Istfa 2005

Istfa 2005

Author: ASM International

Publisher: ASM International

Published: 2005-01-01

Total Pages: 524

ISBN-13: 1615030883

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ISTFA 2006

ISTFA 2006

Author: Electronic Device Failure Analysis Society

Publisher: ASM International

Published: 2006

Total Pages: 524

ISBN-13: 1615030891

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ISTFA 2014

ISTFA 2014

Author: A. S. M. International

Publisher: ASM International

Published: 2014-11-01

Total Pages: 561

ISBN-13: 1627080740

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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.


China Semiconductor Technology International Conference 2010 (CSTIC 2010)

China Semiconductor Technology International Conference 2010 (CSTIC 2010)

Author: Han-Ming Wu

Publisher: The Electrochemical Society

Published: 2010-03

Total Pages: 1203

ISBN-13: 1566778069

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Our mission is to provide a forum for world experts to discuss technologies, address the growing needs associated with silicon technology, and exchange their discoveries and solutions for current issues of high interest. We encourage collaboration, open discussion, and critical reviews at this conference. Furthermore, we hope that this conference will also provide collaborative opportunities for those who are interested in the semiconductor industry in Asia, particularly in China.


ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

Author: ASM International

Publisher: ASM International

Published: 2019-12-01

Total Pages: 540

ISBN-13: 1627082735

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The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.


Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Author: Tejinder Gandhi

Publisher: ASM International

Published: 2019-11-01

Total Pages: 719

ISBN-13: 1627082468

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The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.