The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Novel Plasma Techniques for Low Temperature Processing of Thin Films for Flexible Electronics¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, California from May 24 to 29, 2009.
This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.
This issue of ECS Transactions contains the peer-reviewed full length papers of the International Symposium on Silicon Nitride, Silicon Dioxide, and Emerging Dielectrics held May 1-6, 2011 in Montreal as a part of the 219th Meeting of The Electrochemical Society. The papers address a very diverse range of topics. In addition to the deposition and characterization of the dielectrics, more specific topics addressed by the papers include applications, device characterization and reliability, interface states, interface traps, defects, transistor and gate oxide studies, and modeling.
This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.
The field of flexible electronics has grown rapidly over the last two decades with diverse applications including wearable gadgets and medical equipment. This textbook comprehensively covers the fundamental aspects of flexible electronics along with materials and processing techniques. It discusses topics including flexural rigidity, flexible PCBs, organic semiconductors, nanostructured materials, material reliability, electronic reliability, crystalline and polymer materials, semiconductor processing, and flexible silicon in depth. The text covers advantages, disadvantages, and applications of processes such as sol-gel processing and ink-jet printing. Pedagogical features such as solved problems and unsolved exercises are interspersed throughout the text for better understanding. FEATURES Covers major areas such as materials, physics, processes, and applications of flexible electronics Contains homework problems for readers to understand concepts in an easy manner Discusses, in detail, various types of materials, such as flexible silicon, metal oxides, and organic semiconductors Explains the application of flexible electronics in displays, solar cells, and batteries Includes a section on stretchable electronics This textbook is primarily written for senior undergraduate and graduate students in electrical engineering, electronics, materials science, chemistry, and communication engineering for a course on flexible electronics. Teaching resources are available, including a solutions manual for instructors.
Inkjet-based Micromanufacturing Inkjet technology goes way beyond putting ink on paper: it enables simpler, faster and more reliable manufacturing processes in the fields of micro- and nanotechnology. Modern inkjet heads are per se precision instruments that deposit droplets of fluids on a variety of surfaces in programmable, repeating patterns, allowing, after suitable modifications and adaptations, the manufacturing of devices such as thin-film transistors, polymer-based displays and photovoltaic elements. Moreover, inkjet technology facilitates the large-scale production of flexible RFID transponders needed, eg, for automated logistics and miniaturized sensors for applications in health surveillance. The book gives an introduction to inkjet-based micromanufacturing, followed by an overview of the underlying theories and models, which provides the basis for a full understanding and a successful usage of inkjet-based methods in current microsystems research and development Overview of Inkjet-based Micromanufacturing: Thermal Inkjet Theory and Modeling Post-Printing Processes for Inorganic Inks for Plastic Electronics Applications Inkjet Ink Formulations Inkjet Fabrication of Printed Circuit Boards Antennas for Radio Frequency Identification Tags Inkjet Printing for MEMS
This two volume set reviews the key issues in processing and characterization of nanoscale ferroelectrics and multiferroics, and provides a comprehensive description of their properties, with an emphasis in differentiating size effects of extrinsic ones like boundary or interface effects. Recently described nanoscale novel phenomena are also addressed. Organized into three parts it addresses key issues in processing (nanostructuring), characterization (of the nanostructured materials) and nanoscale effects. Taking full advantage of the synergies between nanoscale ferroelectrics and multiferroics, the text covers materials nanostructured at all levels, from ceramic technologies like ferroelectric nanopowders, bulk nanostructured ceramics and thick films, and magnetoelectric nanocomposites, to thin films, either polycrystalline layer heterostructures or epitaxial systems, and to nanoscale free standing objects with specific geometries, such as nanowires and tubes at different levels of development. This set is developed from the high level European scientific knowledge platform built within the COST (European Cooperation in Science and Technology) Action on Single and multiphase ferroics and multiferroics with restricted geometries (SIMUFER, ref. MP0904). Chapter contributors have been carefully selected, and have all made major contributions to knowledge of the respective topics, and overall, they are among most respected scientists in the field.
Chemical Solution Synthesis for Materials Design and Thin Film Device Applications presents current research on wet chemical techniques for thin-film based devices. Sections cover the quality of thin films, types of common films used in devices, various thermodynamic properties, thin film patterning, device configuration and applications. As a whole, these topics create a roadmap for developing new materials and incorporating the results in device fabrication. This book is suitable for graduate, undergraduate, doctoral students, and researchers looking for quick guidance on material synthesis and device fabrication through wet chemical routes. - Provides the different wet chemical routes for materials synthesis, along with the most relevant thin film structured materials for device applications - Discusses patterning and solution processing of inorganic thin films, along with solvent-based processing techniques - Includes an overview of key processes and methods in thin film synthesis, processing and device fabrication, such as nucleation, lithography and solution processing
