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Author: Jeffrey A. Davis
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 417
ISBN-13: 1461504619
DOWNLOAD EBOOKThis book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Author: Muhannad S. Bakir
Publisher: Artech House
Published: 2008-11-30
Total Pages: 551
ISBN-13: 1596932473
DOWNLOAD EBOOKThis cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author: Rene van Leuken
Publisher: Springer Science & Business Media
Published: 2011-02-04
Total Pages: 270
ISBN-13: 3642177514
DOWNLOAD EBOOKThis book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.
Author: Bibiche Geuskens
Publisher: Springer Science & Business Media
Published: 2012-12-06
Total Pages: 205
ISBN-13: 1461555612
DOWNLOAD EBOOKModeling Microprocessor Performance focuses on the development of a design and evaluation tool, named RIPE (Rensselaer Interconnect Performance Estimator). This tool analyzes the impact on wireability, clock frequency, power dissipation, and the reliability of single chip CMOS microprocessors as a function of interconnect, device, circuit, design and architectural parameters. It can accurately predict the overall performance of existing microprocessor systems. For the three major microprocessor architectures, DEC, PowerPC and Intel, the results have shown agreement within 10% on key parameters. The models cover a broad range of issues that relate to the implementation and performance of single chip CMOS microprocessors. The book contains a detailed discussion of the various models and the underlying assumptions based on actual design practices. As such, RIPE and its models provide an insightful tool into single chip microprocessor design and its performance aspects. At the same time, it provides design and process engineers with the capability to model, evaluate, compare and optimize single chip microprocessor systems using advanced technology and design techniques at an early design stage without costly and time consuming implementation. RIPE and its models demonstrate the factors which must be considered when estimating tradeoffs in device and interconnect technology and architecture design on microprocessor performance.
Author: Paul D. Franzon
Publisher: John Wiley & Sons
Published: 2019-01-25
Total Pages: 492
ISBN-13: 3527697047
DOWNLOAD EBOOKThis fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Author: Cor L. Claeys
Publisher: The Electrochemical Society
Published: 1997
Total Pages: 418
ISBN-13: 9781566771290
DOWNLOAD EBOOKAuthor: Singh Ajay Kumar
Publisher: PHI Learning Pvt. Ltd.
Published: 2010-06-30
Total Pages: 360
ISBN-13: 8120341872
DOWNLOAD EBOOKThis well-organised book provides an in-depth coverage of VLSI design engineering, which ranges from CMOS logic to physical design automation. The book begins with a discussion on the structure and operation of MOS as MOSFET is the basic building block for any VLSI design. Then, it goes on to explain the various fabrication methods of MOSFET and CMOS, implementation and properties of MOS inverter circuit, and parasitic parameters and resistances associated with MOSFET, which determine and ultimately limit the performance of a digital system. Besides, it describes design methodology and the concept of the combinational static logic circuits, sequential circuit design and CMOS dynamic circuits. Finally, the book examines semiconductor memory and the importance of adder and multiplier circuits for the VLSI designer. Primarily intended as a text for the undergraduate and postgraduate students of Electrical and Electronics Engineering, the book would also be of considerable value to designers both beginners and professionals. Key Features: Provides mathematical derivations for both noise margin and logic voltage. Explains all combinational and sequential logics separately. Contains a large number of solved and unsolved problems based on issues related to digital VLSI design.
Author: Rupam Goswami
Publisher: Springer Nature
Published: 2022-02-16
Total Pages: 313
ISBN-13: 981169124X
DOWNLOAD EBOOKThis book covers evolution, concept and applications of modern semiconductor devices such as tunnel field effect transistors (TFETs), vertical super-thin body MOSFETs, ion sensing FETs (ISFETs), non-conventional solar cells, opto-electro mechanical devices and thin film transistors (TFTs). Comprising of theory, experimentation and applications of devices, the chapters describe state-of-art methods and techniques which shall be highly assistive in having an overall perspective on emerging technologies and working on a research area. The book is aimed at the scholars, enthusiasts and researchers who are currently working on devices in the contemporary era of semiconductor devices. Additionally, the chapters are lucid and descriptive and carry the potential of serving as a reference book for scholars in their undergraduate studies, who are looking ahead for a prospective career in semiconductor devices.
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
Published: 2012-04-02
Total Pages: 616
ISBN-13: 0470662549
DOWNLOAD EBOOKFinding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author: Yoon Soo Park
Publisher: World Scientific
Published: 2003-01-29
Total Pages: 413
ISBN-13: 9814487082
DOWNLOAD EBOOKThe 2002 Workshop on Frontiers in Electronics was the third in the series of WOFE workshops. Over 70 leading experts from academia, industry, and government agencies reported on the most recent developments in their fields and exchanged views on future trends and directions of the electronics and photonics industry. The issues they addressed ranged from system-on-chip to DNA doping, from ultrathin SOI to electrotextiles, from photonics integration on the ULSI platform to wide band gap semiconductor devices and solid state lighting. The rapid pace of electronic technology evolution compels a merger of different technical areas, and WOFE-02 provided a unique opportunity for cross-fertilization of the emerging fields of microelectronics, photonics, and nanoelectronics. The workshop was informal and stimulated provocative views, visionary outlooks, and discussions on controversial issues.
