Joining of Materials and Structures

Joining of Materials and Structures

Author: Robert W. Messler

Publisher: Butterworth-Heinemann

Published: 2004-08-05

Total Pages: 816

ISBN-13: 0750677570

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Joining of Materials and Structures is the first and only complete and highly readable treatment of the options for joining conventional materials and the structures they comprise in conventional and unconventional ways, and for joining emerging materials and structures in novel ways. Joining by mechanical fasteners, integral designed-or formed-in features, adhesives, welding, brazing, soldering, thermal spraying, and hybrid processes are addressed as processes and technologies, as are issues associated with the joining of metals, ceramics (including cement and concrete) glass, plastics, and composites (including wood), as well as, for the first time anywhere, living tissue. While focused on materials issues, issues related to joint design, production processing, quality assurance, process economics, and joint performance in service are not ignored. The book is written for engineers, from an in-training student to a seasoned practitioner by an engineer who chose to teach after years of practice. By reading and referring to this book, the solutions to joining problems will be within one's grasp. Key Features: · Unprecedented coverage of all joining options (from lashings to lasers) in 10 chapters · Uniquely complete coverage of all materials, including living tissues, in 6 chapters · Richly illustrated with 76 photographs and 233 illustrations or plots · Practice Questions and Problems for use as a text of for reviewing to aid for comprehension * Coverage all of major joining technologies, including welding, soldering, brazing, adhesive and cement bonding, pressure fusion, riveting, bolting, snap-fits, and more * Organized by both joining techniques and materials types, including metals, non-metals, ceramics and glasses, composites, biomaterials, and living tissue * An ideal reference for design engineers, students, package and product designers, manufacturers, machinists, materials scientists


Joining of Advanced Materials

Joining of Advanced Materials

Author: Messler

Publisher: Elsevier

Published: 2013-10-22

Total Pages: 576

ISBN-13: 1483292142

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Provides an unusually complete and readable compilation of the primary and secondary options for joining conventional materials in non-conventional ways. Provides unique coverage of adhesive bonding using both organic and inorganic adhesives, cements and mortars. Focuses on materials issues without ignoring issues related to joint design, production processing, quality assurance, process economics, and joining performance in service.Joining of advanced materials is a unique treatment of joining of both conventional and advanced metals andalloys, intermetallics, ceramics, glasses, polymers, and composites with polymeric, metallic, ceramic, intermetallic and carbon matrices in similar and dissimilar combinations. Suitable for undergraduate and graduate students in engineering in addition to practicing engineers, this book treats in detail mechanical joining with conventional and advanced fasteners or integral design features, adhesive bonding, fusion and non-fusion welding, brazing, soldering, thermal spraying, and synergistic combinations of weld-bonding, weld-brazing, rivet-bonding. In addition, the book addresses materials issues, joint design, production processing, quality assurance, process economics, and joint performance in service.


Joining and Assembly of Medical Materials and Devices

Joining and Assembly of Medical Materials and Devices

Author: Y N Zhou

Publisher: Elsevier

Published: 2013-05-31

Total Pages: 583

ISBN-13: 0857096427

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As medical devices become more intricate, with an increasing number of components made from a wide range of materials, it is important that they meet stringent requirements to ensure that they are safe to be implanted and will not be rejected by the human body. Joining and assembly of medical materials and devices provides a comprehensive overview of joining techniques for a range of medical materials and applications.Part one provides an introduction to medical devices and joining methods with further specific chapters on microwelding methods in medical components and the effects of sterilization on medical materials and welded devices. Part two focuses on medical metals and includes chapters on the joining of shape memory alloys, platinum (Pt) alloys and stainless steel wires for implantable medical devices and evaluating the corrosion performance of metal medical device welds. Part three moves on to highlight the joining and assembly of medical plastics and discusses techniques including ultrasonic welding, transmission laser welding and radio frequency (RF)/dielectric welding. Finally, part four discusses the joining and assembly of biomaterial and tissue implants including metal-ceramic joining techniques for orthopaedic applications and tissue adhesives and sealants for surgical applications.Joining and assembly of medical materials and devices is a technical guide for engineers and researchers within the medical industry, professionals requiring an understanding of joining and assembly techniques in a medical setting, and academics interested in this field. - Introduces joining methods in medical applications including microwelding and considers the effects of sterilization on the resulting joints and devices - Considers the joining, assembly and corrosion performance of medical metals including shape memory alloys, platinum alloys and stainless steel wires - Considers the joining and assembly of medical plastics including multiple welding methods, bonding strategies and adhesives


Engineered Materials Handbook, Desk Edition

Engineered Materials Handbook, Desk Edition

Author: ASM International. Handbook Committee

Publisher: ASM International

Published: 1995-11-01

Total Pages: 1313

ISBN-13: 0871702835

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A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR


Joining Processes for Dissimilar and Advanced Materials

Joining Processes for Dissimilar and Advanced Materials

Author: Pawan Kumar Rakesh

Publisher: Woodhead Publishing

Published: 2021-11-13

Total Pages: 694

ISBN-13: 0323860206

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Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product. - Provides valuable information on innovative joining technologies including induction heating of metals, ultrasonic heating, and laser heating at micro- and nanoscale levels - Describes the newly developed modelling, simulation and digitalization of the joining process - Includes a methodology for characterization of joints


Chip On Board

Chip On Board

Author: John H. Lau

Publisher: Springer Science & Business Media

Published: 1994-06-30

Total Pages: 584

ISBN-13: 9780442014414

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This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.


Functionally Graded Materials 1996

Functionally Graded Materials 1996

Author: I. Shiota

Publisher: Elsevier

Published: 1997-09-02

Total Pages: 803

ISBN-13: 0080532098

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Since a formulated concept of functionally graded materials (FGMs) was proposed in 1984 as a means of preparing thermal barrier materials, a coordinated research has been developed since 1986. The 125 papers presented here present state of the art research results and developments on FGM from the past decade.A wide spectra of topics are covered including design and modeling, fracture analysis, powder metallurgical processes, deposition and spray processes, reaction forming processes, novel processes, material evaluation for structural applications, organic and intelligent materials. Three reviews associated with national research programs on FGMs promoted in Japan and Germany, and the historical perspective of FGM research in Europe are presented as well.The resulting work is recommended to researchers, engineers and graduate school students in the fields of materials science and engineering, mechanical and medical engineering.