Milton Ohring
Publisher: Academic Press
Published: 2014-10-14
Total Pages: 759
ISBN-13: 0080575528
DOWNLOAD EBOOKReliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author:
Publisher:
Published: 1996
Total Pages: 616
ISBN-13:
DOWNLOAD EBOOKAuthor: William F. Filter
Publisher:
Published: 1996-11-18
Total Pages: 616
ISBN-13:
DOWNLOAD EBOOKMRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.
Author: Materials Research Society. Spring Meeting
Publisher:
Published: 1994
Total Pages: 666
ISBN-13:
DOWNLOAD EBOOKAuthor: Paul S. Ho
Publisher: Cambridge University Press
Published: 2022-05-12
Total Pages:
ISBN-13: 1009287796
DOWNLOAD EBOOKLearn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Author: Pradeep Lall
Publisher: CRC Press
Published: 2020-07-09
Total Pages: 332
ISBN-13: 0429605595
DOWNLOAD EBOOKThis book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
Published: 2007-05-26
Total Pages: 1471
ISBN-13: 0387329897
DOWNLOAD EBOOKThis handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: T. O. Herndon
Publisher:
Published: 1993
Total Pages: 520
ISBN-13:
DOWNLOAD EBOOKAuthor: Leo Kounis
Publisher: BoD – Books on Demand
Published: 2020-07-01
Total Pages: 206
ISBN-13: 1789239516
DOWNLOAD EBOOKAmid a plethora of challenges, technological advances in science and engineering are inadvertently affecting an increased spectrum of today’s modern life. Yet for all supplied products and services provided, robustness of processes, methods, and techniques is regarded as a major player in promoting safety. This book on systems reliability, which equally includes maintenance-related policies, presents fundamental reliability concepts that are applied in a number of industrial cases. Furthermore, to alleviate potential cost and time-specific bottlenecks, software engineering and systems engineering incorporate approximation models, also referred to as meta-processes, or surrogate models to reproduce a predefined set of problems aimed at enhancing safety, while minimizing detrimental outcomes to society and the environment.
