Flux Bounded Tungsten Inert Gas Welding Process

Flux Bounded Tungsten Inert Gas Welding Process

Author: P Chakravarthy

Publisher: CRC Press

Published: 2019-12-10

Total Pages: 121

ISBN-13: 1000763927

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This focus book is intended to introduce the Flux Bounded Tungsten Inert Gas Welding (FBTIG) process, which is a variant of Activated Tungsten inert gas welding process. The benefits of activating flux in the weld pool in enhancing the depth of penetration and underlying mechanisms for the same is explained in detail. The benefits of FBTIG process over other fusion welding process are highlighted. The scope for the FBTIG process to be adapted at the industrial level and the advancements in this field is detailed that enables the practicing engineers to exploit the same. Covers activated TIG process, role of activating fluxes in enhancing the depth of penetration Illustrates mechanisms associated with FBTIG process including arc constriction effect, insulation effect and reverse marangoni flow Discusses scope of FBTIG process for commercialization at the industry level Gives general overview of chronological advancements in the field of welding This book is aimed at graduate students, researchers and professionals in welding, manufacturing and engineering.


Cemented Tungsten Carbides

Cemented Tungsten Carbides

Author: Gopal S. Upadhyaya

Publisher: William Andrew

Published: 1998-12-31

Total Pages: 423

ISBN-13: 0815516304

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Written by an international expert, this book covers the processing, microstructure, and properties of cemented tungsten carbides. It is divided into 18 chapters covering wide areas from crystal structure to phase equilibria, production of metal and carbide powders, and much more. This book is ideal for researchers, plant engineers, and senior level students in metallurgical/mechanical/materials engineering who are interested in cemented carbides. There is no parallel book in print.


Uncle Tungsten

Uncle Tungsten

Author: Oliver Sacks

Publisher: Vintage

Published: 2013-12-11

Total Pages: 340

ISBN-13: 0804172153

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From the distinguished neurologist who is also one of the most remarkable storytellers of our time—a riveting memoir of his youth and his love affair with science, as unexpected and fascinating as his celebrated case histories. “A rare gem…. Fresh, joyous, wistful, generous, and tough-minded.” —The New York Times Book Review Long before Oliver Sacks became the bestselling author of The Man Who Mistook His Wife for a Hat and Awakenings, he was a small English boy fascinated by metals—also by chemical reactions (the louder and smellier the better), photography, squids and cuttlefish, H.G. Wells, and the periodic table. In this endlessly charming and eloquent memoir, Sacks chronicles his love affair with science and the magnificently odd and sometimes harrowing childhood in which that love affair unfolded. In Uncle Tungsten we meet Sacks’ extraordinary family, from his surgeon mother (who introduces the fourteen-year-old Oliver to the art of human dissection) and his father, a family doctor who imbues in his son an early enthusiasm for housecalls, to his “Uncle Tungsten,” whose factory produces tungsten-filament lightbulbs. We follow the young Oliver as he is exiled at the age of six to a grim, sadistic boarding school to escape the London Blitz, and later watch as he sets about passionately reliving the exploits of his chemical heroes—in his own home laboratory. Uncle Tungsten is a crystalline view of a brilliant young mind springing to life, a story of growing up which is by turns elegiac, comic, and wistful, full of the electrifying joy of discovery.


Tungsten

Tungsten

Author: Erik Lassner

Publisher: Springer Science & Business Media

Published: 2012-12-06

Total Pages: 432

ISBN-13: 1461549078

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Why does someone write a book about Tungsten? There are several reasons and precedents for this, the most important of which is that the last book on tungsten was written more than 20 years ago, in 1977, by St. W H. Yih and Ch T. Wang. During the intervening period there have been many new scientific and technological developments and innova tions, so it was not only our opinion but the view of many other members of the "tungsten family" that it was time to start writing a new book about tungsten. Preparations of the new book began in 1994. further impetus to the project was provided by the realization that in spite of this new knowledge having been presented at seminars or published in the technical press, a general acknowledgement of it by the majority of technicians and scientists is still far from being realized. It is our hope that this book will significantly contribute to a broader acceptance of recent scientific and technological innovations. An important prerequisite for such a project is the availability of a recently retired, experienced person willing to devote his time and talents to the tedious part of the exercise.


Thermal Spray Fundamentals

Thermal Spray Fundamentals

Author: Pierre L. Fauchais

Publisher: Springer Science & Business Media

Published: 2014-01-24

Total Pages: 1587

ISBN-13: 0387689915

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This book provides readers with the fundamentals necessary for understanding thermal spray technology. Coverage includes in-depth discussions of various thermal spray processes, feedstock materials, particle-jet interactions, and associated yet very critical topics: diagnostics, current and emerging applications, surface science, and pre and post-treatment. This book will serve as an invaluable resource as a textbook for graduate courses in the field and as an exhaustive reference for professionals involved in thermal spray technology.


Joining Processes for Dissimilar and Advanced Materials

Joining Processes for Dissimilar and Advanced Materials

Author: Pawan Kumar Rakesh

Publisher: Woodhead Publishing

Published: 2021-11-13

Total Pages: 694

ISBN-13: 0323860206

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Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product. - Provides valuable information on innovative joining technologies including induction heating of metals, ultrasonic heating, and laser heating at micro- and nanoscale levels - Describes the newly developed modelling, simulation and digitalization of the joining process - Includes a methodology for characterization of joints


Brazing and Bonding of Columbium, Molybdenum, Tantalum, Tungsten, and Graphite

Brazing and Bonding of Columbium, Molybdenum, Tantalum, Tungsten, and Graphite

Author: H. E. Pattee

Publisher:

Published: 1962

Total Pages: 28

ISBN-13:

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Many of the important developments in the joining of columbium, molybdenum, tantalum, tungsten, and graphite are summarized. Much of the subject matter is devoted to the brazing processes, but diffusion and solid-state bonding are covered also. The particular properties which recommend the refractory metals and graphite to aerospace applications are discussed. Adverse properties which limit the use of these materials or which must be overcome by using special precautions also are mentioned. Typical filler metals used to join the refractory materials for low- as well as high-temperature service conditions are covered. The information was gathered from the current literature on joining and from the open DMIC files.