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Author: ASM International
Publisher: ASM International
Published: 2017-12-01
Total Pages: 666
ISBN-13: 1627081518
DOWNLOAD EBOOKThe theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author: Zhiyong Ma
Publisher: CRC Press
Published: 2017-03-27
Total Pages: 889
ISBN-13: 135173394X
DOWNLOAD EBOOKNanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: ASM International
Publisher: ASM International
Published: 2019-12-01
Total Pages: 540
ISBN-13: 1627082735
DOWNLOAD EBOOKThe theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: International Society for Hybrid Microelectronics
Publisher:
Published: 1988
Total Pages: 600
ISBN-13:
DOWNLOAD EBOOKAuthor: Tejinder Gandhi
Publisher: ASM International
Published: 2019-11-01
Total Pages: 719
ISBN-13: 1627082468
DOWNLOAD EBOOKThe Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author: Navid Asadizanjani
Publisher: Springer Nature
Published: 2021-02-15
Total Pages: 193
ISBN-13: 3030626091
DOWNLOAD EBOOKThis book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Author: Carlos Guedes Soares
Publisher: CRC Press
Published: 2015-09-03
Total Pages: 930
ISBN-13: 1315647192
DOWNLOAD EBOOKThis three-volume work presents the proceedings from the 19th International Ship and Offshore Structures Congress held in Cascais, Portugal on 7th to 10th September 2015. The International Ship and Offshore Structures Congress (ISSC) is a forum for the exchange of information by experts undertaking and applying marine structural research.The aim of
Author: Swarup Bhunia
Publisher: Morgan Kaufmann
Published: 2018-10-30
Total Pages: 528
ISBN-13: 0128124784
DOWNLOAD EBOOKHardware Security: A Hands-On Learning Approach provides a broad, comprehensive and practical overview of hardware security that encompasses all levels of the electronic hardware infrastructure. It covers basic concepts like advanced attack techniques and countermeasures that are illustrated through theory, case studies and well-designed, hands-on laboratory exercises for each key concept. The book is ideal as a textbook for upper-level undergraduate students studying computer engineering, computer science, electrical engineering, and biomedical engineering, but is also a handy reference for graduate students, researchers and industry professionals. For academic courses, the book contains a robust suite of teaching ancillaries. Users will be able to access schematic, layout and design files for a printed circuit board for hardware hacking (i.e. the HaHa board) that can be used by instructors to fabricate boards, a suite of videos that demonstrate different hardware vulnerabilities, hardware attacks and countermeasures, and a detailed description and user manual for companion materials. - Provides a thorough overview of computer hardware, including the fundamentals of computer systems and the implications of security risks - Includes discussion of the liability, safety and privacy implications of hardware and software security and interaction - Gives insights on a wide range of security, trust issues and emerging attacks and protection mechanisms in the electronic hardware lifecycle, from design, fabrication, test, and distribution, straight through to supply chain and deployment in the field - A full range of instructor and student support materials can be found on the authors' own website for the book: http://hwsecuritybook.org
Author: Yan Li
Publisher: Springer
Published: 2017-01-20
Total Pages: 465
ISBN-13: 3319445863
DOWNLOAD EBOOKThis volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Author: J. Michael Duncan
Publisher: John Wiley & Sons
Published: 2014-09-22
Total Pages: 336
ISBN-13: 1118651650
DOWNLOAD EBOOKThe definitive guide to the critical issue of slope stability and safety Soil Strength and Slope Stability, Second Edition presents the latest thinking and techniques in the assessment of natural and man-made slopes, and the factors that cause them to survive or crumble. Using clear, concise language and practical examples, the book explains the practical aspects of geotechnical engineering as applied to slopes and embankments. The new second edition includes a thorough discussion on the use of analysis software, providing the background to understand what the software is doing, along with several methods of manual analysis that allow readers to verify software results. The book also includes a new case study about Hurricane Katrina failures at 17th Street and London Avenue Canal, plus additional case studies that frame the principles and techniques described. Slope stability is a critical element of geotechnical engineering, involved in virtually every civil engineering project, especially highway development. Soil Strength and Slope Stability fills the gap in industry literature by providing practical information on the subject without including extraneous theory that may distract from the application. This balanced approach provides clear guidance for professionals in the field, while remaining comprehensive enough for use as a graduate-level text. Topics include: Mechanics of soil and limit equilibrium procedures Analyzing slope stability, rapid drawdown, and partial consolidation Safety, reliability, and stability analyses Reinforced slopes, stabilization, and repair The book also describes examples and causes of slope failure and stability conditions for analysis, and includes an appendix of slope stability charts. Given how vital slope stability is to public safety, a comprehensive resource for analysis and practical action is a valuable tool. Soil Strength and Slope Stability is the definitive guide to the subject, proving useful both in the classroom and in the field.
